{"id":"https://openalex.org/W4410394799","doi":"https://doi.org/10.1109/irps48204.2025.10983099","title":"CoWoS Package Reliability Risk Assessment & Mitigation from Mechanical Perspectives","display_name":"CoWoS Package Reliability Risk Assessment & Mitigation from Mechanical Perspectives","publication_year":2025,"publication_date":"2025-03-30","ids":{"openalex":"https://openalex.org/W4410394799","doi":"https://doi.org/10.1109/irps48204.2025.10983099"},"language":"en","primary_location":{"id":"doi:10.1109/irps48204.2025.10983099","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48204.2025.10983099","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5046160903","display_name":"C. C. Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Ching-Ting Liu","raw_affiliation_strings":["Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C"],"affiliations":[{"raw_affiliation_string":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014807880","display_name":"Yao-Chun Chuang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yao-Chun Chuang","raw_affiliation_strings":["Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C"],"affiliations":[{"raw_affiliation_string":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104116535","display_name":"Jyun-Lin Wu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Jyun-Lin Wu","raw_affiliation_strings":["Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C"],"affiliations":[{"raw_affiliation_string":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083694035","display_name":"Jia-Shen Lan","orcid":"https://orcid.org/0000-0002-1271-644X"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Jia-Shen Lan","raw_affiliation_strings":["Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C"],"affiliations":[{"raw_affiliation_string":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053271740","display_name":"Chang-Fu Han","orcid":"https://orcid.org/0000-0002-1280-0211"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chang-Fu Han","raw_affiliation_strings":["Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C"],"affiliations":[{"raw_affiliation_string":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101300733","display_name":"Chia-Hua Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chia-Hua Chang","raw_affiliation_strings":["Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C"],"affiliations":[{"raw_affiliation_string":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044089544","display_name":"Jiaming Yang","orcid":"https://orcid.org/0000-0002-5829-5687"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Jia-Ming Yang","raw_affiliation_strings":["Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C"],"affiliations":[{"raw_affiliation_string":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101907184","display_name":"Yu-Sheng Lin","orcid":"https://orcid.org/0000-0001-8653-8685"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Sheng Lin","raw_affiliation_strings":["Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C"],"affiliations":[{"raw_affiliation_string":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013117402","display_name":"C.T. Li","orcid":"https://orcid.org/0009-0006-2003-4306"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chen-Wei Li","raw_affiliation_strings":["Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C"],"affiliations":[{"raw_affiliation_string":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006123246","display_name":"Ryan Lu","orcid":"https://orcid.org/0000-0003-0922-3342"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ryan Lu","raw_affiliation_strings":["Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C"],"affiliations":[{"raw_affiliation_string":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C","institution_ids":["https://openalex.org/I4210120917"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":10,"corresponding_author_ids":["https://openalex.org/A5046160903"],"corresponding_institution_ids":["https://openalex.org/I4210120917"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.14794058,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12017","display_name":"Recycling and Waste Management Techniques","score":0.9714999794960022,"subfield":{"id":"https://openalex.org/subfields/2311","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/23","display_name":"Environmental Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12017","display_name":"Recycling and Waste Management Techniques","score":0.9714999794960022,"subfield":{"id":"https://openalex.org/subfields/2311","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/23","display_name":"Environmental Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9406999945640564,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11741","display_name":"Flexible and Reconfigurable Manufacturing Systems","score":0.9075000286102295,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.7343235015869141},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6926246881484985},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5163618326187134},{"id":"https://openalex.org/keywords/risk-analysis","display_name":"Risk analysis (engineering)","score":0.3823056221008301},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26735514402389526},{"id":"https://openalex.org/keywords/medicine","display_name":"Medicine","score":0.10848736763000488},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06468746066093445}],"concepts":[{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.7343235015869141},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6926246881484985},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5163618326187134},{"id":"https://openalex.org/C112930515","wikidata":"https://www.wikidata.org/wiki/Q4389547","display_name":"Risk analysis (engineering)","level":1,"score":0.3823056221008301},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26735514402389526},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.10848736763000488},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06468746066093445},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps48204.2025.10983099","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48204.2025.10983099","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.800000011920929,"id":"https://metadata.un.org/sdg/13","display_name":"Climate action"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2051166244","https://openalex.org/W2053756339","https://openalex.org/W2970073801","https://openalex.org/W3192636176","https://openalex.org/W4376606800","https://openalex.org/W4400034687"],"related_works":["https://openalex.org/W2033512842","https://openalex.org/W4233600955","https://openalex.org/W4322734194","https://openalex.org/W3116237489","https://openalex.org/W4404996554","https://openalex.org/W2913665393","https://openalex.org/W2369695847","https://openalex.org/W3005535424","https://openalex.org/W2994319598","https://openalex.org/W2047067935"],"abstract_inverted_index":{"The":[0],"increasing":[1],"demand":[2],"for":[3],"computing":[4],"power":[5],"in":[6,81],"generative":[7],"AI":[8],"applications":[9],"has":[10],"prompted":[11],"the":[12],"use":[13],"of":[14,96],"advanced":[15],"packaging":[16],"technologies":[17],"like":[18,66],"2.5D":[19],"and":[20,39,49,58,69,77,85],"3D":[21],"ICs,":[22],"which":[23],"enable":[24],"vertical":[25],"component":[26],"stacking.":[27],"Technologies":[28],"such":[29],"as":[30],"chip-on-wafer-on-substrate":[31],"(CoWoS)":[32],"integrate":[33],"multiple":[34],"chips,":[35],"including":[36],"logic":[37],"systems-on-chip":[38],"high-bandwidth":[40],"memory,":[41],"within":[42],"a":[43],"single":[44],"package.":[45],"Heterogeneous":[46],"material":[47,57,87],"integration":[48],"large":[50],"package":[51],"sizes":[52],"creates":[53],"development":[54],"challenges,":[55],"necessitating":[56],"mechanical":[59],"characterization":[60],"to":[61,89],"provide":[62,71],"crucial":[63],"insights.":[64],"Tests":[65],"double":[67],"cantilever":[68],"nano-indentation":[70],"critical":[72],"data":[73],"on":[74],"interface":[75],"robustness":[76],"stress":[78],"resistance,":[79],"aiding":[80],"reliability":[82],"risk":[83],"assessment":[84],"guiding":[86],"selections":[88],"ensure":[90],"long-term":[91],"operation":[92],"performance":[93],"at":[94],"fields":[95],"application.":[97]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}