{"id":"https://openalex.org/W4410395036","doi":"https://doi.org/10.1109/irps48204.2025.10983478","title":"Comprehensive Reliability Assessment of WO<sub>x</sub> Engineering for Temperature-Resilient HfZrO<sub>2</sub> FeCAP","display_name":"Comprehensive Reliability Assessment of WO<sub>x</sub> Engineering for Temperature-Resilient HfZrO<sub>2</sub> FeCAP","publication_year":2025,"publication_date":"2025-03-30","ids":{"openalex":"https://openalex.org/W4410395036","doi":"https://doi.org/10.1109/irps48204.2025.10983478"},"language":"en","primary_location":{"id":"doi:10.1109/irps48204.2025.10983478","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48204.2025.10983478","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100462736","display_name":"Eunjin Kim","orcid":"https://orcid.org/0000-0002-2309-4420"},"institutions":[{"id":"https://openalex.org/I31419693","display_name":"Kyungpook National University","ror":"https://ror.org/040c17130","country_code":"KR","type":"education","lineage":["https://openalex.org/I31419693"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Eunjin Kim","raw_affiliation_strings":["School of Electronic and Electrical Engineering, Kyungpook National University,Daegu,South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic and Electrical Engineering, Kyungpook National University,Daegu,South Korea","institution_ids":["https://openalex.org/I31419693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102931835","display_name":"Hyoungjin Park","orcid":"https://orcid.org/0009-0009-9621-1147"},"institutions":[{"id":"https://openalex.org/I31419693","display_name":"Kyungpook National University","ror":"https://ror.org/040c17130","country_code":"KR","type":"education","lineage":["https://openalex.org/I31419693"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyoungjin Park","raw_affiliation_strings":["School of Electronic and Electrical Engineering, Kyungpook National University,Daegu,South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic and Electrical Engineering, Kyungpook National University,Daegu,South Korea","institution_ids":["https://openalex.org/I31419693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109794693","display_name":"Jiae Jeong","orcid":null},"institutions":[{"id":"https://openalex.org/I31419693","display_name":"Kyungpook National University","ror":"https://ror.org/040c17130","country_code":"KR","type":"education","lineage":["https://openalex.org/I31419693"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jiae Jeong","raw_affiliation_strings":["School of Electronic and Electrical Engineering, Kyungpook National University,Daegu,South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic and Electrical Engineering, Kyungpook National University,Daegu,South Korea","institution_ids":["https://openalex.org/I31419693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085871216","display_name":"Seokjae Lim","orcid":"https://orcid.org/0000-0002-9592-1528"},"institutions":[{"id":"https://openalex.org/I31419693","display_name":"Kyungpook National University","ror":"https://ror.org/040c17130","country_code":"KR","type":"education","lineage":["https://openalex.org/I31419693"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seokjae Lim","raw_affiliation_strings":["School of Electronic and Electrical Engineering, Kyungpook National University,Daegu,South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic and Electrical Engineering, Kyungpook National University,Daegu,South Korea","institution_ids":["https://openalex.org/I31419693"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5054661954","display_name":"Jiyong Woo","orcid":"https://orcid.org/0000-0002-4968-6985"},"institutions":[{"id":"https://openalex.org/I31419693","display_name":"Kyungpook National University","ror":"https://ror.org/040c17130","country_code":"KR","type":"education","lineage":["https://openalex.org/I31419693"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jiyong Woo","raw_affiliation_strings":["School of Electronic and Electrical Engineering, Kyungpook National University,Daegu,South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic and Electrical Engineering, Kyungpook National University,Daegu,South Korea","institution_ids":["https://openalex.org/I31419693"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I31419693"],"apc_list":null,"apc_paid":null,"fwci":6.9408,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.95596706,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":95,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9832000136375427,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9832000136375427,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11128","display_name":"Transition Metal Oxide Nanomaterials","score":0.9735000133514404,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11850","display_name":"Concrete Corrosion and Durability","score":0.9617999792098999,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7122163772583008},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5972654223442078},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.4626532196998596},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.42187392711639404},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.41145840287208557},{"id":"https://openalex.org/keywords/environmental-science","display_name":"Environmental science","score":0.35807135701179504},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2646552324295044},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.13512271642684937},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.12141692638397217}],"concepts":[{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7122163772583008},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5972654223442078},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.4626532196998596},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.42187392711639404},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.41145840287208557},{"id":"https://openalex.org/C39432304","wikidata":"https://www.wikidata.org/wiki/Q188847","display_name":"Environmental science","level":0,"score":0.35807135701179504},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2646552324295044},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.13512271642684937},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.12141692638397217},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps48204.2025.10983478","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48204.2025.10983478","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1894289757","https://openalex.org/W2346962696","https://openalex.org/W4281717358","https://openalex.org/W4385723309","https://openalex.org/W4391912962","https://openalex.org/W4396949993","https://openalex.org/W4404609036","https://openalex.org/W4407691871"],"related_works":["https://openalex.org/W2033512842","https://openalex.org/W4233600955","https://openalex.org/W4322734194","https://openalex.org/W3116237489","https://openalex.org/W4404996554","https://openalex.org/W2913665393","https://openalex.org/W2369695847","https://openalex.org/W3005535424","https://openalex.org/W2994319598","https://openalex.org/W2047067935"],"abstract_inverted_index":{"HfZrO2(HZO)":[0],"ferroelectric":[1,101],"capacitors":[2],"(FeCAPs)":[3],"for":[4,115],"non-volatile":[5],"memory":[6],"are":[7,64],"typically":[8],"formed":[9],"on":[10],"the":[11,56,69,95,105,134],"W-plug":[12],"bottom":[13],"electrode":[14],"(BE).":[15],"We":[16],"present":[17],"direct":[18],"evidence":[19],"of":[20,61],"non-stoichiometric":[21],"WOx":[22],"formation":[23,103],"even":[24,73],"at":[25,130],"350\u00b0C":[26],"thermal":[27],"budget":[28],"during":[29],"post-deposition":[30],"annealing":[31],"(PMA)":[32],"to":[33,66,90],"realize":[34],"ferro":[35],"electricity":[36],"in":[37,68,74,104,120,133],"HZO.":[38],"To":[39],"address":[40],"this,":[41],"we":[42,53],"introduced":[43],"sputtered":[44],"amorphous":[45],"WO":[46,62],"interlayer":[47],"(IL)":[48],"engineering.":[49],"Through":[50],"systematic":[51],"investigation,":[52],"revealed":[54],"how":[55],"physical":[57],"and":[58,71],"chemical":[59],"properties":[60],"ILs":[63],"related":[65],"polarization":[67,123],"HZO":[70],"endurance":[72],"cryogenic":[75],"environments.":[76],"More":[77],"specifically,":[78],"leveraging":[79],"10":[80,136],"nm":[81,137,139],"quasi-stoichiometric":[82],"WO2.8IL":[83],"not":[84],"only":[85],"alleviates":[86],"leakage":[87],"path":[88],"due":[89],"oxygen":[91],"vacancies":[92],"(Vos)":[93],"near":[94],"BE":[96],"interface":[97],"but":[98],"also":[99],"facilitates":[100],"domain":[102],"HZO,":[106],"which":[107],"is":[108],"validated":[109],"by":[110],"stronger":[111],"diffraction":[112],"peak":[113],"intensity":[114],"orthorhombic":[116],"(o)-phase.":[117],"This":[118],"results":[119],"a":[121],"remnant":[122],"(Pr)":[124],"greater":[125],"than":[126],"20":[127],"\u00b5C/cm2after":[128],"105cycles":[129],"123":[131],"K":[132],"optimized":[135],"HZO/10":[138],"WO2.8":[140],"IL":[141],"FeCAP.":[142]},"counts_by_year":[{"year":2025,"cited_by_count":2}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}