{"id":"https://openalex.org/W1596344314","doi":"https://doi.org/10.1109/iscas.2004.1328836","title":"Integrated MEMS structures and CMOS circuits for bioelectronic interface with single cells","display_name":"Integrated MEMS structures and CMOS circuits for bioelectronic interface with single cells","publication_year":2004,"publication_date":"2004-01-01","ids":{"openalex":"https://openalex.org/W1596344314","doi":"https://doi.org/10.1109/iscas.2004.1328836","mag":"1596344314"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2004.1328836","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2004.1328836","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5087428283","display_name":"Natasha Reeves","orcid":null},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"N. Reeves","raw_affiliation_strings":["Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA","Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA"],"affiliations":[{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA","institution_ids":["https://openalex.org/I66946132"]},{"raw_affiliation_string":"Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084212061","display_name":"Y. Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Y. Liu","raw_affiliation_strings":["Mechanical Engineering, University of Maryland, College Park, Maryland, USA"],"affiliations":[{"raw_affiliation_string":"Mechanical Engineering, University of Maryland, College Park, Maryland, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088745197","display_name":"Nicole Nelson","orcid":null},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"N.M. Nelson","raw_affiliation_strings":["Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059663497","display_name":"S. Malhotra","orcid":null},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Malhotra","raw_affiliation_strings":["Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085064219","display_name":"M. Loganathan","orcid":null},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Loganathan","raw_affiliation_strings":["Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089385200","display_name":"J.-M. Lauestein","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"J.-M. Lauestein","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040372832","display_name":"C. Chaiyupatumpa","orcid":null},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Chaiyupatumpa","raw_affiliation_strings":["Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088261669","display_name":"Elisabeth Smela","orcid":"https://orcid.org/0000-0003-3921-2265"},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"E. Smela","raw_affiliation_strings":["Mechanical Engineering, University of Maryland, College Park, Maryland, USA"],"affiliations":[{"raw_affiliation_string":"Mechanical Engineering, University of Maryland, College Park, Maryland, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077161756","display_name":"Pamela Abshire","orcid":"https://orcid.org/0000-0001-9555-453X"},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P.A. Abshire","raw_affiliation_strings":["Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, University of Maryland, College Park, Maryland, USA","institution_ids":["https://openalex.org/I66946132"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5087428283"],"corresponding_institution_ids":["https://openalex.org/I66946132"],"apc_list":null,"apc_paid":null,"fwci":3.9701,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.93452845,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"III","last_page":"673"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11472","display_name":"Analytical Chemistry and Sensors","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/1502","display_name":"Bioengineering"},"field":{"id":"https://openalex.org/fields/15","display_name":"Chemical Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11472","display_name":"Analytical Chemistry and Sensors","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/1502","display_name":"Bioengineering"},"field":{"id":"https://openalex.org/fields/15","display_name":"Chemical Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interfacing","display_name":"Interfacing","score":0.8794031143188477},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.6235053539276123},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5908167958259583},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5492673516273499},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5005946159362793},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.440146803855896},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.4279389977455139},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.42335420846939087},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4205154776573181},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.36430105566978455},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3559279441833496},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3096351623535156},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2607317566871643},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.25201356410980225},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24905571341514587}],"concepts":[{"id":"https://openalex.org/C2776303644","wikidata":"https://www.wikidata.org/wiki/Q1020499","display_name":"Interfacing","level":2,"score":0.8794031143188477},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.6235053539276123},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5908167958259583},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5492673516273499},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5005946159362793},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.440146803855896},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4279389977455139},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.42335420846939087},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4205154776573181},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.36430105566978455},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3559279441833496},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3096351623535156},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2607317566871643},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.25201356410980225},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24905571341514587},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C196806460","wikidata":"https://www.wikidata.org/wiki/Q188603","display_name":"Capillary action","level":2,"score":0.0},{"id":"https://openalex.org/C28413391","wikidata":"https://www.wikidata.org/wiki/Q785542","display_name":"Capillary number","level":3,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/iscas.2004.1328836","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2004.1328836","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 IEEE International Symposium on Circuits and Systems (ISCAS)","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.500.4517","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.500.4517","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.isr.umd.edu/IBIS/publications/10.1109-ISCAS.2004.1328836.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W419563111","https://openalex.org/W599550356","https://openalex.org/W638095323","https://openalex.org/W1480737838","https://openalex.org/W1516759362","https://openalex.org/W1542675219","https://openalex.org/W1682009955","https://openalex.org/W1981696091","https://openalex.org/W1997104334","https://openalex.org/W2017204393","https://openalex.org/W2023123970","https://openalex.org/W2042312878","https://openalex.org/W2048868790","https://openalex.org/W2050753656","https://openalex.org/W2068583038","https://openalex.org/W2093061411","https://openalex.org/W2104193637","https://openalex.org/W2133678917","https://openalex.org/W2144105614","https://openalex.org/W2155382019","https://openalex.org/W2159318368","https://openalex.org/W2321562894"],"related_works":["https://openalex.org/W2136647108","https://openalex.org/W2350029007","https://openalex.org/W1965180958","https://openalex.org/W1973428399","https://openalex.org/W2182594080","https://openalex.org/W2484987020","https://openalex.org/W2152662857","https://openalex.org/W2017757432","https://openalex.org/W2085527795","https://openalex.org/W2098218272"],"abstract_inverted_index":{"We":[0,46],"describe":[1],"a":[2,44,49,89],"bioMEMS":[3],"system":[4,17],"for":[5,13,52],"confining":[6],"and":[7,24],"electrically":[8],"interfacing":[9],"to":[10,42],"single":[11],"cells":[12,73,87],"long-term":[14],"studies.":[15],"The":[16],"comprises":[18],"microvials":[19,55],"that":[20],"can":[21],"be":[22],"covered":[23],"uncovered":[25],"by":[26,29],"lids":[27,58],"actuated":[28,57],"polypyrrole/gold":[30],"hinges.":[31],"Within":[32],"each":[33],"vial":[34],"are":[35],"integrated":[36],"bio-amplifiers":[37],"and/or":[38],"other":[39],"sensing":[40,76],"circuits":[41],"form":[43],"biolab-on-a-chip.":[45],"have":[47],"developed":[48],"process":[50],"sequence":[51],"fabricating":[53],"lidded":[54],"with":[56,68],"on":[59],"CMOS":[60],"die.":[61],"Initial":[62],"testing":[63],"of":[64,77],"these":[65],"\"cell":[66],"clinics\"":[67],"bovine":[69,83],"aortic":[70,84],"smooth":[71,85],"muscle":[72,86],"yields":[74],"successful":[75],"the":[78],"extracellular":[79],"action":[80],"potentials":[81],"from":[82],"using":[88],"custom":[90],"VLSI":[91],"bioamplifier.":[92]},"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}