{"id":"https://openalex.org/W1983466643","doi":"https://doi.org/10.1109/iscas.2010.5537829","title":"Miniaturized CMOS thermal sensor array for temperature gradient measurement in microprocessors","display_name":"Miniaturized CMOS thermal sensor array for temperature gradient measurement in microprocessors","publication_year":2010,"publication_date":"2010-05-01","ids":{"openalex":"https://openalex.org/W1983466643","doi":"https://doi.org/10.1109/iscas.2010.5537829","mag":"1983466643"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2010.5537829","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2010.5537829","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of 2010 IEEE International Symposium on Circuits and Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5024800009","display_name":"Kosta Luria","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104622","display_name":"Intel (Israel)","ror":"https://ror.org/027t2s119","country_code":"IL","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210104622"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"Kosta Luria","raw_affiliation_strings":["Intel Corporation, Yakum, Israel"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation, Yakum, Israel","institution_ids":["https://openalex.org/I4210104622"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5038423749","display_name":"Joseph Shor","orcid":"https://orcid.org/0000-0002-9184-8642"},"institutions":[{"id":"https://openalex.org/I4210104622","display_name":"Intel (Israel)","ror":"https://ror.org/027t2s119","country_code":"IL","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210104622"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"Joseph Shor","raw_affiliation_strings":["Intel Corporation, Yakum, Israel"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation, Yakum, Israel","institution_ids":["https://openalex.org/I4210104622"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210104622"],"apc_list":null,"apc_paid":null,"fwci":2.354,"has_fulltext":false,"cited_by_count":28,"citation_normalized_percentile":{"value":0.88603345,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microprocessor","display_name":"Microprocessor","score":0.7685157060623169},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5616722106933594},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5271463394165039},{"id":"https://openalex.org/keywords/enhanced-data-rates-for-gsm-evolution","display_name":"Enhanced Data Rates for GSM Evolution","score":0.522057294845581},{"id":"https://openalex.org/keywords/measure","display_name":"Measure (data warehouse)","score":0.45431116223335266},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.444820761680603},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4186217188835144},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.414550244808197},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.406052827835083},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.32580435276031494},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26642662286758423},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.2521527409553528},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.12738192081451416},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.0808352530002594}],"concepts":[{"id":"https://openalex.org/C2780728072","wikidata":"https://www.wikidata.org/wiki/Q5297","display_name":"Microprocessor","level":2,"score":0.7685157060623169},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5616722106933594},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5271463394165039},{"id":"https://openalex.org/C162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","level":2,"score":0.522057294845581},{"id":"https://openalex.org/C2780009758","wikidata":"https://www.wikidata.org/wiki/Q6804172","display_name":"Measure (data warehouse)","level":2,"score":0.45431116223335266},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.444820761680603},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4186217188835144},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.414550244808197},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.406052827835083},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.32580435276031494},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26642662286758423},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.2521527409553528},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12738192081451416},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0808352530002594},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscas.2010.5537829","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2010.5537829","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of 2010 IEEE International Symposium on Circuits and Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.7400000095367432}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2055248005","https://openalex.org/W2074534619","https://openalex.org/W4247586331"],"related_works":["https://openalex.org/W39373273","https://openalex.org/W3014521742","https://openalex.org/W2098026815","https://openalex.org/W2390545901","https://openalex.org/W2351709090","https://openalex.org/W2735012529","https://openalex.org/W2732121450","https://openalex.org/W4387917714","https://openalex.org/W2501578203","https://openalex.org/W2113108952"],"abstract_inverted_index":{"A":[0],"miniaturized":[1],"thermal":[2,62],"sensor":[3],"for":[4],"use":[5],"in":[6,12,55],"Intel's":[7],"microprocessors":[8],"has":[9],"been":[10],"demonstrated":[11],"a":[13,44,58],"cutting-edge":[14],"purely":[15],"digital":[16],"process.":[17],"The":[18,29],"circuit":[19,30],"shows":[20],"nearly":[21],"linear":[22],"frequency":[23],"dependence":[24],"with":[25],"temperature":[26],"of":[27,46],"45kHz/\u00b0C.":[28],"occupies":[31],"3.75":[32],"\u00d7":[33],"10":[34],"<sup":[35,39],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[36,40],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">-3</sup>":[37],"mm":[38],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[41],"and":[42],"consumes":[43],"current":[45],"~700uA,":[47],"which":[48],"makes":[49],"it":[50],"suitable":[51],"to":[52,60],"be":[53],"placed":[54],"array":[56],"on":[57],"microprocessor":[59],"measure":[61],"gradients":[63],"across":[64],"the":[65],"die.":[66]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":3},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":3},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":3}],"updated_date":"2026-06-26T08:34:08.712188","created_date":"2025-10-10T00:00:00"}