{"id":"https://openalex.org/W4410395241","doi":"https://doi.org/10.1109/irps48204.2025.10983902","title":"Record-Low EOT(3.6\u00c5) &amp; J<sub>leak</sub>(7\u00d710<sup>-8</sup>A/cm<sup>2</sup>@0.8V) HZO by Dielectric-Selective Microwave Annealing","display_name":"Record-Low EOT(3.6\u00c5) &amp; J<sub>leak</sub>(7\u00d710<sup>-8</sup>A/cm<sup>2</sup>@0.8V) HZO by Dielectric-Selective Microwave Annealing","publication_year":2025,"publication_date":"2025-03-30","ids":{"openalex":"https://openalex.org/W4410395241","doi":"https://doi.org/10.1109/irps48204.2025.10983902"},"language":"en","primary_location":{"id":"doi:10.1109/irps48204.2025.10983902","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48204.2025.10983902","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034095384","display_name":"Hunbeom Shin","orcid":"https://orcid.org/0000-0001-5751-7973"},"institutions":[{"id":"https://openalex.org/I119522612","display_name":"Daejeon University","ror":"https://ror.org/02eqchk86","country_code":"KR","type":"education","lineage":["https://openalex.org/I119522612"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hunbeom Shin","raw_affiliation_strings":["School of Electrical Engineering,Daejeon,Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering,Daejeon,Korea","institution_ids":["https://openalex.org/I119522612"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026532823","display_name":"Giuk Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I119522612","display_name":"Daejeon University","ror":"https://ror.org/02eqchk86","country_code":"KR","type":"education","lineage":["https://openalex.org/I119522612"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Giuk Kim","raw_affiliation_strings":["School of Electrical Engineering,Daejeon,Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering,Daejeon,Korea","institution_ids":["https://openalex.org/I119522612"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101929012","display_name":"Sujeong Lee","orcid":"https://orcid.org/0000-0002-4039-621X"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sujeong Lee","raw_affiliation_strings":["Graduate School of Semiconductor Technology, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of Semiconductor Technology, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108929247","display_name":"Geonhyeong Kang","orcid":null},"institutions":[{"id":"https://openalex.org/I119522612","display_name":"Daejeon University","ror":"https://ror.org/02eqchk86","country_code":"KR","type":"education","lineage":["https://openalex.org/I119522612"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Geonhyeong Kang","raw_affiliation_strings":["School of Electrical Engineering,Daejeon,Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering,Daejeon,Korea","institution_ids":["https://openalex.org/I119522612"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003020623","display_name":"Hyojun Choi","orcid":"https://orcid.org/0009-0006-3462-6759"},"institutions":[{"id":"https://openalex.org/I119522612","display_name":"Daejeon University","ror":"https://ror.org/02eqchk86","country_code":"KR","type":"education","lineage":["https://openalex.org/I119522612"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyojun Choi","raw_affiliation_strings":["School of Electrical Engineering,Daejeon,Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering,Daejeon,Korea","institution_ids":["https://openalex.org/I119522612"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082230273","display_name":"Taeseung Jung","orcid":"https://orcid.org/0000-0002-1212-4305"},"institutions":[{"id":"https://openalex.org/I119522612","display_name":"Daejeon University","ror":"https://ror.org/02eqchk86","country_code":"KR","type":"education","lineage":["https://openalex.org/I119522612"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Taeseung Jung","raw_affiliation_strings":["School of Electrical Engineering,Daejeon,Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering,Daejeon,Korea","institution_ids":["https://openalex.org/I119522612"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029046108","display_name":"Sanghun Jeon","orcid":"https://orcid.org/0000-0002-4222-1587"},"institutions":[{"id":"https://openalex.org/I119522612","display_name":"Daejeon University","ror":"https://ror.org/02eqchk86","country_code":"KR","type":"education","lineage":["https://openalex.org/I119522612"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sanghun Jeon","raw_affiliation_strings":["School of Electrical Engineering,Daejeon,Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering,Daejeon,Korea","institution_ids":["https://openalex.org/I119522612"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100388391","display_name":"Hyungjun Kim","orcid":"https://orcid.org/0000-0003-2256-8046"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyung-Jun Kim","raw_affiliation_strings":["Samsung Advanced Institute of Technology (SAIT), Samsung Electronics Co., Ltd,Suwon,Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Samsung Advanced Institute of Technology (SAIT), Samsung Electronics Co., Ltd,Suwon,Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058197414","display_name":"Junho Ahn","orcid":"https://orcid.org/0000-0002-1903-0248"},"institutions":[{"id":"https://openalex.org/I4575257","display_name":"Hanyang University","ror":"https://ror.org/046865y68","country_code":"KR","type":"education","lineage":["https://openalex.org/I4575257"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jinho Ahn","raw_affiliation_strings":["Hanyang University,Division of Materials Science and Engineering,Seoul,Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hanyang University,Division of Materials Science and Engineering,Seoul,Korea","institution_ids":["https://openalex.org/I4575257"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.99,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.88664617,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9362999796867371,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9362999796867371,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.7543343305587769},{"id":"https://openalex.org/keywords/microwave","display_name":"Microwave","score":0.7091367840766907},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.6957163214683533},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6310915350914001},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4684063792228699},{"id":"https://openalex.org/keywords/analytical-chemistry","display_name":"Analytical Chemistry (journal)","score":0.4512993395328522},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.20097115635871887},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.14258232712745667},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.09233298897743225},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.06797614693641663}],"concepts":[{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.7543343305587769},{"id":"https://openalex.org/C44838205","wikidata":"https://www.wikidata.org/wiki/Q127995","display_name":"Microwave","level":2,"score":0.7091367840766907},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.6957163214683533},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6310915350914001},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4684063792228699},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.4512993395328522},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.20097115635871887},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.14258232712745667},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.09233298897743225},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.06797614693641663},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps48204.2025.10983902","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48204.2025.10983902","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.6200000047683716}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W2058571189","https://openalex.org/W2061738465","https://openalex.org/W2326666341","https://openalex.org/W2625135835","https://openalex.org/W2900507180","https://openalex.org/W2904840622","https://openalex.org/W3014354503","https://openalex.org/W3202406557","https://openalex.org/W4221025951","https://openalex.org/W4226068788","https://openalex.org/W4296025957","https://openalex.org/W4307965995","https://openalex.org/W4366176067","https://openalex.org/W4385192512","https://openalex.org/W4386225363","https://openalex.org/W4389104947","https://openalex.org/W4396902164","https://openalex.org/W4401879598"],"related_works":["https://openalex.org/W2053668343","https://openalex.org/W2076353393","https://openalex.org/W2362940819","https://openalex.org/W2086745820","https://openalex.org/W1908385343","https://openalex.org/W2061413604","https://openalex.org/W1620532008","https://openalex.org/W2334225663","https://openalex.org/W2607335390","https://openalex.org/W1549119392"],"abstract_inverted_index":{"In":[0],"this":[1,120],"work,":[2],"we":[3],"present":[4],"HZO":[5,42,77,88,108],"film":[6,78],"near":[7],"the":[8,38,76,81,85,104,134],"morphotropic":[9],"phase":[10],"boundary":[11],"(MPB)":[12],"with":[13],"an":[14],"EOT":[15],"of":[16],"3.6":[17],"\u00c5":[18],"and":[19,47,66,79,93,140],"a":[20,30],"low":[21],"leakage":[22],"current":[23],"density":[24],"(Jleak@":[25],"0.8":[26],"V)":[27],"of$\\mathrm{J}_{\\text{leak}}(7.0\\times":[28],"10^{-8}\\mathrm{A}/\\text{cm}^{2}{@}$using":[29],"microwave":[31,48],"annealing":[32,95,115],"(MWA)":[33],"system.":[34],"The":[35],"MWA":[36],"supplies":[37],"energy":[39,124],"required":[40],"for":[41,107,138,143],"crystallization":[43,109],"in":[44,96],"both":[45],"thermal":[46,58,114],"forms,":[49],"offering":[50],"three":[51],"key":[52],"benefits:":[53],"(i)":[54],"It":[55,73,102],"drastically":[56],"reduces":[57],"budget":[59],"(TB),":[60],"suppresses":[61],"interfacial":[62],"dead":[63],"layer":[64],"formation,":[65],"enhances":[67],"endurance":[68],"($\\mathrm{K}\\sim":[69],"62$at":[70],"1012cycles).":[71],"(ii)":[72],"only":[74],"affects":[75],"not":[80],"TiN":[82],"electrodes,":[83],"making":[84],"dipoles":[86],"inside":[87],"vibrate.":[89],"This":[90],"enables":[91],"selective":[92],"volumetric":[94],"high-aspect-ratio":[97],"DRAM":[98],"cell":[99],"capacitors.":[100],"(iii)":[101],"lowers":[103],"activation":[105,123],"barrier":[106],"compared":[110],"to":[111],"typical":[112],"rapid":[113],"(RTA).":[116],"We":[117],"experimentally":[118],"verified":[119],"by":[121],"quantifying":[122],"(Ea)":[125],"using":[126],"electrical":[127],"measurements":[128],"under":[129],"various":[130],"TBs,":[131],"finding":[132],"that":[133],"Eawas":[135],"0.67":[136],"eV/f.u.":[137,142],"MWA,":[139],"0.85":[141],"RTA.":[144]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}