{"id":"https://openalex.org/W4396980778","doi":"https://doi.org/10.1109/irps48228.2024.10529404","title":"Virtual FA Methodology for DRAM: Real-Time Analysis and Risk Assessment Method Using Telemetry","display_name":"Virtual FA Methodology for DRAM: Real-Time Analysis and Risk Assessment Method Using Telemetry","publication_year":2024,"publication_date":"2024-04-14","ids":{"openalex":"https://openalex.org/W4396980778","doi":"https://doi.org/10.1109/irps48228.2024.10529404"},"language":"en","primary_location":{"id":"doi:10.1109/irps48228.2024.10529404","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48228.2024.10529404","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5024241386","display_name":"Jungchul Lee","orcid":"https://orcid.org/0000-0001-7880-8657"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Jungchul Lee","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102666290","display_name":"EC Kwon","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"EC Kwon","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113799254","display_name":"Yoon Sh","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"SH Yoon","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5098670266","display_name":"RG Oh","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"RG Oh","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104302099","display_name":"SY Park","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"SY Park","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113210288","display_name":"SH Youn","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"SH Youn","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111198010","display_name":"KR Choi","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"KR Choi","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028465632","display_name":"T. W. Kim","orcid":"https://orcid.org/0009-0005-0859-2447"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"TW Kim","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114018369","display_name":"Kim Mc","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"MC Kim","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103906988","display_name":"JH Park","orcid":"https://orcid.org/0009-0001-2384-9918"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"JH Park","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102666289","display_name":"YW Ko","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"YW Ko","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114161705","display_name":"YD Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"YD Kim","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108930084","display_name":"J.H. Moon","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"JS Moon","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020399268","display_name":"H.-C. Park","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"HA Park","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108930085","display_name":"KO Hong","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"KO Hong","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101355147","display_name":"JY Yang","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"JY Yang","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113505168","display_name":"J.B. Yoon","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"JY Yoon","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114161706","display_name":"J. S. Yoon","orcid":"https://orcid.org/0000-0002-4393-5258"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"JM Yoon","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100592232","display_name":"JM Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"JM Lee","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063718436","display_name":"Jae\u2010Hoon Kim","orcid":"https://orcid.org/0000-0001-6599-7065"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"JH Kim","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113210287","display_name":"HY Yoo","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"HY Yoo","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108112838","display_name":"SJ Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sj Kim","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113046461","display_name":"NH Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"NH Lee","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028685974","display_name":"Seng Hua Lee","orcid":"https://orcid.org/0000-0001-6369-9902"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"SH Lee","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113209390","display_name":"KS. Kwon","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"KS Kwon","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108930086","display_name":"IG Jung","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"IG Jung","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072736104","display_name":"Yung Seng Lee","orcid":"https://orcid.org/0000-0002-1253-0557"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"YS Lee","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063718436","display_name":"Jae\u2010Hoon Kim","orcid":"https://orcid.org/0000-0001-6599-7065"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"JH Kim","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5010124316","display_name":"Sangwoo Pae","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sangwoo Pae","raw_affiliation_strings":["Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Co., Ltd.,Memory Division,Hwa-seong si,Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":29,"corresponding_author_ids":["https://openalex.org/A5024241386"],"corresponding_institution_ids":["https://openalex.org/I2250650973"],"apc_list":null,"apc_paid":null,"fwci":0.4439,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.60541766,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9869999885559082,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/telemetry","display_name":"Telemetry","score":0.9003322124481201},{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.7811746597290039},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6864073872566223},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4016353487968445},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3411332964897156},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1884860098361969},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1693909764289856},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.16467276215553284}],"concepts":[{"id":"https://openalex.org/C183121708","wikidata":"https://www.wikidata.org/wiki/Q209867","display_name":"Telemetry","level":2,"score":0.9003322124481201},{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.7811746597290039},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6864073872566223},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4016353487968445},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3411332964897156},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1884860098361969},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1693909764289856},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.16467276215553284}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps48228.2024.10529404","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48228.2024.10529404","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Climate action","score":0.44999998807907104,"id":"https://metadata.un.org/sdg/13"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1989062952","https://openalex.org/W2290195878","https://openalex.org/W3004493283","https://openalex.org/W4229595138","https://openalex.org/W4376606729"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2748952813","https://openalex.org/W2070863773","https://openalex.org/W4212896802","https://openalex.org/W2056771637","https://openalex.org/W748047311","https://openalex.org/W2359918844","https://openalex.org/W4298110012","https://openalex.org/W2519661158","https://openalex.org/W3120961607"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"Virtual":[3],"FA,":[4],"an":[5],"innovative":[6],"approach":[7],"to":[8,82],"enhance":[9],"the":[10],"DRAM":[11,55],"production":[12,84],"quality":[13,18,60,85,90],"in":[14,19,86,91],"Samsung":[15,87],"and":[16,34,43,47,59,73,79,88],"field":[17,89],"customers.":[20],"By":[21],"leveraging":[22],"telemetry":[23],"data":[24],"from":[25],"customer":[26],"deployment":[27],"fleet,":[28],"our":[29],"method":[30],"classifies":[31],"failure":[32,71],"types":[33,72],"perform":[35],"risk":[36],"assessment":[37],"without":[38],"physical":[39],"analysis,":[40],"enabling":[41],"swift":[42],"effective":[44],"issue":[45],"identification":[46],"resolution.":[48],"The":[49],"study,":[50],"involving":[51],"several":[52],"experts":[53],"across":[54,76],"design,":[56],"process,":[57],"assembly,":[58],"team,":[61],"targeted":[62],"15nm":[63],"DDR4":[64],"products.":[65],"With":[66],"vFA,":[67],"we":[68],"accurately":[69],"categorized":[70],"determined":[74],"risks":[75],"all":[77],"products":[78],"cases,":[80],"leading":[81],"improved":[83],"customers":[92],"with":[93],"timely":[94],"feedback.":[95]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1}],"updated_date":"2025-12-21T01:58:51.020947","created_date":"2025-10-10T00:00:00"}