{"id":"https://openalex.org/W2098842841","doi":"https://doi.org/10.1109/iscas.2008.4541872","title":"A CMOS image sensor with focal plane SPIHT image compression","display_name":"A CMOS image sensor with focal plane SPIHT image compression","publication_year":2008,"publication_date":"2008-05-01","ids":{"openalex":"https://openalex.org/W2098842841","doi":"https://doi.org/10.1109/iscas.2008.4541872","mag":"2098842841"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2008.4541872","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2008.4541872","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5064263152","display_name":"Zhiqiang Lin","orcid":"https://orcid.org/0000-0003-1834-2060"},"institutions":[{"id":"https://openalex.org/I114395901","display_name":"University of Nebraska\u2013Lincoln","ror":"https://ror.org/043mer456","country_code":"US","type":"education","lineage":["https://openalex.org/I114395901"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhiqiang Lin","raw_affiliation_strings":["University of Nebraska-Lincoln, Department of Electrical Engineering, 209N WSEC, 68588-0511, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Nebraska-Lincoln, Department of Electrical Engineering, 209N WSEC, 68588-0511, USA","institution_ids":["https://openalex.org/I114395901"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109380502","display_name":"Michael W. Hoffman","orcid":null},"institutions":[{"id":"https://openalex.org/I114395901","display_name":"University of Nebraska\u2013Lincoln","ror":"https://ror.org/043mer456","country_code":"US","type":"education","lineage":["https://openalex.org/I114395901"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael W. Hoffman","raw_affiliation_strings":["University of Nebraska-Lincoln, Department of Electrical Engineering, 209N WSEC, 68588-0511, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Nebraska-Lincoln, Department of Electrical Engineering, 209N WSEC, 68588-0511, USA","institution_ids":["https://openalex.org/I114395901"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032539861","display_name":"W.D. Leon","orcid":null},"institutions":[{"id":"https://openalex.org/I114395901","display_name":"University of Nebraska\u2013Lincoln","ror":"https://ror.org/043mer456","country_code":"US","type":"education","lineage":["https://openalex.org/I114395901"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Walter D. Leon","raw_affiliation_strings":["University of Nebraska-Lincoln, Department of Electrical Engineering, 209N WSEC, 68588-0511, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Nebraska-Lincoln, Department of Electrical Engineering, 209N WSEC, 68588-0511, USA","institution_ids":["https://openalex.org/I114395901"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033257842","display_name":"Nathan Schemm","orcid":null},"institutions":[{"id":"https://openalex.org/I114395901","display_name":"University of Nebraska\u2013Lincoln","ror":"https://ror.org/043mer456","country_code":"US","type":"education","lineage":["https://openalex.org/I114395901"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nathan Schemm","raw_affiliation_strings":["University of Nebraska-Lincoln, Department of Electrical Engineering, 209N WSEC, 68588-0511, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Nebraska-Lincoln, Department of Electrical Engineering, 209N WSEC, 68588-0511, USA","institution_ids":["https://openalex.org/I114395901"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051590590","display_name":"Sina Balk\u0131r","orcid":null},"institutions":[{"id":"https://openalex.org/I114395901","display_name":"University of Nebraska\u2013Lincoln","ror":"https://ror.org/043mer456","country_code":"US","type":"education","lineage":["https://openalex.org/I114395901"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sina Balkir","raw_affiliation_strings":["University of Nebraska-Lincoln, Department of Electrical Engineering, 209N WSEC, 68588-0511, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Nebraska-Lincoln, Department of Electrical Engineering, 209N WSEC, 68588-0511, USA","institution_ids":["https://openalex.org/I114395901"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I114395901"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"2134","last_page":"2137"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13114","display_name":"Image Processing Techniques and Applications","score":0.9936000108718872,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12389","display_name":"Infrared Target Detection Methodologies","score":0.9932000041007996,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/image-compression","display_name":"Image compression","score":0.7369914054870605},{"id":"https://openalex.org/keywords/set-partitioning-in-hierarchical-trees","display_name":"Set partitioning in hierarchical trees","score":0.6975414752960205},{"id":"https://openalex.org/keywords/cardinal-point","display_name":"Cardinal point","score":0.5658732652664185},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.562690258026123},{"id":"https://openalex.org/keywords/data-compression","display_name":"Data compression","score":0.5571947693824768},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.5437506437301636},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5311264991760254},{"id":"https://openalex.org/keywords/compression","display_name":"Compression (physics)","score":0.5015468597412109},{"id":"https://openalex.org/keywords/wavelet-transform","display_name":"Wavelet transform","score":0.49021297693252563},{"id":"https://openalex.org/keywords/texture-compression","display_name":"Texture compression","score":0.46834275126457214},{"id":"https://openalex.org/keywords/image-quality","display_name":"Image quality","score":0.4520168900489807},{"id":"https://openalex.org/keywords/image-sensor","display_name":"Image sensor","score":0.44405099749565125},{"id":"https://openalex.org/keywords/wavelet","display_name":"Wavelet","score":0.3881228268146515},{"id":"https://openalex.org/keywords/image-processing","display_name":"Image processing","score":0.2861897349357605},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2378075122833252},{"id":"https://openalex.org/keywords/image","display_name":"Image (mathematics)","score":0.22764533758163452},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.2136516571044922},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06580469012260437}],"concepts":[{"id":"https://openalex.org/C13481523","wikidata":"https://www.wikidata.org/wiki/Q412438","display_name":"Image compression","level":4,"score":0.7369914054870605},{"id":"https://openalex.org/C136968285","wikidata":"https://www.wikidata.org/wiki/Q3246374","display_name":"Set partitioning in hierarchical trees","level":5,"score":0.6975414752960205},{"id":"https://openalex.org/C138395690","wikidata":"https://www.wikidata.org/wiki/Q376733","display_name":"Cardinal point","level":2,"score":0.5658732652664185},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.562690258026123},{"id":"https://openalex.org/C78548338","wikidata":"https://www.wikidata.org/wiki/Q2493","display_name":"Data compression","level":2,"score":0.5571947693824768},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.5437506437301636},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5311264991760254},{"id":"https://openalex.org/C180016635","wikidata":"https://www.wikidata.org/wiki/Q2712821","display_name":"Compression (physics)","level":2,"score":0.5015468597412109},{"id":"https://openalex.org/C196216189","wikidata":"https://www.wikidata.org/wiki/Q2867","display_name":"Wavelet transform","level":3,"score":0.49021297693252563},{"id":"https://openalex.org/C54243161","wikidata":"https://www.wikidata.org/wiki/Q39333","display_name":"Texture compression","level":5,"score":0.46834275126457214},{"id":"https://openalex.org/C55020928","wikidata":"https://www.wikidata.org/wiki/Q3813865","display_name":"Image quality","level":3,"score":0.4520168900489807},{"id":"https://openalex.org/C76935873","wikidata":"https://www.wikidata.org/wiki/Q209121","display_name":"Image sensor","level":2,"score":0.44405099749565125},{"id":"https://openalex.org/C47432892","wikidata":"https://www.wikidata.org/wiki/Q831390","display_name":"Wavelet","level":2,"score":0.3881228268146515},{"id":"https://openalex.org/C9417928","wikidata":"https://www.wikidata.org/wiki/Q1070689","display_name":"Image processing","level":3,"score":0.2861897349357605},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2378075122833252},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.22764533758163452},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.2136516571044922},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06580469012260437},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/iscas.2008.4541872","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2008.4541872","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},{"id":"pmh:oai:digitalcommons.unl.edu:dissertations-11671","is_oa":false,"landing_page_url":"https://digitalcommons.unl.edu/dissertations/AAI3296996","pdf_url":null,"source":{"id":"https://openalex.org/S4306400577","display_name":"Lincoln (University of Nebraska)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I114395901","host_organization_name":"University of Nebraska\u2013Lincoln","host_organization_lineage":["https://openalex.org/I114395901"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"ETD collection for University of Nebraska-Lincoln","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.44999998807907104}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1561802659","https://openalex.org/W1881559947","https://openalex.org/W1958891755","https://openalex.org/W2049905908","https://openalex.org/W2054703221","https://openalex.org/W2099581229","https://openalex.org/W2110228798","https://openalex.org/W2117397477","https://openalex.org/W2142276208","https://openalex.org/W6639422080"],"related_works":["https://openalex.org/W2737866791","https://openalex.org/W2012662082","https://openalex.org/W2553674103","https://openalex.org/W2997437750","https://openalex.org/W2746864668","https://openalex.org/W2185945257","https://openalex.org/W2143816931","https://openalex.org/W2527655544","https://openalex.org/W3138226658","https://openalex.org/W2365414501"],"abstract_inverted_index":{"In":[0,33],"this":[1],"paper,":[2],"a":[3],"focal":[4,15,38,69,95],"plane":[5,16,39,96],"SPIHT":[6,52,85,91,111],"image":[7,19,35,47,116,124],"compression":[8,36,72,88,92,112],"scheme":[9],"has":[10],"been":[11],"integrated":[12],"on":[13,66,93],"the":[14,31,42,50,63,67,94,100,108],"of":[17,110],"CMOS":[18],"sensor.":[20],"A":[21],"test":[22],"chip":[23],"is":[24,54,74],"prototyped":[25],"in":[26],"0.35\u03bcm":[27],"technology":[28],"to":[29,56,61,83],"verify":[30],"design.":[32],"our":[34],"scheme,":[37],"prediction":[40],"replaces":[41],"traditional":[43,51,84],"wavelet":[44],"transform":[45],"for":[46,122],"decomposition,":[48],"and":[49,60,86,118],"coding":[53],"modified":[55],"reduce":[57],"computational":[58],"complexity":[59],"suit":[62],"parallel":[64],"implementation":[65],"sensor":[68,101],"plane.":[70],"Simulated":[71],"performance":[73],"still":[75],"good,":[76],"especially":[77],"at":[78],"low":[79],"bit":[80],"rates,":[81],"compared":[82],"other":[87],"schemes.":[89],"Integrating":[90],"not":[97],"only":[98],"reduces":[99],"readout":[102],"volume,":[103],"but":[104],"also":[105],"provides":[106],"all":[107],"advantages":[109],"including":[113],"both":[114],"high":[115],"quality":[117],"optimized":[119],"data":[120],"ordering":[121],"progressive":[123],"transmission.":[125]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}