{"id":"https://openalex.org/W2102314381","doi":"https://doi.org/10.1109/isbi.2004.1398587","title":"Atomic layer deposition for fabricating capacitive micromachined ultrasonic transducers: initial characterization","display_name":"Atomic layer deposition for fabricating capacitive micromachined ultrasonic transducers: initial characterization","publication_year":2005,"publication_date":"2005-04-12","ids":{"openalex":"https://openalex.org/W2102314381","doi":"https://doi.org/10.1109/isbi.2004.1398587","mag":"2102314381"},"language":"en","primary_location":{"id":"doi:10.1109/isbi.2004.1398587","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isbi.2004.1398587","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 2nd IEEE International Symposium on Biomedical Imaging: Macro to Nano (IEEE Cat No. 04EX821)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5049743466","display_name":"L.L. Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I188538660","display_name":"University of Colorado Boulder","ror":"https://ror.org/02ttsq026","country_code":"US","type":"education","lineage":["https://openalex.org/I188538660"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"L.L. Liu","raw_affiliation_strings":["Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","institution_ids":["https://openalex.org/I188538660"]},{"raw_affiliation_string":"[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]","institution_ids":["https://openalex.org/I188538660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043668762","display_name":"Osama M. Mukdadi","orcid":"https://orcid.org/0000-0001-9250-0720"},"institutions":[{"id":"https://openalex.org/I188538660","display_name":"University of Colorado Boulder","ror":"https://ror.org/02ttsq026","country_code":"US","type":"education","lineage":["https://openalex.org/I188538660"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"O.M. Mukdadi","raw_affiliation_strings":["Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","institution_ids":["https://openalex.org/I188538660"]},{"raw_affiliation_string":"[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]","institution_ids":["https://openalex.org/I188538660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051366404","display_name":"Jean Hertzberg","orcid":"https://orcid.org/0000-0002-8984-6808"},"institutions":[{"id":"https://openalex.org/I188538660","display_name":"University of Colorado Boulder","ror":"https://ror.org/02ttsq026","country_code":"US","type":"education","lineage":["https://openalex.org/I188538660"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.R. Hertzberg","raw_affiliation_strings":["Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","institution_ids":["https://openalex.org/I188538660"]},{"raw_affiliation_string":"[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]","institution_ids":["https://openalex.org/I188538660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108047202","display_name":"Hyoung-Bum Kim","orcid":"https://orcid.org/0000-0001-5211-3339"},"institutions":[{"id":"https://openalex.org/I188538660","display_name":"University of Colorado Boulder","ror":"https://ror.org/02ttsq026","country_code":"US","type":"education","lineage":["https://openalex.org/I188538660"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H.B. Kim","raw_affiliation_strings":["Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","institution_ids":["https://openalex.org/I188538660"]},{"raw_affiliation_string":"[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]","institution_ids":["https://openalex.org/I188538660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057626532","display_name":"Victor M. Bright","orcid":"https://orcid.org/0000-0001-5498-3071"},"institutions":[{"id":"https://openalex.org/I188538660","display_name":"University of Colorado Boulder","ror":"https://ror.org/02ttsq026","country_code":"US","type":"education","lineage":["https://openalex.org/I188538660"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"V.M. Bright","raw_affiliation_strings":["Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","institution_ids":["https://openalex.org/I188538660"]},{"raw_affiliation_string":"[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]","institution_ids":["https://openalex.org/I188538660"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080954287","display_name":"Robin Shandas","orcid":"https://orcid.org/0000-0002-9473-7542"},"institutions":[{"id":"https://openalex.org/I188538660","display_name":"University of Colorado Boulder","ror":"https://ror.org/02ttsq026","country_code":"US","type":"education","lineage":["https://openalex.org/I188538660"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. Shandas","raw_affiliation_strings":["Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA","institution_ids":["https://openalex.org/I188538660"]},{"raw_affiliation_string":"[Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA]","institution_ids":["https://openalex.org/I188538660"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5049743466"],"corresponding_institution_ids":["https://openalex.org/I188538660"],"apc_list":null,"apc_paid":null,"fwci":0.873,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.756239,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"2","issue":null,"first_page":"512","last_page":"515"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10107","display_name":"Ferroelectric and Piezoelectric Materials","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.7632728815078735},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7373000383377075},{"id":"https://openalex.org/keywords/atomic-layer-deposition","display_name":"Atomic layer deposition","score":0.6872420907020569},{"id":"https://openalex.org/keywords/transducer","display_name":"Transducer","score":0.6407377123832703},{"id":"https://openalex.org/keywords/capacitive-micromachined-ultrasonic-transducers","display_name":"Capacitive micromachined ultrasonic transducers","score":0.6350553631782532},{"id":"https://openalex.org/keywords/ultrasonic-sensor","display_name":"Ultrasonic sensor","score":0.6075665354728699},{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.5361542105674744},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.49045655131340027},{"id":"https://openalex.org/keywords/capacitor","display_name":"Capacitor","score":0.4774254262447357},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.45971018075942993},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.4496142268180847},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.38251057267189026},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.35695260763168335},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.21450799703598022},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.20078805088996887},{"id":"https://openalex.org/keywords/piezoelectricity","display_name":"Piezoelectricity","score":0.18002554774284363},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.13284268975257874},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.11941242218017578},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.08773094415664673}],"concepts":[{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.7632728815078735},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7373000383377075},{"id":"https://openalex.org/C69544855","wikidata":"https://www.wikidata.org/wiki/Q757625","display_name":"Atomic layer deposition","level":3,"score":0.6872420907020569},{"id":"https://openalex.org/C56318395","wikidata":"https://www.wikidata.org/wiki/Q215928","display_name":"Transducer","level":2,"score":0.6407377123832703},{"id":"https://openalex.org/C58772458","wikidata":"https://www.wikidata.org/wiki/Q5034480","display_name":"Capacitive micromachined ultrasonic transducers","level":3,"score":0.6350553631782532},{"id":"https://openalex.org/C81288441","wikidata":"https://www.wikidata.org/wiki/Q20736125","display_name":"Ultrasonic sensor","level":2,"score":0.6075665354728699},{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.5361542105674744},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.49045655131340027},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.4774254262447357},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.45971018075942993},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.4496142268180847},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.38251057267189026},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.35695260763168335},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.21450799703598022},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.20078805088996887},{"id":"https://openalex.org/C100082104","wikidata":"https://www.wikidata.org/wiki/Q183759","display_name":"Piezoelectricity","level":2,"score":0.18002554774284363},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.13284268975257874},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.11941242218017578},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.08773094415664673},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isbi.2004.1398587","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isbi.2004.1398587","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 2nd IEEE International Symposium on Biomedical Imaging: Macro to Nano (IEEE Cat No. 04EX821)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.47999998927116394,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W630955716","https://openalex.org/W1567834739","https://openalex.org/W2000399637","https://openalex.org/W2070151367","https://openalex.org/W2102196727","https://openalex.org/W2156690225","https://openalex.org/W2159442239","https://openalex.org/W3022497021","https://openalex.org/W3023949535"],"related_works":["https://openalex.org/W4319718051","https://openalex.org/W3202163833","https://openalex.org/W2808928575","https://openalex.org/W4281663564","https://openalex.org/W2330836581","https://openalex.org/W3008955959","https://openalex.org/W2890862950","https://openalex.org/W2165649385","https://openalex.org/W2051847435","https://openalex.org/W2969556451"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3],"examine":[4],"the":[5,50,64,69,83,88,143,155],"utility":[6],"of":[7,40,45,66,76,87,94],"a":[8,30,61,73,118,127],"new":[9],"method":[10,19],"for":[11,110,145],"fabricating":[12],"capacitive":[13],"micromachined":[14],"ultrasonic":[15],"transducers":[16,95],"(CMUTs).":[17],"The":[18],"is":[20,158],"based":[21],"on":[22],"atomic":[23],"layer":[24],"deposition":[25],"(ALD)":[26],"technology,":[27],"which":[28],"uses":[29],"self-limiting":[31],"binary":[32],"reaction":[33],"process":[34,129],"to":[35,60,71,82,130,153],"produce":[36],"ultra-thin":[37],"membranes.":[38,89],"Advantages":[39],"ALD":[41],"include":[42],"precise":[43],"control":[44],"dimensions":[46],"including":[47],"gap-width":[48],"between":[49],"capacitor":[51],"plates,":[52],"membrane":[53],"thickness":[54],"and":[55,78,107,121,132,148],"radius,":[56],"lower":[57],"cost":[58],"due":[59,81],"reduction":[62],"in":[63],"number":[65],"fabrication":[67,93,128],"steps,":[68],"potential":[70,144],"use":[72],"large":[74],"variety":[75],"materials,":[77],"increased":[79],"reliability":[80],"enhanced":[84],"surface":[85],"quality":[86],"These":[90],"capabilities":[91],"promise":[92],"with":[96,126],"superior":[97],"operating":[98],"characteristics.":[99],"However,":[100],"no":[101],"study":[102],"has":[103],"yet":[104],"documented":[105],"sensitivity":[106,147],"power":[108,150],"requirements":[109],"CMUTs":[111,134],"created":[112],"using":[113,135],"ALD.":[114,136],"We":[115],"present":[116],"here":[117],"first-order":[119],"mechanical":[120],"equivalent":[122],"circuit":[123],"analysis":[124],"along":[125],"create":[131],"characterize":[133],"Results":[137],"show":[138],"that":[139],"these":[140],"systems":[141],"have":[142],"excellent":[146],"decreased":[149],"requirements.":[151],"Work":[152],"test":[154],"fabricated":[156],"elements":[157],"currently":[159],"underway.":[160]},"counts_by_year":[{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}