{"id":"https://openalex.org/W4396980738","doi":"https://doi.org/10.1109/irps48228.2024.10529434","title":"Design for Reliability (DFR) Aware EDA Solution for Product Reliability (Invited)","display_name":"Design for Reliability (DFR) Aware EDA Solution for Product Reliability (Invited)","publication_year":2024,"publication_date":"2024-04-14","ids":{"openalex":"https://openalex.org/W4396980738","doi":"https://doi.org/10.1109/irps48228.2024.10529434"},"language":"en","primary_location":{"id":"doi:10.1109/irps48228.2024.10529434","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48228.2024.10529434","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100669566","display_name":"Tianhao Zhang","orcid":"https://orcid.org/0000-0002-6258-4553"},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Tianhao Zhang","raw_affiliation_strings":["Ansys, Inc,San Jose,CA","Ansys, Inc, San Jose, CA"],"affiliations":[{"raw_affiliation_string":"Ansys, Inc,San Jose,CA","institution_ids":["https://openalex.org/I21160419"]},{"raw_affiliation_string":"Ansys, Inc, San Jose, CA","institution_ids":["https://openalex.org/I21160419"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5070536710","display_name":"Norman Chang","orcid":"https://orcid.org/0000-0003-2524-0935"},"institutions":[{"id":"https://openalex.org/I21160419","display_name":"Ansys (United States)","ror":"https://ror.org/05cf5b117","country_code":"US","type":"company","lineage":["https://openalex.org/I21160419"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Norman Chang","raw_affiliation_strings":["Ansys, Inc,San Jose,CA","Ansys, Inc, San Jose, CA"],"affiliations":[{"raw_affiliation_string":"Ansys, Inc,San Jose,CA","institution_ids":["https://openalex.org/I21160419"]},{"raw_affiliation_string":"Ansys, Inc, San Jose, CA","institution_ids":["https://openalex.org/I21160419"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5100669566"],"corresponding_institution_ids":["https://openalex.org/I21160419"],"apc_list":null,"apc_paid":null,"fwci":0.6674,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.67814198,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7360036969184875},{"id":"https://openalex.org/keywords/multiphysics","display_name":"Multiphysics","score":0.713681697845459},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.6634142994880676},{"id":"https://openalex.org/keywords/electronic-design-automation","display_name":"Electronic design automation","score":0.5796388387680054},{"id":"https://openalex.org/keywords/workflow","display_name":"Workflow","score":0.5751292109489441},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5462980270385742},{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.5079448819160461},{"id":"https://openalex.org/keywords/automation","display_name":"Automation","score":0.4902699291706085},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.45324626564979553},{"id":"https://openalex.org/keywords/interdependence","display_name":"Interdependence","score":0.42380034923553467},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.42120373249053955},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.3812747001647949},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.32276567816734314},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.21861118078231812},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.10051926970481873}],"concepts":[{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7360036969184875},{"id":"https://openalex.org/C46435376","wikidata":"https://www.wikidata.org/wiki/Q1829750","display_name":"Multiphysics","level":3,"score":0.713681697845459},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.6634142994880676},{"id":"https://openalex.org/C64260653","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design automation","level":2,"score":0.5796388387680054},{"id":"https://openalex.org/C177212765","wikidata":"https://www.wikidata.org/wiki/Q627335","display_name":"Workflow","level":2,"score":0.5751292109489441},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5462980270385742},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.5079448819160461},{"id":"https://openalex.org/C115901376","wikidata":"https://www.wikidata.org/wiki/Q184199","display_name":"Automation","level":2,"score":0.4902699291706085},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.45324626564979553},{"id":"https://openalex.org/C185874996","wikidata":"https://www.wikidata.org/wiki/Q269699","display_name":"Interdependence","level":2,"score":0.42380034923553467},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.42120373249053955},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3812747001647949},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.32276567816734314},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.21861118078231812},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.10051926970481873},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps48228.2024.10529434","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48228.2024.10529434","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.5799999833106995}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1547964102","https://openalex.org/W1915204103","https://openalex.org/W2744406216","https://openalex.org/W4229451260","https://openalex.org/W4312712610"],"related_works":["https://openalex.org/W2084426624","https://openalex.org/W3026055904","https://openalex.org/W2792869497","https://openalex.org/W4312133600","https://openalex.org/W2567205727","https://openalex.org/W2361803029","https://openalex.org/W2548694948","https://openalex.org/W2393282994","https://openalex.org/W2393908603","https://openalex.org/W1996645807"],"abstract_inverted_index":{"Product":[0],"reliability,":[1],"encompassing":[2],"both":[3],"manufacturing":[4],"and":[5,30,45,56,99,115],"operational":[6],"aspects,":[7],"is":[8],"emerging":[9],"as":[10,36],"a":[11],"crucial":[12],"aspect":[13],"of":[14,63,108],"design":[15,19],"across":[16],"iterative":[17],"chip-package-system":[18],"cycles,":[20],"especially":[21],"those":[22],"products":[23],"anticipated":[24],"to":[25],"endure":[26],"for":[27,87,117],"longer":[28],"lifetime":[29],"possible":[31],"severe":[32],"operation":[33],"environment,":[34],"such":[35],"automotive":[37],"electronics":[38],"systems,":[39,49],"high":[40],"performance":[41],"computing":[42],"(HPC),":[43],"telecommunications,":[44],"AI":[46],"applications.":[47],"These":[48],"characterized":[50],"by":[51],"higher":[52],"power":[53],"density,":[54],"2.5D":[55],"3D":[57],"Heterogeneous":[58],"Integration,":[59],"necessitate":[60],"careful":[61],"consideration":[62],"Multiphysics-based":[64],"reliability":[65,73],"enhancements":[66],"while":[67],"addressing":[68],"the":[69,81,106],"interdependencies":[70],"among":[71],"different":[72],"requirements,":[74],"presents":[75],"significant":[76],"challenges.":[77],"This":[78,102],"paper":[79,103],"introduces":[80],"innovative":[82],"EDA":[83],"solution":[84],"on":[85],"Design":[86],"Reliability":[88],"(DFR)":[89],"workflow":[90],"with":[91],"Multiphysics":[92],"consideration,":[93],"crossing":[94],"from":[95],"IP":[96],"level,":[97],"chip,":[98],"package/PCB":[100],"levels.":[101],"also":[104],"outlines":[105],"roadmap":[107],"DFR":[109],"enhancement":[110],"including":[111],"early-stage":[112],"feasibility":[113],"analysis":[114],"automation":[116],"system-technology":[118],"co-optimization.":[119]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}