{"id":"https://openalex.org/W2016660234","doi":"https://doi.org/10.1109/iscas.2012.6271781","title":"Die-level photolithography and etchless parylene packaging processes for on-CMOS electrochemical biosensors","display_name":"Die-level photolithography and etchless parylene packaging processes for on-CMOS electrochemical biosensors","publication_year":2012,"publication_date":"2012-05-01","ids":{"openalex":"https://openalex.org/W2016660234","doi":"https://doi.org/10.1109/iscas.2012.6271781","mag":"2016660234"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2012.6271781","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2012.6271781","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE International Symposium on Circuits and Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101452853","display_name":"Lin Li","orcid":"https://orcid.org/0000-0002-5901-1164"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Lin Li","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA","Department of Electrical and Computer Engineering, Michigan State University,East Lansing,,USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA","institution_ids":["https://openalex.org/I87216513"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University,East Lansing,,USA","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100437899","display_name":"Xiaowen Liu","orcid":"https://orcid.org/0000-0003-2321-1727"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xiaowen Liu","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA","Department of Electrical and Computer Engineering, Michigan State University,East Lansing,,USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA","institution_ids":["https://openalex.org/I87216513"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University,East Lansing,,USA","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5025942859","display_name":"Andrew J. Mason","orcid":"https://orcid.org/0000-0002-6548-1162"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Andrew J. Mason","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA","Department of Electrical and Computer Engineering, Michigan State University,East Lansing,,USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA","institution_ids":["https://openalex.org/I87216513"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University,East Lansing,,USA","institution_ids":["https://openalex.org/I87216513"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5101452853"],"corresponding_institution_ids":["https://openalex.org/I87216513"],"apc_list":null,"apc_paid":null,"fwci":0.3003,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.60502355,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"134","issue":null,"first_page":"2401","last_page":"2404"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11472","display_name":"Analytical Chemistry and Sensors","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1502","display_name":"Bioengineering"},"field":{"id":"https://openalex.org/fields/15","display_name":"Chemical Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11472","display_name":"Analytical Chemistry and Sensors","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1502","display_name":"Bioengineering"},"field":{"id":"https://openalex.org/fields/15","display_name":"Chemical Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T11255","display_name":"Microfluidic and Bio-sensing Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/photolithography","display_name":"Photolithography","score":0.7613701224327087},{"id":"https://openalex.org/keywords/parylene","display_name":"Parylene","score":0.7358909845352173},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.7051485776901245},{"id":"https://openalex.org/keywords/biosensor","display_name":"Biosensor","score":0.5990765690803528},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.5668167471885681},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5297763347625732},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.4854608178138733},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.249955415725708},{"id":"https://openalex.org/keywords/polymer","display_name":"Polymer","score":0.11208310723304749}],"concepts":[{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.7613701224327087},{"id":"https://openalex.org/C2777385008","wikidata":"https://www.wikidata.org/wiki/Q448540","display_name":"Parylene","level":3,"score":0.7358909845352173},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7051485776901245},{"id":"https://openalex.org/C160756335","wikidata":"https://www.wikidata.org/wiki/Q669391","display_name":"Biosensor","level":2,"score":0.5990765690803528},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5668167471885681},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5297763347625732},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.4854608178138733},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.249955415725708},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.11208310723304749},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscas.2012.6271781","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2012.6271781","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE International Symposium on Circuits and Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.44999998807907104}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W1529995164","https://openalex.org/W1986173272","https://openalex.org/W2031740793","https://openalex.org/W2033384545","https://openalex.org/W2051938570","https://openalex.org/W2059338946","https://openalex.org/W2113837915","https://openalex.org/W2128158388","https://openalex.org/W2129629198","https://openalex.org/W2142198267","https://openalex.org/W2142303686","https://openalex.org/W2151913858","https://openalex.org/W2159421177","https://openalex.org/W2166911092","https://openalex.org/W2171677346","https://openalex.org/W2180930892","https://openalex.org/W4243818631","https://openalex.org/W6682490653"],"related_works":["https://openalex.org/W2379171104","https://openalex.org/W1988759754","https://openalex.org/W2132917903","https://openalex.org/W2279318584","https://openalex.org/W2005133991","https://openalex.org/W2001552486","https://openalex.org/W2533401445","https://openalex.org/W1662923965","https://openalex.org/W83428874","https://openalex.org/W2067464657"],"abstract_inverted_index":{"Integrated":[0],"sensor":[1,14],"arrays":[2],"on":[3],"CMOS":[4,20],"instrumentation":[5],"chips":[6],"are":[7,41,50],"attractive":[8],"to":[9,43,86],"many":[10],"biological":[11],"and":[12,37,99],"biomedical":[13],"applications.":[15],"However,":[16],"the":[17,44],"packaging":[18,38,95],"of":[19,46,70,107],"circuitry":[21],"for":[22,65],"use":[23],"within":[24],"a":[25,71,80],"liquid":[26],"environment":[27],"remains":[28],"as":[29],"an":[30],"open":[31],"challenge.":[32],"Reliable":[33],"post-CMOS":[34,88],"electrode":[35,90],"fabrication":[36,101],"processes":[39],"that":[40,61],"critical":[42],"development":[45],"integrated":[47],"electrochemical":[48],"biosensors":[49,109],"presented":[51],"in":[52,111],"this":[53],"paper.":[54],"A":[55],"die-level":[56],"photolithography":[57],"process":[58,82],"was":[59],"developed":[60,85],"provides":[62],"uniform":[63],"coverage":[64],"accurate":[66],"patterning":[67],"over":[68],"87%":[69],"3\u00d73mm":[72],"<sup":[73],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[74],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[75],"silicon":[76],"substrate.":[77],"In":[78],"addition,":[79],"new":[81],"has":[83],"been":[84],"package":[87],"fabricated":[89],"arrays.":[91],"This":[92],"etchless":[93],"parylene":[94],"reduces":[96],"processing":[97],"time":[98],"improves":[100],"yield.":[102],"These":[103],"techniques":[104],"enable":[105],"realization":[106],"on-CMOS":[108],"operating":[110],"liquids.":[112]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":6},{"year":2016,"cited_by_count":3},{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}