{"id":"https://openalex.org/W1863902628","doi":"https://doi.org/10.1109/iscas.2006.1693382","title":"System for Deposition and Characterization of Polypyrrole/Gold Bilayer Hinges","display_name":"System for Deposition and Characterization of Polypyrrole/Gold Bilayer Hinges","publication_year":2006,"publication_date":"2006-09-22","ids":{"openalex":"https://openalex.org/W1863902628","doi":"https://doi.org/10.1109/iscas.2006.1693382","mag":"1863902628"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2006.1693382","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2006.1693382","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2006 IEEE International Symposium on Circuits and Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5017687136","display_name":"E. Choi","orcid":null},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"E. Choi","raw_affiliation_strings":["Electrical and Computer Engineering, The Johns Hopkins University, Baltimore, MD, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, The Johns Hopkins University, Baltimore, MD, USA","institution_ids":["https://openalex.org/I145311948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057789499","display_name":"Andreas G. Andreou","orcid":"https://orcid.org/0000-0003-3826-600X"},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A.G. Andreou","raw_affiliation_strings":["Electrical and Computer Engineering, The Johns Hopkins University, Baltimore, MD, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, The Johns Hopkins University, Baltimore, MD, USA","institution_ids":["https://openalex.org/I145311948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024783386","display_name":"Yingkai Liu","orcid":"https://orcid.org/0009-0001-9064-500X"},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yingkai Liu","raw_affiliation_strings":["Mechanical Engineering, University of Maryland, College Park, MD, USA"],"affiliations":[{"raw_affiliation_string":"Mechanical Engineering, University of Maryland, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5088261669","display_name":"Elisabeth Smela","orcid":"https://orcid.org/0000-0003-3921-2265"},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"E. Smela","raw_affiliation_strings":["Mechanical Engineering, University of Maryland, College Park, MD, USA"],"affiliations":[{"raw_affiliation_string":"Mechanical Engineering, University of Maryland, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5017687136"],"corresponding_institution_ids":["https://openalex.org/I145311948"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.05550009,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"3506","last_page":"3509"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10660","display_name":"Conducting polymers and applications","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10660","display_name":"Conducting polymers and applications","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6073777675628662},{"id":"https://openalex.org/keywords/polypyrrole","display_name":"Polypyrrole","score":0.5912300944328308},{"id":"https://openalex.org/keywords/deposition","display_name":"Deposition (geology)","score":0.5823286771774292},{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.5607955455780029},{"id":"https://openalex.org/keywords/actuator","display_name":"Actuator","score":0.5254634618759155},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.4969539940357208},{"id":"https://openalex.org/keywords/turnaround-time","display_name":"Turnaround time","score":0.43009594082832336},{"id":"https://openalex.org/keywords/bilayer","display_name":"Bilayer","score":0.4233420789241791},{"id":"https://openalex.org/keywords/matlab","display_name":"MATLAB","score":0.4164610207080841},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.4108165502548218},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.34431275725364685},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.33928781747817993},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.32997971773147583},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3281491994857788},{"id":"https://openalex.org/keywords/electrochemistry","display_name":"Electrochemistry","score":0.22076919674873352},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.19809797406196594},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.1211557686328888},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.10561949014663696}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6073777675628662},{"id":"https://openalex.org/C2777232022","wikidata":"https://www.wikidata.org/wiki/Q146230","display_name":"Polypyrrole","level":4,"score":0.5912300944328308},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.5823286771774292},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.5607955455780029},{"id":"https://openalex.org/C172707124","wikidata":"https://www.wikidata.org/wiki/Q423488","display_name":"Actuator","level":2,"score":0.5254634618759155},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.4969539940357208},{"id":"https://openalex.org/C176553487","wikidata":"https://www.wikidata.org/wiki/Q7855819","display_name":"Turnaround time","level":2,"score":0.43009594082832336},{"id":"https://openalex.org/C192157962","wikidata":"https://www.wikidata.org/wiki/Q4087243","display_name":"Bilayer","level":3,"score":0.4233420789241791},{"id":"https://openalex.org/C2780365114","wikidata":"https://www.wikidata.org/wiki/Q169478","display_name":"MATLAB","level":2,"score":0.4164610207080841},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.4108165502548218},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.34431275725364685},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.33928781747817993},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.32997971773147583},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3281491994857788},{"id":"https://openalex.org/C52859227","wikidata":"https://www.wikidata.org/wiki/Q7877","display_name":"Electrochemistry","level":3,"score":0.22076919674873352},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.19809797406196594},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.1211557686328888},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.10561949014663696},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C41625074","wikidata":"https://www.wikidata.org/wiki/Q176088","display_name":"Membrane","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscas.2006.1693382","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2006.1693382","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2006 IEEE International Symposium on Circuits and Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5299999713897705,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1480737838","https://openalex.org/W1531295603","https://openalex.org/W1967098842","https://openalex.org/W2003408868","https://openalex.org/W2028240311","https://openalex.org/W2048868790","https://openalex.org/W2065695030","https://openalex.org/W2094741269"],"related_works":["https://openalex.org/W2373227895","https://openalex.org/W585699616","https://openalex.org/W1936924293","https://openalex.org/W2981670615","https://openalex.org/W2091082548","https://openalex.org/W2019921404","https://openalex.org/W2066532521","https://openalex.org/W1971004312","https://openalex.org/W2357674325","https://openalex.org/W2767554844"],"abstract_inverted_index":{"We":[0,71,102],"report":[1],"on":[2],"a":[3,59,66,105],"custom":[4],"designed":[5],"system":[6,24],"for":[7],"the":[8,23,43,74,77,84,94,111],"deposition":[9],"and":[10,21,35,53],"characterization":[11],"of":[12,76,107],"polypyrrole":[13,85],"bilayer":[14],"actuators.":[15],"Unlike":[16],"conventional":[17],"commercial":[18],"electrochemical":[19],"cells":[20],"potentiostats,":[22],"described":[25],"in":[26,69,110],"this":[27],"paper":[28],"has":[29],"specifications":[30],"commensurate":[31],"to":[32,82],"its":[33],"application":[34],"thus":[36],"can":[37],"be":[38],"readily":[39],"implemented":[40,104],"using":[41,93],"off":[42],"shelf":[44],"electronic":[45],"components":[46],"at":[47],"relatively":[48],"low":[49],"cost.":[50],"Deposition":[51],"rates":[52],"actuation":[54],"are":[55,80],"computer":[56],"controlled":[57],"through":[58,90],"standard":[60],"data":[61],"acquisition":[62],"interface":[63],"card":[64],"with":[65],"program":[67],"written":[68],"Matlab.":[70],"also":[72],"discuss":[73],"design":[75,119],"masks":[78],"that":[79,116],"employed":[81],"fabricate":[83],"structures.":[86],"This":[87],"is":[88],"accomplished":[89],"silicon":[91],"compilation":[92],"CAD":[95],"software":[96],"LEDIT":[97,112],"(1999)":[98],"from":[99],"Tanner":[100],"Research.":[101],"have":[103],"selection":[106],"parameterized":[108],"routines":[109],"script":[113],"language":[114],"LComp":[115],"greatly":[117],"reduces":[118],"turnaround":[120],"time.":[121]},"counts_by_year":[{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}