{"id":"https://openalex.org/W4410394945","doi":"https://doi.org/10.1109/irps48204.2025.10983058","title":"Design Considerations for Long-Term Reliability of Outdoor Electronic Assemblies (Invited)","display_name":"Design Considerations for Long-Term Reliability of Outdoor Electronic Assemblies (Invited)","publication_year":2025,"publication_date":"2025-03-30","ids":{"openalex":"https://openalex.org/W4410394945","doi":"https://doi.org/10.1109/irps48204.2025.10983058"},"language":"en","primary_location":{"id":"doi:10.1109/irps48204.2025.10983058","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48204.2025.10983058","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100639015","display_name":"Qiming Zhang","orcid":"https://orcid.org/0000-0003-4919-5083"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Qiming Zhang","raw_affiliation_strings":["Exponent Hong Kong SAR,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Exponent Hong Kong SAR,China","institution_ids":[]}]},{"author_position":"last","author":{"id":null,"display_name":"Farooq Siddiqui","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Farooq Siddiqui","raw_affiliation_strings":["Exponent Hong Kong SAR,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Exponent Hong Kong SAR,China","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11006","display_name":"BIM and Construction Integration","score":0.49059998989105225,"subfield":{"id":"https://openalex.org/subfields/2215","display_name":"Building and Construction"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11006","display_name":"BIM and Construction Integration","score":0.49059998989105225,"subfield":{"id":"https://openalex.org/subfields/2215","display_name":"Building and Construction"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/term","display_name":"Term (time)","score":0.7600563764572144},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.675979733467102},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5548191070556641},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5149756073951721},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23230352997779846},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.057045429944992065}],"concepts":[{"id":"https://openalex.org/C61797465","wikidata":"https://www.wikidata.org/wiki/Q1188986","display_name":"Term (time)","level":2,"score":0.7600563764572144},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.675979733467102},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5548191070556641},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5149756073951721},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23230352997779846},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.057045429944992065},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps48204.2025.10983058","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48204.2025.10983058","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1964477462","https://openalex.org/W1988115264","https://openalex.org/W2079788494","https://openalex.org/W2144958327","https://openalex.org/W2165364844","https://openalex.org/W2500051108","https://openalex.org/W2529378999","https://openalex.org/W2542137934","https://openalex.org/W3010476272","https://openalex.org/W4200558375","https://openalex.org/W4231172679","https://openalex.org/W4313411086","https://openalex.org/W4318014811","https://openalex.org/W4384523589","https://openalex.org/W4405154945"],"related_works":["https://openalex.org/W2033512842","https://openalex.org/W4233600955","https://openalex.org/W4322734194","https://openalex.org/W3116237489","https://openalex.org/W4404996554","https://openalex.org/W2913665393","https://openalex.org/W2369695847","https://openalex.org/W3005535424","https://openalex.org/W2994319598","https://openalex.org/W2047067935"],"abstract_inverted_index":{"In":[0],"the":[1,11,20,25,33,50,54,77,84],"crucial":[2],"product":[3],"design":[4,55],"phase,":[5],"it":[6],"is":[7],"imperative":[8],"to":[9,88],"prioritize":[10],"long-term":[12],"reliability":[13],"of":[14,23,53,59],"outdoor":[15,70,95],"electronic":[16,71],"assemblies.":[17],"This":[18,45],"encompasses":[19],"meticulous":[21],"process":[22],"optimizing":[24],"design,":[26],"meticulously":[27,41],"selecting":[28],"appropriate":[29],"materials,":[30],"accurately":[31],"predicting":[32],"product's":[34],"lifespan,":[35],"rigorously":[36],"assessing":[37],"environmental":[38,63],"conditions,":[39],"and":[40,65],"conducting":[42],"durability":[43,67],"testing.":[44],"article":[46,78],"will":[47,79],"delve":[48],"into":[49,83],"intricate":[51],"details":[52],"considerations,":[56],"vital":[57],"aspects":[58],"material":[60],"selection,":[61],"thorough":[62],"assessment,":[64],"rigorous":[66],"testing":[68],"for":[69,94],"assemblies":[72],"in":[73],"harsh":[74],"environments.":[75],"Additionally,":[76],"provide":[80],"valuable":[81],"insights":[82],"best":[85],"industrial":[86],"practices":[87],"prevent":[89],"frequently":[90],"observed":[91],"failure":[92],"modes":[93],"electronics.":[96]},"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}