{"id":"https://openalex.org/W1968507315","doi":"https://doi.org/10.1109/iscas.2013.6572185","title":"TSV-based on-chip inductive coupling communications","display_name":"TSV-based on-chip inductive coupling communications","publication_year":2013,"publication_date":"2013-05-01","ids":{"openalex":"https://openalex.org/W1968507315","doi":"https://doi.org/10.1109/iscas.2013.6572185","mag":"1968507315"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2013.6572185","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2013.6572185","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Symposium on Circuits and Systems (ISCAS2013)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5028133110","display_name":"Khaled Salah","orcid":"https://orcid.org/0000-0002-2310-2558"},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]}],"countries":["HU"],"is_corresponding":false,"raw_author_name":"Khaled Salah","raw_affiliation_strings":["Mentor Graphics Corporation, Cairo, Egypt","Mentor Graphics,Cairo,Egypt"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, Cairo, Egypt","institution_ids":[]},{"raw_affiliation_string":"Mentor Graphics,Cairo,Egypt","institution_ids":["https://openalex.org/I105695857"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009116315","display_name":"Alaa El-Rouby","orcid":null},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]}],"countries":["HU"],"is_corresponding":false,"raw_author_name":"Alaa El-Rouby","raw_affiliation_strings":["Mentor Graphics Corporation, Cairo, Egypt","Mentor Graphics,Cairo,Egypt"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, Cairo, Egypt","institution_ids":[]},{"raw_affiliation_string":"Mentor Graphics,Cairo,Egypt","institution_ids":["https://openalex.org/I105695857"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087597892","display_name":"Hani Ragai","orcid":"https://orcid.org/0000-0002-7999-8824"},"institutions":[{"id":"https://openalex.org/I107720978","display_name":"Ain Shams University","ror":"https://ror.org/00cb9w016","country_code":"EG","type":"education","lineage":["https://openalex.org/I107720978"]}],"countries":["EG"],"is_corresponding":false,"raw_author_name":"Hani Ragai","raw_affiliation_strings":["Ain-Shams University, Cairo, Egypt","Ain Shams University Cairo Egypt"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Ain-Shams University, Cairo, Egypt","institution_ids":["https://openalex.org/I107720978"]},{"raw_affiliation_string":"Ain Shams University Cairo Egypt","institution_ids":["https://openalex.org/I107720978"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5084980840","display_name":"Yehea Ismail","orcid":"https://orcid.org/0000-0003-3956-7533"},"institutions":[{"id":"https://openalex.org/I80693520","display_name":"American University in Cairo","ror":"https://ror.org/0176yqn58","country_code":"EG","type":"education","lineage":["https://openalex.org/I80693520"]}],"countries":["EG"],"is_corresponding":false,"raw_author_name":"Yehea Ismail","raw_affiliation_strings":["AUC University, Cairo, Egypt","AUC Univ., Cairo, Egypt"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AUC University, Cairo, Egypt","institution_ids":[]},{"raw_affiliation_string":"AUC Univ., Cairo, Egypt","institution_ids":["https://openalex.org/I80693520"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1672","last_page":"1675"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/coupling-coefficient-of-resonators","display_name":"Coupling coefficient of resonators","score":0.7936969995498657},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.7297321557998657},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.702538251876831},{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.6316852569580078},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.5592415928840637},{"id":"https://openalex.org/keywords/spiral","display_name":"Spiral (railway)","score":0.5586171746253967},{"id":"https://openalex.org/keywords/inductive-coupling","display_name":"Inductive coupling","score":0.5223297476768494},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5115472078323364},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5077108144760132},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.48868945240974426},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.477912038564682},{"id":"https://openalex.org/keywords/expression","display_name":"Expression (computer science)","score":0.4402748942375183},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.406444787979126},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.35570603609085083},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1882704496383667},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.14328694343566895},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.08962857723236084}],"concepts":[{"id":"https://openalex.org/C91397564","wikidata":"https://www.wikidata.org/wiki/Q15059729","display_name":"Coupling coefficient of resonators","level":3,"score":0.7936969995498657},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.7297321557998657},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.702538251876831},{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.6316852569580078},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.5592415928840637},{"id":"https://openalex.org/C174128100","wikidata":"https://www.wikidata.org/wiki/Q846907","display_name":"Spiral (railway)","level":2,"score":0.5586171746253967},{"id":"https://openalex.org/C177872590","wikidata":"https://www.wikidata.org/wiki/Q1498289","display_name":"Inductive coupling","level":2,"score":0.5223297476768494},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5115472078323364},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5077108144760132},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.48868945240974426},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.477912038564682},{"id":"https://openalex.org/C90559484","wikidata":"https://www.wikidata.org/wiki/Q778379","display_name":"Expression (computer science)","level":2,"score":0.4402748942375183},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.406444787979126},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.35570603609085083},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1882704496383667},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.14328694343566895},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.08962857723236084},{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscas.2013.6572185","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2013.6572185","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Symposium on Circuits and Systems (ISCAS2013)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.41999998688697815,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1511747864","https://openalex.org/W1581632527","https://openalex.org/W1975691531","https://openalex.org/W2007935306","https://openalex.org/W2049040572","https://openalex.org/W2107860320","https://openalex.org/W2114486131","https://openalex.org/W2115252408","https://openalex.org/W2127687175","https://openalex.org/W2140574483","https://openalex.org/W2140932511","https://openalex.org/W2143621442","https://openalex.org/W2159072744","https://openalex.org/W2162484909","https://openalex.org/W4231021813","https://openalex.org/W6634984374","https://openalex.org/W6680605976"],"related_works":["https://openalex.org/W2005928013","https://openalex.org/W4283747635","https://openalex.org/W3158408562","https://openalex.org/W2324125918","https://openalex.org/W4289655799","https://openalex.org/W1976151090","https://openalex.org/W2117520483","https://openalex.org/W4235041402","https://openalex.org/W4390747354","https://openalex.org/W2091487568"],"abstract_inverted_index":{"This":[0,62,91],"paper":[1],"presents":[2],"a":[3,20],"novel":[4],"wireless":[5,46,76],"through":[6],"silicon":[7],"via":[8],"(TSV)":[9],"communication":[10,93],"structure":[11],"based":[12],"on":[13],"near-field":[14],"inductive-coupling.":[15],"The":[16,27,44,74],"proposed":[17,45,75,92],"system":[18,78,94],"uses":[19],"spiral":[21],"inductor":[22],"built":[23],"using":[24],"TSV":[25,47,77],"technology.":[26],"electrical":[28],"performance":[29],"obtained":[30],"from":[31],"EM-based":[32],"S-parameter":[33],"simulations":[34,69],"for":[35,56,87],"different":[36],"number":[37],"of":[38],"turns":[39],"and":[40,70],"configurations":[41],"are":[42],"presented.":[43,61],"shows":[48],"good":[49,72],"coupling":[50,58,63],"coefficient.":[51],"A":[52],"closed":[53],"form":[54],"expression":[55,64],"the":[57],"coefficient":[59],"is":[60,65,95],"verified":[66],"against":[67],"EM":[68],"showed":[71],"agreement.":[73],"provides":[79],"small":[80],"area":[81],"(30":[82],"\u03bcm)":[83],"<sup":[84],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[85],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[86],"typical":[88],"design":[89],"values.":[90],"enabling":[96],"NoC.":[97]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}