{"id":"https://openalex.org/W2760374769","doi":"https://doi.org/10.1109/iscas.2017.8050619","title":"A fully integrated wireless sensor-brain interface system to restore finger sensation","display_name":"A fully integrated wireless sensor-brain interface system to restore finger sensation","publication_year":2017,"publication_date":"2017-05-01","ids":{"openalex":"https://openalex.org/W2760374769","doi":"https://doi.org/10.1109/iscas.2017.8050619","mag":"2760374769"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2017.8050619","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2017.8050619","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100639668","display_name":"Xilin Liu","orcid":"https://orcid.org/0000-0002-9547-3905"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Xilin Liu","raw_affiliation_strings":["Department of Electrical and Systems Engineering"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Systems Engineering","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077847368","display_name":"Hongjie Zhu","orcid":"https://orcid.org/0000-0002-2604-033X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hongjie Zhu","raw_affiliation_strings":["Department of Electrical and Systems Engineering"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Systems Engineering","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100656860","display_name":"Milin Zhang","orcid":"https://orcid.org/0000-0001-6915-0734"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Milin Zhang","raw_affiliation_strings":["Department of Neurosurgery"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Neurosurgery","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012601931","display_name":"Xiaotie Wu","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Xiaotie Wu","raw_affiliation_strings":["Department of Neurosurgery"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Neurosurgery","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036680368","display_name":"Andrew G. Richardson","orcid":"https://orcid.org/0000-0002-4752-3867"},"institutions":[{"id":"https://openalex.org/I79576946","display_name":"University of Pennsylvania","ror":"https://ror.org/00b30xv10","country_code":"US","type":"education","lineage":["https://openalex.org/I79576946"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Andrew G. Richardson","raw_affiliation_strings":["Department of Material Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Material Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA","institution_ids":["https://openalex.org/I79576946"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013266488","display_name":"Srihari Y. Sritharan","orcid":null},"institutions":[{"id":"https://openalex.org/I79576946","display_name":"University of Pennsylvania","ror":"https://ror.org/00b30xv10","country_code":"US","type":"education","lineage":["https://openalex.org/I79576946"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Srihari Y. Sritharan","raw_affiliation_strings":["Department of Material Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Material Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA","institution_ids":["https://openalex.org/I79576946"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064244868","display_name":"Dengteng Ge","orcid":"https://orcid.org/0000-0003-1433-1188"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dengteng Ge","raw_affiliation_strings":["Department of Electronic Engineering, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronic Engineering, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103673428","display_name":"Yang Shu","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Shu","raw_affiliation_strings":["Department of Electronic Engineering, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronic Engineering, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114028982","display_name":"Timothy H. Lucas","orcid":null},"institutions":[{"id":"https://openalex.org/I79576946","display_name":"University of Pennsylvania","ror":"https://ror.org/00b30xv10","country_code":"US","type":"education","lineage":["https://openalex.org/I79576946"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Timothy H. Lucas","raw_affiliation_strings":["Department of Material Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Material Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA","institution_ids":["https://openalex.org/I79576946"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040819167","display_name":"Jan Van der Spiegel","orcid":"https://orcid.org/0000-0002-6070-0717"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jan Van der Spiegel","raw_affiliation_strings":["Department of Electrical and Systems Engineering"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Systems Engineering","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":10,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.4783,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.58186167,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},"topics":[{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10429","display_name":"EEG and Brain-Computer Interfaces","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10784","display_name":"Muscle activation and electromyography studies","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6142432689666748},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5471242666244507},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.525272011756897},{"id":"https://openalex.org/keywords/wireless-sensor-network","display_name":"Wireless sensor network","score":0.5094404816627502},{"id":"https://openalex.org/keywords/sensor-node","display_name":"Sensor node","score":0.457630455493927},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.4467587172985077},{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.4383111000061035},{"id":"https://openalex.org/keywords/brain\u2013computer-interface","display_name":"Brain\u2013computer interface","score":0.43141528964042664},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.38035428524017334},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.37749719619750977},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.35467860102653503},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.33343350887298584},{"id":"https://openalex.org/keywords/key-distribution-in-wireless-sensor-networks","display_name":"Key distribution in wireless sensor networks","score":0.316944420337677},{"id":"https://openalex.org/keywords/wireless-network","display_name":"Wireless network","score":0.21611526608467102},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1168350875377655},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.08913370966911316}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6142432689666748},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5471242666244507},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.525272011756897},{"id":"https://openalex.org/C24590314","wikidata":"https://www.wikidata.org/wiki/Q336038","display_name":"Wireless sensor network","level":2,"score":0.5094404816627502},{"id":"https://openalex.org/C111185680","wikidata":"https://www.wikidata.org/wiki/Q3866206","display_name":"Sensor node","level":5,"score":0.457630455493927},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.4467587172985077},{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.4383111000061035},{"id":"https://openalex.org/C173201364","wikidata":"https://www.wikidata.org/wiki/Q897410","display_name":"Brain\u2013computer interface","level":3,"score":0.43141528964042664},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.38035428524017334},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.37749719619750977},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.35467860102653503},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.33343350887298584},{"id":"https://openalex.org/C41971633","wikidata":"https://www.wikidata.org/wiki/Q6398155","display_name":"Key distribution in wireless sensor networks","level":4,"score":0.316944420337677},{"id":"https://openalex.org/C108037233","wikidata":"https://www.wikidata.org/wiki/Q11375","display_name":"Wireless network","level":3,"score":0.21611526608467102},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1168350875377655},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.08913370966911316},{"id":"https://openalex.org/C522805319","wikidata":"https://www.wikidata.org/wiki/Q179965","display_name":"Electroencephalography","level":2,"score":0.0},{"id":"https://openalex.org/C118552586","wikidata":"https://www.wikidata.org/wiki/Q7867","display_name":"Psychiatry","level":1,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscas.2017.8050619","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2017.8050619","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1606050419","https://openalex.org/W2054093267","https://openalex.org/W2074613775","https://openalex.org/W2277033640","https://openalex.org/W2492362931"],"related_works":["https://openalex.org/W2115569193","https://openalex.org/W2161127017","https://openalex.org/W2799361348","https://openalex.org/W1977342959","https://openalex.org/W2053773563","https://openalex.org/W2148549110","https://openalex.org/W2564820291","https://openalex.org/W2067121920","https://openalex.org/W2371193381","https://openalex.org/W1536182396"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3,28,42,47,52,58,73,79,162],"fully":[4],"integrated":[5],"wireless":[6,21,29,67],"sensor":[7,30,70,95,106],"brain":[8,117],"machine":[9],"interface":[10,24,40,88,153],"system":[11,145],"to":[12,89,111,148,154],"restore":[13],"continuous":[14],"somatosensory":[15],"feedback":[16],"from":[17],"the":[18,150,155],"hand.":[19],"A":[20],"bi-directional":[22],"neural":[23,39,44],"system-on-chip":[25],"(SoC)":[26],"and":[27,62,86,135,160],"node":[31,71],"design":[32],"are":[33,139],"described":[34],"in":[35,98,115,128,141,168],"this":[36,142],"work.":[37],"The":[38,69,92,123,144],"integrates":[41],"16-channel":[43,48],"recording":[45],"front-end,":[46],"electrical":[49],"stimulation":[50],"back-end,":[51],"successive":[53],"approximation":[54],"analog-to-digital":[55],"converter":[56],"(ADC),":[57],"custom":[59,74],"digital":[60],"controller,":[61],"an":[63,83],"ultra-wide":[64],"band":[65],"(UWB)":[66],"transceiver.":[68],"features":[72],"designed":[75,147],"optical":[76,93],"force":[77,94],"sensor,":[78],"low-power":[80],"level-crossing":[81],"ADC,":[82],"UWB":[84],"transmitter,":[85],"analog":[87],"off-chip":[90],"accelerometers.":[91],"is":[96],"developed":[97],"standard":[99,130],"CMOS":[100,131],"with":[101],"low-cost":[102],"post":[103],"fabrication.":[104],"Multiple":[105],"nodes":[107],"can":[108],"be":[109],"used":[110],"trigger":[112],"pre-defined":[113],"microstimulation":[114],"different":[116],"areas":[118],"for":[119,165],"restoring":[120],"finger":[121],"sensation.":[122],"prototypes":[124],"have":[125],"been":[126],"fabricated":[127],"180nm":[129],"technology.":[132],"Bench":[133],"testing":[134],"In-Vivo":[136],"experimental":[137],"results":[138],"presented":[140],"paper.":[143],"was":[146],"investigate":[149],"first":[151],"chronic":[152],"cuneate":[156],"nucleus":[157],"of":[158],"macaques,":[159],"showed":[161],"promising":[163],"solution":[164],"sensation":[166],"restoration":[167],"future":[169],"neuroprosthetics.":[170]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":2}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}
