{"id":"https://openalex.org/W2132686275","doi":"https://doi.org/10.1109/iscas.2011.5937837","title":"Noise coupling due to through silicon vias (TSVs) in 3-D integrated circuits","display_name":"Noise coupling due to through silicon vias (TSVs) in 3-D integrated circuits","publication_year":2011,"publication_date":"2011-05-01","ids":{"openalex":"https://openalex.org/W2132686275","doi":"https://doi.org/10.1109/iscas.2011.5937837","mag":"2132686275"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2011.5937837","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2011.5937837","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International Symposium of Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5061262597","display_name":"Emre Salman","orcid":"https://orcid.org/0000-0001-6538-6803"},"institutions":[{"id":"https://openalex.org/I59553526","display_name":"Stony Brook University","ror":"https://ror.org/05qghxh33","country_code":"US","type":"education","lineage":["https://openalex.org/I59553526"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Emre Salman","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Stony Brook University, New York, USA","Department of Electrical and Computer Engineering, Stony Brook University, New York 11794, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Stony Brook University, New York, USA","institution_ids":["https://openalex.org/I59553526"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Stony Brook University, New York 11794, USA","institution_ids":["https://openalex.org/I59553526"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5061262597"],"corresponding_institution_ids":["https://openalex.org/I59553526"],"apc_list":null,"apc_paid":null,"fwci":5.3701,"has_fulltext":false,"cited_by_count":16,"citation_normalized_percentile":{"value":0.96717351,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1411","last_page":"1414"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.995199978351593,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9914000034332275,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.7761435508728027},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.713239312171936},{"id":"https://openalex.org/keywords/noise","display_name":"Noise (video)","score":0.6535649299621582},{"id":"https://openalex.org/keywords/bottleneck","display_name":"Bottleneck","score":0.6196915507316589},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5627095103263855},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5520780086517334},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.5294247269630432},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.5106671452522278},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.5055127143859863},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.48587101697921753},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3863048553466797},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.33945930004119873},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.30871450901031494},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.29973018169403076},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.29203248023986816},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.17092320322990417},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.1308097243309021},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08378314971923828}],"concepts":[{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.7761435508728027},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.713239312171936},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.6535649299621582},{"id":"https://openalex.org/C2780513914","wikidata":"https://www.wikidata.org/wiki/Q18210350","display_name":"Bottleneck","level":2,"score":0.6196915507316589},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5627095103263855},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5520780086517334},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.5294247269630432},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.5106671452522278},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.5055127143859863},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.48587101697921753},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3863048553466797},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.33945930004119873},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.30871450901031494},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.29973018169403076},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29203248023986816},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.17092320322990417},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.1308097243309021},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08378314971923828},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscas.2011.5937837","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2011.5937837","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International Symposium of Circuits and Systems (ISCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W2005220526","https://openalex.org/W2022319527","https://openalex.org/W2026717319","https://openalex.org/W2071003187","https://openalex.org/W2078787346","https://openalex.org/W2103398239","https://openalex.org/W2109622694","https://openalex.org/W2116214599","https://openalex.org/W2129722479","https://openalex.org/W2129785295","https://openalex.org/W2144149750","https://openalex.org/W2155190990","https://openalex.org/W2170501415","https://openalex.org/W2481508967","https://openalex.org/W2541669576","https://openalex.org/W6651737849","https://openalex.org/W6678959836"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W2549021975","https://openalex.org/W2016589506","https://openalex.org/W2376702355","https://openalex.org/W4385062230"],"abstract_inverted_index":{"Three-dimensional":[0],"(3-D)":[1],"integration":[2],"is":[3,64],"a":[4,17,50,55,72,90],"promising":[5],"technology":[6],"to":[7,49,54,66,97],"alleviate":[8],"the":[9,30,68,85],"interconnect":[10],"bottleneck":[11],"by":[12,28],"stacking":[13],"multiple":[14],"dies":[15],"in":[16,59],"monolithic":[18],"fashion.":[19],"Both":[20],"power":[21],"dissipation":[22],"and":[23],"delay":[24],"can":[25],"be":[26],"reduced":[27],"utilizing":[29],"third":[31],"dimension":[32],"where":[33],"through":[34],"silicon":[35],"vias":[36],"(TSVs)":[37],"are":[38,57,78],"used":[39],"for":[40],"vertical":[41],"communication.":[42],"Characteristics":[43],"of":[44,71],"switching":[45,98],"noise":[46,69,75,82],"that":[47],"couples":[48],"sensitive":[51],"device":[52],"due":[53],"TSV":[56,86],"investigated":[58],"this":[60],"paper.":[61],"A":[62],"model":[63],"developed":[65],"evaluate":[67],"performance":[70],"TSV.":[73],"Several":[74],"isolation":[76],"strategies":[77],"also":[79],"discussed.":[80],"Ignoring":[81],"characteristics":[83],"during":[84],"placement":[87],"process":[88],"produces":[89],"poor":[91],"3-D":[92],"circuit":[93],"with":[94],"high":[95],"susceptibility":[96],"noise.":[99]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":6},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":3}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}