{"id":"https://openalex.org/W4225295317","doi":"https://doi.org/10.1109/irps48227.2022.9764452","title":"Nanoscale Analysis of Breakdown Induced Crack Propagation in DTSCR Devices","display_name":"Nanoscale Analysis of Breakdown Induced Crack Propagation in DTSCR Devices","publication_year":2022,"publication_date":"2022-03-01","ids":{"openalex":"https://openalex.org/W4225295317","doi":"https://doi.org/10.1109/irps48227.2022.9764452"},"language":"en","primary_location":{"id":"doi:10.1109/irps48227.2022.9764452","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48227.2022.9764452","pdf_url":null,"source":{"id":"https://openalex.org/S4363605693","display_name":"2022 IEEE International Reliability Physics Symposium (IRPS)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102974446","display_name":"Xinqian Chen","orcid":"https://orcid.org/0000-0002-8570-8985"},"institutions":[{"id":"https://openalex.org/I66867065","display_name":"East China Normal University","ror":"https://ror.org/02n96ep67","country_code":"CN","type":"education","lineage":["https://openalex.org/I66867065"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xinqian Chen","raw_affiliation_strings":["East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","institution_ids":["https://openalex.org/I66867065"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China","institution_ids":["https://openalex.org/I66867065"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001052471","display_name":"Fei Hou","orcid":"https://orcid.org/0000-0001-8226-6635"},"institutions":[{"id":"https://openalex.org/I4210125143","display_name":"Chengdu University","ror":"https://ror.org/034z67559","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210125143"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fei Hou","raw_affiliation_strings":["Chengdu University,School of Electronic Information and Electrical Engineering,Chengdu,China","School of Electronic Information and Electrical Engineering, Chengdu University, Chengdu, China"],"affiliations":[{"raw_affiliation_string":"Chengdu University,School of Electronic Information and Electrical Engineering,Chengdu,China","institution_ids":["https://openalex.org/I4210125143"]},{"raw_affiliation_string":"School of Electronic Information and Electrical Engineering, Chengdu University, Chengdu, China","institution_ids":["https://openalex.org/I4210125143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087298747","display_name":"Zuoyuan Dong","orcid":"https://orcid.org/0000-0003-4441-649X"},"institutions":[{"id":"https://openalex.org/I66867065","display_name":"East China Normal University","ror":"https://ror.org/02n96ep67","country_code":"CN","type":"education","lineage":["https://openalex.org/I66867065"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zuoyuan Dong","raw_affiliation_strings":["East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","institution_ids":["https://openalex.org/I66867065"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China","institution_ids":["https://openalex.org/I66867065"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100398025","display_name":"Yuxin Zhang","orcid":"https://orcid.org/0000-0002-2587-5239"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuxin Zhang","raw_affiliation_strings":["University of Electronic Science and Technology of China,Center for Advanced Semiconductor & Integrated Micro-System,Chengdu,China"],"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,Center for Advanced Semiconductor & Integrated Micro-System,Chengdu,China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020836818","display_name":"Chaolun Wang","orcid":"https://orcid.org/0000-0002-2730-7614"},"institutions":[{"id":"https://openalex.org/I66867065","display_name":"East China Normal University","ror":"https://ror.org/02n96ep67","country_code":"CN","type":"education","lineage":["https://openalex.org/I66867065"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chaolun Wang","raw_affiliation_strings":["East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","institution_ids":["https://openalex.org/I66867065"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China","institution_ids":["https://openalex.org/I66867065"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103047540","display_name":"Fang Liang","orcid":"https://orcid.org/0000-0003-4893-5967"},"institutions":[{"id":"https://openalex.org/I66867065","display_name":"East China Normal University","ror":"https://ror.org/02n96ep67","country_code":"CN","type":"education","lineage":["https://openalex.org/I66867065"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fang Liang","raw_affiliation_strings":["East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","institution_ids":["https://openalex.org/I66867065"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China","institution_ids":["https://openalex.org/I66867065"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053995503","display_name":"Feibo Du","orcid":"https://orcid.org/0000-0001-8622-2429"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Feibo Du","raw_affiliation_strings":["University of Electronic Science and Technology of China,Center for Advanced Semiconductor & Integrated Micro-System,Chengdu,China"],"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,Center for Advanced Semiconductor & Integrated Micro-System,Chengdu,China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100321245","display_name":"Zhiwei Liu","orcid":"https://orcid.org/0000-0003-0805-5930"},"institutions":[{"id":"https://openalex.org/I66867065","display_name":"East China Normal University","ror":"https://ror.org/02n96ep67","country_code":"CN","type":"education","lineage":["https://openalex.org/I66867065"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhiwei Liu","raw_affiliation_strings":["East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","institution_ids":["https://openalex.org/I66867065"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China","institution_ids":["https://openalex.org/I66867065"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5112849573","display_name":"Xing Wu","orcid":"https://orcid.org/0000-0001-5876-2620"},"institutions":[{"id":"https://openalex.org/I66867065","display_name":"East China Normal University","ror":"https://ror.org/02n96ep67","country_code":"CN","type":"education","lineage":["https://openalex.org/I66867065"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xing Wu","raw_affiliation_strings":["East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"East China Normal University,Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering,Shanghai,China","institution_ids":["https://openalex.org/I66867065"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Multidimensional Information Processing, School of Communication and Electronic Engineering, East China Normal University, Shanghai, China","institution_ids":["https://openalex.org/I66867065"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5102974446"],"corresponding_institution_ids":["https://openalex.org/I66867065"],"apc_list":null,"apc_paid":null,"fwci":0.9667,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.66147044,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electrostatic-discharge","display_name":"Electrostatic discharge","score":0.8146843910217285},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7770744562149048},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5842041969299316},{"id":"https://openalex.org/keywords/nanoscopic-scale","display_name":"Nanoscopic scale","score":0.5745766162872314},{"id":"https://openalex.org/keywords/diode","display_name":"Diode","score":0.5530433058738708},{"id":"https://openalex.org/keywords/breakdown-voltage","display_name":"Breakdown voltage","score":0.5190094709396362},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.48458731174468994},{"id":"https://openalex.org/keywords/leakage","display_name":"Leakage (economics)","score":0.4839916229248047},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.48171764612197876},{"id":"https://openalex.org/keywords/transmission-electron-microscopy","display_name":"Transmission electron microscopy","score":0.44425278902053833},{"id":"https://openalex.org/keywords/transmission-line","display_name":"Transmission line","score":0.42294448614120483},{"id":"https://openalex.org/keywords/transient","display_name":"Transient (computer programming)","score":0.417512446641922},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.39930716156959534},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.29564642906188965},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.17448872327804565},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.16323184967041016},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12172272801399231}],"concepts":[{"id":"https://openalex.org/C205483674","wikidata":"https://www.wikidata.org/wiki/Q3574961","display_name":"Electrostatic discharge","level":3,"score":0.8146843910217285},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7770744562149048},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5842041969299316},{"id":"https://openalex.org/C45206210","wikidata":"https://www.wikidata.org/wiki/Q2415817","display_name":"Nanoscopic scale","level":2,"score":0.5745766162872314},{"id":"https://openalex.org/C78434282","wikidata":"https://www.wikidata.org/wiki/Q11656","display_name":"Diode","level":2,"score":0.5530433058738708},{"id":"https://openalex.org/C119321828","wikidata":"https://www.wikidata.org/wiki/Q1267190","display_name":"Breakdown voltage","level":3,"score":0.5190094709396362},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.48458731174468994},{"id":"https://openalex.org/C2777042071","wikidata":"https://www.wikidata.org/wiki/Q6509304","display_name":"Leakage (economics)","level":2,"score":0.4839916229248047},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.48171764612197876},{"id":"https://openalex.org/C146088050","wikidata":"https://www.wikidata.org/wiki/Q744818","display_name":"Transmission electron microscopy","level":2,"score":0.44425278902053833},{"id":"https://openalex.org/C33441834","wikidata":"https://www.wikidata.org/wiki/Q693004","display_name":"Transmission line","level":2,"score":0.42294448614120483},{"id":"https://openalex.org/C2780799671","wikidata":"https://www.wikidata.org/wiki/Q17087362","display_name":"Transient (computer programming)","level":2,"score":0.417512446641922},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.39930716156959534},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.29564642906188965},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.17448872327804565},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.16323184967041016},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12172272801399231},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps48227.2022.9764452","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48227.2022.9764452","pdf_url":null,"source":{"id":"https://openalex.org/S4363605693","display_name":"2022 IEEE International Reliability Physics Symposium (IRPS)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.47999998927116394}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1524944995","https://openalex.org/W1589026312","https://openalex.org/W2113796903","https://openalex.org/W2135978993","https://openalex.org/W2494861250","https://openalex.org/W3003810946","https://openalex.org/W3010335491","https://openalex.org/W3130777201","https://openalex.org/W3161841128","https://openalex.org/W3214369605","https://openalex.org/W3216381334"],"related_works":["https://openalex.org/W2124694210","https://openalex.org/W2153609444","https://openalex.org/W2544244340","https://openalex.org/W3160715487","https://openalex.org/W1482270496","https://openalex.org/W2157426934","https://openalex.org/W2533798643","https://openalex.org/W1524410551","https://openalex.org/W2103831524","https://openalex.org/W2070456298"],"abstract_inverted_index":{"In":[0],"the":[1,7,65,80,101],"advanced":[2],"technology":[3],"process,":[4],"owing":[5],"to":[6,99],"low":[8],"and":[9,83],"tunable":[10],"trigger":[11],"voltage,":[12],"diode-triggered":[13],"SCRs":[14],"(DTSCRs)":[15],"are":[16],"widely":[17],"used":[18],"in":[19,47,73],"low-voltage":[20],"applications":[21],"with":[22,36],"extremely":[23],"narrow":[24],"electrostatic":[25],"discharge":[26],"(ESD)":[27],"design":[28],"margins.":[29],"The":[30,50,62],"breakdown":[31,102],"of":[32,53,64,69],"DTSCRs":[33,54],"ESD":[34],"structure":[35,81],"abnormal":[37],"leakage":[38],"current":[39],"under":[40],"transmission":[41,88],"line":[42],"pulsing":[43],"stressing":[44],"was":[45],"studied":[46],"this":[48],"work.":[49],"physical":[51],"origins":[52],"have":[55],"been":[56],"established":[57],"through":[58],"failure":[59],"analysis":[60],"(FA).":[61],"mismatch":[63],"thermal":[66],"expansion":[67],"coefficient":[68],"local":[70],"materials":[71],"results":[72],"redundant":[74,77],"stress.":[75],"Such":[76],"stress":[78],"induce":[79],"dislocations":[82],"cracks":[84],"were":[85],"captured":[86],"by":[87],"electron":[89],"microscopy":[90],"at":[91],"atomic":[92],"scale.":[93],"A":[94],"multi-physical":[95],"simulation":[96],"is":[97],"conducted":[98],"scrutinize":[100],"transient":[103],"process.":[104]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}