{"id":"https://openalex.org/W1594107542","doi":"https://doi.org/10.1109/iscas.2015.7169060","title":"Physical characterization of steady-state temperature profiles in three-dimensional integrated circuits","display_name":"Physical characterization of steady-state temperature profiles in three-dimensional integrated circuits","publication_year":2015,"publication_date":"2015-05-01","ids":{"openalex":"https://openalex.org/W1594107542","doi":"https://doi.org/10.1109/iscas.2015.7169060","mag":"1594107542"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2015.7169060","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2015.7169060","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101449950","display_name":"Sumeet S. Kumar","orcid":"https://orcid.org/0000-0002-0667-7552"},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Sumeet S. Kumar","raw_affiliation_strings":["Circuits and Systems Group, Delft University of Technology, The Netherlands","Circuits and Systems group, Delft University of Technology, the Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Circuits and Systems Group, Delft University of Technology, The Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Circuits and Systems group, Delft University of Technology, the Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019444861","display_name":"Amir Zjajo","orcid":"https://orcid.org/0000-0002-0716-8186"},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Amir Zjajo","raw_affiliation_strings":["Circuits and Systems Group, Delft University of Technology, The Netherlands","Circuits and Systems group, Delft University of Technology, the Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Circuits and Systems Group, Delft University of Technology, The Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Circuits and Systems group, Delft University of Technology, the Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041082811","display_name":"Ren\u00e9 van Leuken","orcid":"https://orcid.org/0000-0003-0638-7595"},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Rene van Leuken","raw_affiliation_strings":["Circuits and Systems Group, Delft University of Technology, The Netherlands","Circuits and Systems group, Delft University of Technology, the Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Circuits and Systems Group, Delft University of Technology, The Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Circuits and Systems group, Delft University of Technology, the Netherlands","institution_ids":["https://openalex.org/I98358874"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I98358874"],"apc_list":null,"apc_paid":null,"fwci":0.4118,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.49347576,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1969","last_page":"1972"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.7883036732673645},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.6381643414497375},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5826519727706909},{"id":"https://openalex.org/keywords/power-density","display_name":"Power density","score":0.5693780183792114},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.555698037147522},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.5367274284362793},{"id":"https://openalex.org/keywords/hotspot","display_name":"Hotspot (geology)","score":0.5284340977668762},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.5056235790252686},{"id":"https://openalex.org/keywords/steady-state","display_name":"Steady state (chemistry)","score":0.49282601475715637},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4844129681587219},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.48325115442276},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4226549565792084},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3172774910926819},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3028362989425659},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25007379055023193},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2095300257205963},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.11535301804542542},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.11341434717178345},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.11321640014648438}],"concepts":[{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.7883036732673645},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.6381643414497375},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5826519727706909},{"id":"https://openalex.org/C21881925","wikidata":"https://www.wikidata.org/wiki/Q3503313","display_name":"Power density","level":3,"score":0.5693780183792114},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.555698037147522},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.5367274284362793},{"id":"https://openalex.org/C146481406","wikidata":"https://www.wikidata.org/wiki/Q105131","display_name":"Hotspot (geology)","level":2,"score":0.5284340977668762},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.5056235790252686},{"id":"https://openalex.org/C8171440","wikidata":"https://www.wikidata.org/wiki/Q903414","display_name":"Steady state (chemistry)","level":2,"score":0.49282601475715637},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4844129681587219},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.48325115442276},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4226549565792084},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3172774910926819},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3028362989425659},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25007379055023193},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2095300257205963},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.11535301804542542},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.11341434717178345},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11321640014648438},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscas.2015.7169060","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2015.7169060","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.800000011920929}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1987293146","https://openalex.org/W2009145358","https://openalex.org/W2018344821","https://openalex.org/W2041138571","https://openalex.org/W2081082387","https://openalex.org/W2130517400","https://openalex.org/W2130949272","https://openalex.org/W2139019659","https://openalex.org/W2147298083","https://openalex.org/W2166810861","https://openalex.org/W3142845206"],"related_works":["https://openalex.org/W2379637199","https://openalex.org/W2380576232","https://openalex.org/W2937054111","https://openalex.org/W2066223521","https://openalex.org/W373327546","https://openalex.org/W2405057786","https://openalex.org/W2058958858","https://openalex.org/W2369019401","https://openalex.org/W3015968783","https://openalex.org/W2048061586"],"abstract_inverted_index":{"The":[0,88],"thermal":[1,24,98],"performance":[2],"of":[3,12,26,43,46,52,56,72,90,96,110],"three-dimensional":[4],"integrated":[5],"circuits":[6],"is":[7,29],"influenced":[8],"by":[9],"a":[10,40],"number":[11],"design":[13],"and":[14,23,31,49,60,81,106],"technology":[15],"parameters.":[16],"However,":[17],"the":[18,44,83,94,107],"relationship":[19],"between":[20],"these":[21,73],"parameters":[22,74],"behaviour":[25],"die":[27],"stacks":[28],"complex":[30],"not":[32],"well":[33],"understood.":[34],"In":[35],"this":[36],"paper,":[37],"we":[38],"perform":[39],"detailed":[41],"evaluation":[42],"influence":[45],"stack":[47,61,111],"composition":[48],"depth,":[50],"thickness":[51],"dies,":[53,105],"physical":[54],"location":[55],"power":[57,62,112],"dissipating":[58],"elements":[59],"density":[63,113],"on":[64,100,104,114],"steady-state":[65],"temperature":[66,101],"profiles.":[67],"We":[68],"examine":[69],"how":[70],"each":[71],"affects":[75],"heat":[76],"spread":[77],"within":[78],"3D":[79],"ICs,":[80],"highlight":[82],"causes":[84],"for":[85],"hotspot":[86],"formation.":[87],"results":[89],"our":[91],"analysis":[92],"illustrate":[93],"implications":[95],"effective":[97],"conductivity":[99],"sensing":[102],"zones":[103],"significant":[108],"impact":[109],"overall":[115],"operating":[116],"temperature.":[117]},"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}