{"id":"https://openalex.org/W1543289999","doi":"https://doi.org/10.1109/iscas.2003.1205172","title":"A modular sensor microsystem utilizing a universal interface circuit","display_name":"A modular sensor microsystem utilizing a universal interface circuit","publication_year":2003,"publication_date":"2003-11-21","ids":{"openalex":"https://openalex.org/W1543289999","doi":"https://doi.org/10.1109/iscas.2003.1205172","mag":"1543289999"},"language":"en","primary_location":{"id":"doi:10.1109/iscas.2003.1205172","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2003.1205172","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2003 International Symposium on Circuits and Systems, 2003. ISCAS '03.","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5025942859","display_name":"Andrew J. Mason","orcid":"https://orcid.org/0000-0002-6548-1162"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"A. Mason","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110736590","display_name":"N. Yazdi","orcid":"https://orcid.org/0009-0002-6458-9988"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"N. Yazdi","raw_affiliation_strings":["Department of Electrical Engineering, Arizona State University, Tempe, AZ, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Arizona State University, Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023975843","display_name":"J. Zhang","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"J. Zhang","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5005574872","display_name":"Zuhail Sainudeen","orcid":null},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Z. Sainudeen","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA","institution_ids":["https://openalex.org/I87216513"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5025942859"],"corresponding_institution_ids":["https://openalex.org/I87216513"],"apc_list":null,"apc_paid":null,"fwci":0.6955,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.69165886,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"3","issue":null,"first_page":"III","last_page":"926"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12784","display_name":"Modular Robots and Swarm Intelligence","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microsystem","display_name":"Microsystem","score":0.907371997833252},{"id":"https://openalex.org/keywords/modularity","display_name":"Modularity (biology)","score":0.7991735339164734},{"id":"https://openalex.org/keywords/modular-design","display_name":"Modular design","score":0.7671207785606384},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.6245797872543335},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6068882346153259},{"id":"https://openalex.org/keywords/control-reconfiguration","display_name":"Control reconfiguration","score":0.5995959639549255},{"id":"https://openalex.org/keywords/plug-and-play","display_name":"Plug and play","score":0.5490565299987793},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5248327851295471},{"id":"https://openalex.org/keywords/suite","display_name":"Suite","score":0.41930750012397766},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.4127841889858246},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3866211771965027},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.32891646027565},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2911840081214905},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.277529776096344},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.10332602262496948}],"concepts":[{"id":"https://openalex.org/C151054161","wikidata":"https://www.wikidata.org/wiki/Q379385","display_name":"Microsystem","level":2,"score":0.907371997833252},{"id":"https://openalex.org/C2779478453","wikidata":"https://www.wikidata.org/wiki/Q6889748","display_name":"Modularity (biology)","level":2,"score":0.7991735339164734},{"id":"https://openalex.org/C101468663","wikidata":"https://www.wikidata.org/wiki/Q1620158","display_name":"Modular design","level":2,"score":0.7671207785606384},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.6245797872543335},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6068882346153259},{"id":"https://openalex.org/C119701452","wikidata":"https://www.wikidata.org/wiki/Q5165881","display_name":"Control reconfiguration","level":2,"score":0.5995959639549255},{"id":"https://openalex.org/C2780070844","wikidata":"https://www.wikidata.org/wiki/Q857815","display_name":"Plug and play","level":2,"score":0.5490565299987793},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5248327851295471},{"id":"https://openalex.org/C79581498","wikidata":"https://www.wikidata.org/wiki/Q1367530","display_name":"Suite","level":2,"score":0.41930750012397766},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.4127841889858246},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3866211771965027},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.32891646027565},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2911840081214905},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.277529776096344},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.10332602262496948},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C166957645","wikidata":"https://www.wikidata.org/wiki/Q23498","display_name":"Archaeology","level":1,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0},{"id":"https://openalex.org/C54355233","wikidata":"https://www.wikidata.org/wiki/Q7162","display_name":"Genetics","level":1,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0},{"id":"https://openalex.org/C95457728","wikidata":"https://www.wikidata.org/wiki/Q309","display_name":"History","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscas.2003.1205172","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscas.2003.1205172","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2003 International Symposium on Circuits and Systems, 2003. ISCAS '03.","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1604608773","https://openalex.org/W2057620214","https://openalex.org/W2082981272","https://openalex.org/W2094276266","https://openalex.org/W2110775015","https://openalex.org/W2115006402","https://openalex.org/W2145154329","https://openalex.org/W2153435288","https://openalex.org/W2162672488","https://openalex.org/W4233236873"],"related_works":["https://openalex.org/W1988460209","https://openalex.org/W1495423923","https://openalex.org/W2289396372","https://openalex.org/W2884343688","https://openalex.org/W2005078723","https://openalex.org/W2357657342","https://openalex.org/W2377074248","https://openalex.org/W2360146884","https://openalex.org/W2186351580","https://openalex.org/W2577208961"],"abstract_inverted_index":{"The":[0],"performance":[1],"features":[2],"of":[3,9,13,22,29,69],"MEMS":[4],"transducers":[5],"allow":[6],"the":[7],"development":[8],"a":[10,20,26,34,48,81,85],"new":[11],"class":[12],"small,":[14],"low-power":[15],"sensor":[16],"microsystems":[17,40],"which":[18,90],"utilize":[19],"suite":[21],"sensors":[23],"to":[24],"support":[25,91],"wide":[27],"range":[28],"applications.":[30],"This":[31],"paper":[32],"presents":[33],"system-level":[35],"framework":[36],"for":[37,44,76,94],"constructing":[38],"such":[39,79],"where":[41],"system":[42],"modularity":[43],"application":[45],"adaptability":[46],"is":[47,72],"primary":[49],"design":[50],"consideration.":[51],"System":[52],"architecture,":[53],"communication":[54,82],"protocols,":[55],"modular":[56],"packaging,":[57],"and":[58,66,84,99],"interface":[59,88],"electronics":[60],"are":[61,97],"discussed":[62],"in":[63,101],"general":[64],"terms,":[65],"an":[67],"implementation":[68],"these":[70],"concepts":[71],"presented.":[73],"Key":[74],"requirements":[75],"microsystem":[77],"modularity,":[78],"as":[80],"bus":[83],"universal":[86],"microsensor":[87],"circuit":[89],"plug-n-play":[92],"operation":[93],"online":[95],"reconfiguration,":[96],"developed":[98],"presented":[100],"this":[102],"paper.":[103]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}