{"id":"https://openalex.org/W4396949205","doi":"https://doi.org/10.1109/irps48228.2024.10529413","title":"Layout Guidelines against Charging Damage from the Well-Side Antennas in Separated Power Domains","display_name":"Layout Guidelines against Charging Damage from the Well-Side Antennas in Separated Power Domains","publication_year":2024,"publication_date":"2024-04-14","ids":{"openalex":"https://openalex.org/W4396949205","doi":"https://doi.org/10.1109/irps48228.2024.10529413"},"language":"en","primary_location":{"id":"doi:10.1109/irps48228.2024.10529413","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48228.2024.10529413","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5090291177","display_name":"Hsi-Yu Kuo","orcid":null},"institutions":[{"id":"https://openalex.org/I4210119464","display_name":"Quality and Reliability (Greece)","ror":"https://ror.org/02f8mda22","country_code":"GR","type":"company","lineage":["https://openalex.org/I4210119464"]}],"countries":["GR"],"is_corresponding":true,"raw_author_name":"Hsi-Yu Kuo","raw_affiliation_strings":["Quality & Reliability"],"affiliations":[{"raw_affiliation_string":"Quality & Reliability","institution_ids":["https://openalex.org/I4210119464"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110975541","display_name":"Yu-Lin Chu","orcid":"https://orcid.org/0009-0000-7250-7976"},"institutions":[{"id":"https://openalex.org/I4210119464","display_name":"Quality and Reliability (Greece)","ror":"https://ror.org/02f8mda22","country_code":"GR","type":"company","lineage":["https://openalex.org/I4210119464"]}],"countries":["GR"],"is_corresponding":false,"raw_author_name":"Yu-Lin Chu","raw_affiliation_strings":["Quality & Reliability"],"affiliations":[{"raw_affiliation_string":"Quality & Reliability","institution_ids":["https://openalex.org/I4210119464"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050021790","display_name":"Hung-Da Dai","orcid":"https://orcid.org/0000-0001-6536-7100"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Hung-Da Dai","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074731112","display_name":"Chun-Chi Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chun-Chi Wang","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101203013","display_name":"Pei-Jung Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Pei-Jung Lin","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114161371","display_name":"Shu-Cheng Kuo","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Shu-Cheng Kuo","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112915944","display_name":"Ethan Guo","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ethan Guo","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,DRC,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,DRC,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100724532","display_name":"Yamin Zhang","orcid":"https://orcid.org/0000-0001-5001-4329"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ya-Min Zhang","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,DRC,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,DRC,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114034882","display_name":"Yu-Ti Su","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Ti Su","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,ESD,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,ESD,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103946611","display_name":"Chia-Lin Hsu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chia-Lin Hsu","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,ESD,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,ESD,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055480013","display_name":"Kuan\u2010Hung Chen","orcid":"https://orcid.org/0000-0003-2336-2752"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kuan-Hung Chen","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,ESD,Hsinchu,Taiwan,R. O. C.,300-77","Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,ESD,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056913557","display_name":"Tsung-Yuan Chen","orcid":"https://orcid.org/0000-0002-1155-1372"},"institutions":[{"id":"https://openalex.org/I4210119464","display_name":"Quality and Reliability (Greece)","ror":"https://ror.org/02f8mda22","country_code":"GR","type":"company","lineage":["https://openalex.org/I4210119464"]}],"countries":["GR"],"is_corresponding":false,"raw_author_name":"Tsung-Yuan Chen","raw_affiliation_strings":["Quality & Reliability"],"affiliations":[{"raw_affiliation_string":"Quality & Reliability","institution_ids":["https://openalex.org/I4210119464"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100592148","display_name":"Te-Liang Li","orcid":null},"institutions":[{"id":"https://openalex.org/I4210119464","display_name":"Quality and Reliability (Greece)","ror":"https://ror.org/02f8mda22","country_code":"GR","type":"company","lineage":["https://openalex.org/I4210119464"]}],"countries":["GR"],"is_corresponding":false,"raw_author_name":"Te-Liang Li","raw_affiliation_strings":["Quality & Reliability"],"affiliations":[{"raw_affiliation_string":"Quality & Reliability","institution_ids":["https://openalex.org/I4210119464"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111524552","display_name":"Ray Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210119464","display_name":"Quality and Reliability (Greece)","ror":"https://ror.org/02f8mda22","country_code":"GR","type":"company","lineage":["https://openalex.org/I4210119464"]}],"countries":["GR"],"is_corresponding":false,"raw_author_name":"Ray Huang","raw_affiliation_strings":["Quality & Reliability"],"affiliations":[{"raw_affiliation_string":"Quality & Reliability","institution_ids":["https://openalex.org/I4210119464"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032577494","display_name":"Kuo-Ji Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kuo-Ji Chen","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,ESD,Hsinchu,Taiwan,R. O. C.,300-77","Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,ESD,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034065846","display_name":"Ming-Hsiang Song","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ming-Hsiang Song","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,ESD,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,ESD,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006123246","display_name":"Ryan Lu","orcid":"https://orcid.org/0000-0003-0922-3342"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ryan Lu","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Co., Ltd.,Product Engineering,Hsinchu,Taiwan,R. O. C.,300-77","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5089693505","display_name":"Kejun Xia","orcid":"https://orcid.org/0000-0002-4210-345X"},"institutions":[{"id":"https://openalex.org/I4210119464","display_name":"Quality and Reliability (Greece)","ror":"https://ror.org/02f8mda22","country_code":"GR","type":"company","lineage":["https://openalex.org/I4210119464"]}],"countries":["GR"],"is_corresponding":false,"raw_author_name":"Kejun Xia","raw_affiliation_strings":["Quality & Reliability"],"affiliations":[{"raw_affiliation_string":"Quality & Reliability","institution_ids":["https://openalex.org/I4210119464"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":18,"corresponding_author_ids":["https://openalex.org/A5090291177"],"corresponding_institution_ids":["https://openalex.org/I4210119464"],"apc_list":null,"apc_paid":null,"fwci":0.6674,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.6779718,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9954000115394592,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12122","display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","score":0.9941999912261963,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cover","display_name":"Cover (algebra)","score":0.5817974209785461},{"id":"https://openalex.org/keywords/network-topology","display_name":"Network topology","score":0.5614827275276184},{"id":"https://openalex.org/keywords/isolation","display_name":"Isolation (microbiology)","score":0.5437416434288025},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5046471357345581},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.49181774258613586},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4778463542461395},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.47398319840431213},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4189060628414154},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.3754723072052002},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3602452576160431},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.33404654264450073},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.14035511016845703},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.09099873900413513},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.07726821303367615}],"concepts":[{"id":"https://openalex.org/C2780428219","wikidata":"https://www.wikidata.org/wiki/Q16952335","display_name":"Cover (algebra)","level":2,"score":0.5817974209785461},{"id":"https://openalex.org/C199845137","wikidata":"https://www.wikidata.org/wiki/Q145490","display_name":"Network topology","level":2,"score":0.5614827275276184},{"id":"https://openalex.org/C2775941552","wikidata":"https://www.wikidata.org/wiki/Q25212305","display_name":"Isolation (microbiology)","level":2,"score":0.5437416434288025},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5046471357345581},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.49181774258613586},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4778463542461395},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.47398319840431213},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4189060628414154},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.3754723072052002},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3602452576160431},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.33404654264450073},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.14035511016845703},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.09099873900413513},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.07726821303367615},{"id":"https://openalex.org/C89423630","wikidata":"https://www.wikidata.org/wiki/Q7193","display_name":"Microbiology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps48228.2024.10529413","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48228.2024.10529413","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4300000071525574,"display_name":"Climate action","id":"https://metadata.un.org/sdg/13"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W2067541202","https://openalex.org/W2116299747","https://openalex.org/W2621293650","https://openalex.org/W2801616556","https://openalex.org/W3040531896","https://openalex.org/W4200057461","https://openalex.org/W4225317669","https://openalex.org/W4225328371","https://openalex.org/W4319431072","https://openalex.org/W4366377793","https://openalex.org/W4376606738","https://openalex.org/W6636934870"],"related_works":["https://openalex.org/W3014521742","https://openalex.org/W4232403550","https://openalex.org/W623607250","https://openalex.org/W2617868873","https://openalex.org/W3204141294","https://openalex.org/W4245429118","https://openalex.org/W4205110281","https://openalex.org/W4386230336","https://openalex.org/W4212927854","https://openalex.org/W4211151614"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3],"propose":[4],"layout":[5],"guidelines":[6,33],"to":[7],"significantly":[8],"mitigate":[9],"the":[10,24,37,41,79],"charging":[11],"damage":[12],"from":[13,40],"well-side":[14],"antennas":[15],"in":[16,68],"separated":[17],"power":[18],"domains.":[19],"We":[20],"specifically":[21],"focus":[22],"on":[23,36],"circuit":[25],"topologies":[26],"that":[27,44],"consist":[28],"of":[29,48,51],"aggressor-victim":[30],"pairs.":[31],"The":[32,63],"are":[34],"based":[35],"silicon":[38],"data":[39],"test":[42],"patterns":[43],"cover":[45],"adequate":[46],"combinations":[47],"different":[49,60],"geometries":[50],"isolation":[52,80],"wells,":[53],"metals,":[54],"and":[55],"vias,":[56],"as":[57,59,78],"well":[58,61],"configurations.":[62],"method":[64],"has":[65],"been":[66],"verified":[67],"0.13\u00b5m":[69],"BCD":[70],"(Bipolar-CMOS-DMOS)":[71],"process":[72],"using":[73],"NBL":[74],"(N-type":[75],"Buried":[76],"Layer)":[77],"well.":[81]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}