{"id":"https://openalex.org/W4396949273","doi":"https://doi.org/10.1109/irps48228.2024.10529391","title":"Study of Thermomechanical Damage Mechanism in Al Interconnects in Al-SiO2 structure by High Density Peak Current","display_name":"Study of Thermomechanical Damage Mechanism in Al Interconnects in Al-SiO2 structure by High Density Peak Current","publication_year":2024,"publication_date":"2024-04-14","ids":{"openalex":"https://openalex.org/W4396949273","doi":"https://doi.org/10.1109/irps48228.2024.10529391"},"language":"en","primary_location":{"id":"doi:10.1109/irps48228.2024.10529391","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48228.2024.10529391","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5092590869","display_name":"Hariram Mohanram","orcid":null},"institutions":[{"id":"https://openalex.org/I189196454","display_name":"The University of Texas at Arlington","ror":"https://ror.org/019kgqr73","country_code":"US","type":"education","lineage":["https://openalex.org/I189196454"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Hariram Mohanram","raw_affiliation_strings":["University of Texas at Arlington,Arlington,Texas,76019"],"affiliations":[{"raw_affiliation_string":"University of Texas at Arlington,Arlington,Texas,76019","institution_ids":["https://openalex.org/I189196454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5098660435","display_name":"Harikrishnan Kumarasamy","orcid":null},"institutions":[{"id":"https://openalex.org/I189196454","display_name":"The University of Texas at Arlington","ror":"https://ror.org/019kgqr73","country_code":"US","type":"education","lineage":["https://openalex.org/I189196454"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Harikrishnan Kumarasamy","raw_affiliation_strings":["University of Texas at Arlington,Arlington,Texas,76019"],"affiliations":[{"raw_affiliation_string":"University of Texas at Arlington,Arlington,Texas,76019","institution_ids":["https://openalex.org/I189196454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084793487","display_name":"Choong-Un Kim","orcid":"https://orcid.org/0000-0002-3678-9539"},"institutions":[{"id":"https://openalex.org/I189196454","display_name":"The University of Texas at Arlington","ror":"https://ror.org/019kgqr73","country_code":"US","type":"education","lineage":["https://openalex.org/I189196454"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Choong-Un Kim","raw_affiliation_strings":["University of Texas at Arlington,Arlington,Texas,76019"],"affiliations":[{"raw_affiliation_string":"University of Texas at Arlington,Arlington,Texas,76019","institution_ids":["https://openalex.org/I189196454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101895184","display_name":"Young-Joon Park","orcid":"https://orcid.org/0000-0003-1137-6225"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Young-Joon Park","raw_affiliation_strings":["Texas Instruments, Inc,Dallas,Texas,75243"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc,Dallas,Texas,75243","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5032818658","display_name":"S. Krishnan","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Srikanth Krishnan","raw_affiliation_strings":["Texas Instruments, Inc,Dallas,Texas,75243"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc,Dallas,Texas,75243","institution_ids":["https://openalex.org/I74760111"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5092590869"],"corresponding_institution_ids":["https://openalex.org/I189196454"],"apc_list":null,"apc_paid":null,"fwci":0.4439,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.6051508,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10717","display_name":"Aluminum Alloys Composites Properties","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/current","display_name":"Current (fluid)","score":0.6557838916778564},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5870206952095032},{"id":"https://openalex.org/keywords/mechanism","display_name":"Mechanism (biology)","score":0.5509369969367981},{"id":"https://openalex.org/keywords/current-density","display_name":"Current density","score":0.5422613620758057},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4420965909957886},{"id":"https://openalex.org/keywords/engineering-physics","display_name":"Engineering physics","score":0.3731003403663635},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.294564425945282},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12435975670814514},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1050364077091217}],"concepts":[{"id":"https://openalex.org/C148043351","wikidata":"https://www.wikidata.org/wiki/Q4456944","display_name":"Current (fluid)","level":2,"score":0.6557838916778564},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5870206952095032},{"id":"https://openalex.org/C89611455","wikidata":"https://www.wikidata.org/wiki/Q6804646","display_name":"Mechanism (biology)","level":2,"score":0.5509369969367981},{"id":"https://openalex.org/C207740977","wikidata":"https://www.wikidata.org/wiki/Q234072","display_name":"Current density","level":2,"score":0.5422613620758057},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4420965909957886},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3731003403663635},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.294564425945282},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12435975670814514},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1050364077091217},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps48228.2024.10529391","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48228.2024.10529391","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G7646307385","display_name":null,"funder_award_id":"3179.001","funder_id":"https://openalex.org/F4320306087","funder_display_name":"Semiconductor Research Corporation"}],"funders":[{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1966404162","https://openalex.org/W1986663717","https://openalex.org/W2080929803","https://openalex.org/W2998182209","https://openalex.org/W3040665813","https://openalex.org/W3081178685"],"related_works":["https://openalex.org/W2382997850","https://openalex.org/W2390968135","https://openalex.org/W2382213751","https://openalex.org/W2006863447","https://openalex.org/W2537886641","https://openalex.org/W2130876290","https://openalex.org/W3008717980","https://openalex.org/W2077156177","https://openalex.org/W2084159017","https://openalex.org/W2611979962"],"abstract_inverted_index":{"This":[0,26],"paper":[1],"concerns":[2],"the":[3,32,67,131,156,167,178,193,206,221,261],"damage":[4,27,266],"mechanism":[5,28,68,214],"of":[6,20,31,141,152,158,173,199,263],"Al":[7,72,112,136,200,229,250],"interconnects":[8,73],"induced":[9],"by":[10,143],"thermomechanical":[11],"load":[12],"due":[13,129],"to":[14,17,59,92,116,130,148,210,217,220,234,253],"a":[15,79,86,117,236],"exposure":[16],"short":[18],"bursts":[19],"high-density":[21],"electric":[22],"current":[23,96,145],"in":[24,49,75,192,228,273],"repetition.":[25],"is":[29,114],"one":[30],"emerging":[33],"reliability":[34],"challenges":[35],"and":[36,51,63,137,225],"has":[37],"been":[38,45],"under":[39,126],"significant":[40],"concern":[41],"while":[42,246],"studies":[43],"have":[44,56,254],"limited":[46],"with":[47,98,190],"difficulties":[48],"testing":[50],"related":[52,219],"analysis.":[53],"Our":[54,107,258],"efforts":[55],"enabled":[57],"us":[58],"conduct":[60],"both":[61],"experimental":[62],"numerical":[64,108],"investigations":[65],"on":[66,155],"using":[69],"standard":[70],"2-level":[71],"patterned":[74],"Si":[76],"substate":[77],"as":[78,164,166,267,269],"model":[80],"structure.":[81],"To":[82],"enable":[83],"effective":[84],"testing,":[85],"pulse":[87,181],"generator":[88],"circuit":[89],"was":[90,146,175,182,188,215],"developed":[91],"produce":[93],"microsecond":[94],"bipolar":[95],"pulses":[97],"sufficiently":[99],"long":[100],"\u201coff\u201d":[101],"duration":[102],"for":[103],"complete":[104],"heat":[105],"dissipation.":[106],"analysis":[109],"finds":[110],"that":[111],"interconnect":[113,168],"subjected":[115],"temperature":[118],"spike":[119],"during":[120,161],"\u201con\u201d":[121,162],"period,":[122],"forcing":[123],"it":[124],"be":[125,218],"thermal":[127,132],"stress":[128,142],"expansion":[133],"mismatch":[134],"between":[135],"SiO2.":[138],"The":[139,170,186,213],"repetition":[140],"pulsing":[144],"found":[147,176,216],"induce":[149],"two":[150],"types":[151],"failure/damage":[153,207],"depending":[154],"level":[157],"input":[159],"power":[160,179,204],"period":[163],"well":[165,268],"dimensions.":[169],"first":[171],"mode":[172,208],"damage/failure":[174],"when":[177],"per":[180],"at":[183],"excessive":[184],"level.":[185],"failure":[187,244],"associated":[189],"cracking":[191],"dielectric":[194],"layer":[195],"through":[196],"which":[197,240],"extrusion":[198],"occurred.":[201],"At":[202],"lower":[203],"level,":[205],"changed":[209],"crack/void":[211],"formation.":[212],"repeated":[222],"plastic":[223],"deformation,":[224],"thus":[226],"fatigue":[227,237,243],"interconnects.":[230],"Interestingly,":[231],"there":[232],"seems":[233],"exist":[235],"limit,":[238],"below":[239],"load,":[241],"no":[242,255],"develops":[245],"soft":[247],"metals":[248],"like":[249],"are":[251],"known":[252],"such":[256],"limit.":[257],"findings":[259],"highlight":[260],"danger":[262],"surge":[264],"current-driven":[265],"possible":[270],"mitigation":[271],"strategies":[272],"advanced":[274],"packaging":[275],"design.":[276]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1}],"updated_date":"2025-12-26T23:08:49.675405","created_date":"2025-10-10T00:00:00"}