{"id":"https://openalex.org/W2517040789","doi":"https://doi.org/10.1109/iscas.2016.7527502","title":"Fabrication, characterization and modeling of flexible electronic components based on CNT networks","display_name":"Fabrication, characterization and modeling of flexible electronic components based on CNT networks","publication_year":2016,"publication_date":"2016-05-01","ids":{"openalex":"https://openalex.org/W2517040789","doi":"https://doi.org/10.1109/iscas.2016.7527502","mag":"2517040789"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2016.7527502","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2016.7527502","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072981900","display_name":"Paolo Lugli","orcid":"https://orcid.org/0000-0002-2511-5643"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Paolo Lugli","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026315056","display_name":"Alaa Abdellah","orcid":"https://orcid.org/0000-0001-6547-5208"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Alaa Abdellah","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039353142","display_name":"Ahmed Abdelhalim","orcid":"https://orcid.org/0009-0008-5246-0195"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Ahmed Abdelhalim","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029149047","display_name":"Andreas Albrecht","orcid":"https://orcid.org/0000-0002-9813-4319"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Andreas Albrecht","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047902684","display_name":"Markus Becherer","orcid":"https://orcid.org/0000-0002-1291-8877"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Markus Becherer","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084404889","display_name":"Engin \u00c7a\u011fatay","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Engin Cagatay","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091658290","display_name":"Simone Colasanti","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Simone Colasanti","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047389019","display_name":"Aniello Falco","orcid":"https://orcid.org/0000-0002-7411-900X"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Aniello Falco","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022629017","display_name":"Florin C. Loghin","orcid":"https://orcid.org/0000-0002-4756-9929"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Florin Loghin","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085819200","display_name":"Sara El-Molla","orcid":"https://orcid.org/0000-0003-2444-3095"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Sara El-Molla","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063619484","display_name":"Jos\u00e9 F. Salmer\u00f3n","orcid":"https://orcid.org/0000-0002-7859-1643"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Jose F. Salmeron","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061890461","display_name":"Almudena Rivadeneyra","orcid":"https://orcid.org/0000-0001-8133-1992"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Almudena Rivadeneyra","raw_affiliation_strings":["Institute for Nanoelectronics, Technical University of Munich, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute for Nanoelectronics, Technical University of Munich, Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I62916508"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.08932715,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"15","issue":null,"first_page":"1362","last_page":"1365"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9894999861717224,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9894999861717224,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.987500011920929,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9746000170707703,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.8070349097251892},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6303312182426453},{"id":"https://openalex.org/keywords/netlist","display_name":"Netlist","score":0.5650165677070618},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.5641946196556091},{"id":"https://openalex.org/keywords/coating","display_name":"Coating","score":0.5512809753417969},{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.4940357804298401},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.48425909876823425},{"id":"https://openalex.org/keywords/deposition","display_name":"Deposition (geology)","score":0.4805362820625305},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4693858325481415},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.4120132327079773},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.34045201539993286},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.19073596596717834},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16311374306678772}],"concepts":[{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.8070349097251892},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6303312182426453},{"id":"https://openalex.org/C177650935","wikidata":"https://www.wikidata.org/wiki/Q1760303","display_name":"Netlist","level":2,"score":0.5650165677070618},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.5641946196556091},{"id":"https://openalex.org/C2781448156","wikidata":"https://www.wikidata.org/wiki/Q1570182","display_name":"Coating","level":2,"score":0.5512809753417969},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.4940357804298401},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.48425909876823425},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.4805362820625305},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4693858325481415},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.4120132327079773},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.34045201539993286},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.19073596596717834},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16311374306678772},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1109/iscas.2016.7527502","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2016.7527502","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},{"id":"pmh:oai:alma.39UBZ_INST:11235363900001241","is_oa":false,"landing_page_url":"http://ieeexplore.ieee.org/abstract/document/7527502/","pdf_url":null,"source":{"id":"https://openalex.org/S4210197018","display_name":"View","issn_l":"2688-268X","issn":["2688-268X","2688-3988"],"is_oa":false,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference Proceedings"},{"id":"pmh:oai:mediatum.ub.tum.de:node/1325434","is_oa":false,"landing_page_url":"https://mediatum.ub.tum.de/1325434","pdf_url":null,"source":{"id":"https://openalex.org/S4306400453","display_name":"mediaTUM \u2013 the media and publications repository of the Technical University Munich (Technical University Munich)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I62916508","host_organization_name":"Technical University of Munich","host_organization_lineage":["https://openalex.org/I62916508"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"ConferencePaper"},{"id":"pmh:oai:unibz.it:11235363900001241","is_oa":false,"landing_page_url":"https://bia.unibz.it/esploro/outputs/conferenceProceeding/Fabrication-characterization-and-modeling-of-flexible/991005772657301241","pdf_url":null,"source":{"id":"https://openalex.org/S4210197018","display_name":"View","issn_l":"2688-268X","issn":["2688-268X","2688-3988"],"is_oa":false,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference Proceedings"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320320300","display_name":"European Commission","ror":"https://ror.org/00k4n6c32"},{"id":"https://openalex.org/F4320338368","display_name":"FP7 People: Marie-Curie Actions","ror":"https://ror.org/00k4n6c32"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":23,"referenced_works":["https://openalex.org/W656433898","https://openalex.org/W926871616","https://openalex.org/W1992464698","https://openalex.org/W1996079531","https://openalex.org/W2004446708","https://openalex.org/W2022540905","https://openalex.org/W2032211241","https://openalex.org/W2064703305","https://openalex.org/W2089608886","https://openalex.org/W2092037892","https://openalex.org/W2093255275","https://openalex.org/W2113328000","https://openalex.org/W2134483085","https://openalex.org/W2141000909","https://openalex.org/W2142512841","https://openalex.org/W2146161411","https://openalex.org/W2161518257","https://openalex.org/W2276754042","https://openalex.org/W2293374835","https://openalex.org/W2317496160","https://openalex.org/W2320271170","https://openalex.org/W2323839386","https://openalex.org/W4233730519"],"related_works":["https://openalex.org/W2170314243","https://openalex.org/W2119179026","https://openalex.org/W2794947590","https://openalex.org/W2114971758","https://openalex.org/W2109932036","https://openalex.org/W2093081283","https://openalex.org/W4313118781","https://openalex.org/W2354546390","https://openalex.org/W2159172546","https://openalex.org/W2127141320"],"abstract_inverted_index":{"In":[0,81],"this":[1],"contribution,":[2],"we":[3,83],"will":[4,84,120],"present":[5],"a":[6,11,21,48,58,109],"modeling":[7],"approach":[8],"based":[9],"on":[10,73],"stochastic":[12],"algorithm":[13],"that":[14],"can":[15],"generate":[16],"non-rigid":[17],"solid":[18],"objects":[19],"in":[20],"three-dimensional":[22],"space,":[23],"emulating":[24],"with":[25,66],"high":[26],"fidelity":[27],"the":[28,51,74,78,86],"typical":[29],"fabrication":[30],"processes":[31],"involved":[32],"(i.e.":[33],"spray-coating).":[34],"A":[35],"randomly":[36],"generated":[37],"set":[38],"of":[39,77,88,108,111],"tube":[40,43],"segments":[41],"and":[42,50,69,103,116],"junctions":[44],"is":[45,55],"converted":[46],"into":[47],"netlist":[49],"overall":[52],"electrical":[53],"behavior":[54],"computed":[56],"via":[57],"SPICE":[59],"software.":[60],"The":[61,106],"theoretical":[62],"results":[63],"agree":[64],"well":[65,97],"experimental":[67],"data":[68],"provide":[70],"valuable":[71],"details":[72],"operation":[75],"mode":[76],"fabricated":[79],"devices.":[80],"addition,":[82],"discuss":[85],"characteristics":[87],"CNT":[89],"films":[90],"prepared":[91],"by":[92],"scalable":[93],"spray":[94],"deposition":[95],"as":[96,98],"inkjet":[99],"printing":[100],"onto":[101],"rigid":[102],"flexible":[104],"substrates.":[105],"performance":[107],"variety":[110],"devices":[112],"(e.g.":[113],"pressure,":[114],"temperature":[115],"gas":[117],"sensors;":[118],"FETs)":[119],"be":[121],"described.":[122]},"counts_by_year":[{"year":2022,"cited_by_count":1}],"updated_date":"2026-07-02T09:51:11.867554","created_date":"2025-10-10T00:00:00"}