{"id":"https://openalex.org/W4410394878","doi":"https://doi.org/10.1109/irps48204.2025.10982796","title":"Investigation of Cryogenic Aging in 28 nm CMOS: Suppression of BTI and HCD in Circuits and SRAM","display_name":"Investigation of Cryogenic Aging in 28 nm CMOS: Suppression of BTI and HCD in Circuits and SRAM","publication_year":2025,"publication_date":"2025-03-30","ids":{"openalex":"https://openalex.org/W4410394878","doi":"https://doi.org/10.1109/irps48204.2025.10982796"},"language":"en","primary_location":{"id":"doi:10.1109/irps48204.2025.10982796","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48204.2025.10982796","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5056827862","display_name":"J. Diaz-Fortuny","orcid":"https://orcid.org/0000-0002-8186-071X"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Javier Diaz-Fortuny","raw_affiliation_strings":["imec,Leuven,Belgium,3001"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium,3001","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044415469","display_name":"Mahdi Benkhelifa","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Mahdi Benkhelifa","raw_affiliation_strings":["Technical University of Munich, TUM School of Computation, Information and Technology; Chair of AI Processor Design; Munich Institute of Robotics and Machine Intelligence,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich, TUM School of Computation, Information and Technology; Chair of AI Processor Design; Munich Institute of Robotics and Machine Intelligence,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051359840","display_name":"Alexander Grill","orcid":"https://orcid.org/0000-0003-1615-1033"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Alexander Grill","raw_affiliation_strings":["imec,Leuven,Belgium,3001"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium,3001","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020854030","display_name":"E. Bury","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Erik Bury","raw_affiliation_strings":["imec,Leuven,Belgium,3001"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium,3001","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061087611","display_name":"R. Degraeve","orcid":"https://orcid.org/0000-0002-4609-5573"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Robin Degraeve","raw_affiliation_strings":["imec,Leuven,Belgium,3001"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium,3001","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058263075","display_name":"B. Kaczer","orcid":"https://orcid.org/0000-0002-1484-4007"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Ben Kaczer","raw_affiliation_strings":["imec,Leuven,Belgium,3001"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium,3001","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":null,"display_name":"Hussam Amrouch","orcid":null},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Hussam Amrouch","raw_affiliation_strings":["Technical University of Munich, TUM School of Computation, Information and Technology; Chair of AI Processor Design; Munich Institute of Robotics and Machine Intelligence,Munich,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technical University of Munich, TUM School of Computation, Information and Technology; Chair of AI Processor Design; Munich Institute of Robotics and Machine Intelligence,Munich,Germany","institution_ids":["https://openalex.org/I62916508"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.0704,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.77372238,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":98,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10624","display_name":"Silicon and Solar Cell Technologies","score":0.9936000108718872,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/static-random-access-memory","display_name":"Static random-access memory","score":0.757512092590332},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6835325360298157},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.6195827722549438},{"id":"https://openalex.org/keywords/random-access-memory","display_name":"Random access memory","score":0.5167500376701355},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4579654037952423},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.39717668294906616},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3734821081161499},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3694206178188324},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3235706686973572},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2676156163215637},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.10558280348777771}],"concepts":[{"id":"https://openalex.org/C68043766","wikidata":"https://www.wikidata.org/wiki/Q267416","display_name":"Static random-access memory","level":2,"score":0.757512092590332},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6835325360298157},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.6195827722549438},{"id":"https://openalex.org/C2994168587","wikidata":"https://www.wikidata.org/wiki/Q5295","display_name":"Random access memory","level":2,"score":0.5167500376701355},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4579654037952423},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.39717668294906616},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3734821081161499},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3694206178188324},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3235706686973572},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2676156163215637},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.10558280348777771}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps48204.2025.10982796","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48204.2025.10982796","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W2002612140","https://openalex.org/W2097506792","https://openalex.org/W2122520074","https://openalex.org/W2134777311","https://openalex.org/W2542616127","https://openalex.org/W2946149457","https://openalex.org/W2996946661","https://openalex.org/W3011734232","https://openalex.org/W3020771783","https://openalex.org/W3039772691","https://openalex.org/W3040682238","https://openalex.org/W3160393719","https://openalex.org/W3195839992","https://openalex.org/W4225300032","https://openalex.org/W4312688568","https://openalex.org/W4317793303","https://openalex.org/W4367044174","https://openalex.org/W4376606809","https://openalex.org/W4379033988","https://openalex.org/W4393141584","https://openalex.org/W4399491335"],"related_works":["https://openalex.org/W2248394785","https://openalex.org/W2389800961","https://openalex.org/W1909296377","https://openalex.org/W2089002058","https://openalex.org/W1995389502","https://openalex.org/W3185029353","https://openalex.org/W2969498307","https://openalex.org/W3116379964","https://openalex.org/W2793465010","https://openalex.org/W2915176329"],"abstract_inverted_index":{"The":[0,105],"increasing":[1],"interest":[2],"in":[3,53,99,147],"cryogenic":[4,25,63,130,142],"circuits":[5,112],"is":[6,152],"driven":[7],"by":[8],"their":[9,125,150],"transformative":[10],"potential":[11],"across":[12],"high-performance":[13],"computing,":[14],"medical":[15],"devices,":[16],"space":[17],"exploration,":[18],"and":[19,31,43,72,93,118,155],"quantum":[20],"technologies.":[21],"Operating":[22],"transistors":[23],"at":[24,62,82,129],"temperatures,":[26,64],"such":[27],"as":[28,132,134,141],"77":[29],"K":[30],"below,":[32],"yields":[33],"substantial":[34],"improvements,":[35],"including":[36],"increased":[37],"ON":[38],"current,":[39,42],"reduced":[40],"OFF":[41],"enhanced":[44],"sub-threshold":[45],"slope,":[46],"paving":[47],"the":[48],"way":[49],"for":[50,113],"significant":[51],"gains":[52],"efficiency.":[54],"While":[55],"recent":[56],"studies":[57],"have":[58],"explored":[59],"device-level":[60],"reliability":[61,151],"circuit-level":[65],"reliability-particularly":[66],"under":[67],"bias":[68],"temperature":[69],"instability":[70],"(BTI)":[71],"hot":[73],"carrier":[74],"degradation":[75],"(HCD)-remains":[76],"underexamined,":[77],"leaving":[78],"critical":[79,148],"aging":[80,120],"mechanisms":[81],"these":[83],"temperatures":[84,131],"poorly":[85],"understood.":[86],"To":[87],"bridge":[88],"this":[89],"gap,":[90],"we":[91],"designed":[92],"fabricated":[94],"a":[95,100],"fully":[96],"customized":[97],"chip":[98,106],"commercial":[101],"28":[102],"nm":[103],"technology.":[104],"integrates":[107],"diverse":[108],"ring":[109],"oscillator":[110],"(RO)":[111],"precise":[114],"characterization":[115],"of":[116,124],"BTI":[117],"HCD":[119],"effects,":[121],"enabling":[122],"evaluation":[123],"impact":[126],"on":[127],"performance":[128],"low":[133],"4":[135],"K.":[136],"This":[137],"work":[138],"ensures":[139],"that":[140],"CMOS":[143],"technologies":[144],"drive":[145],"innovation":[146],"applications,":[149],"comprehensively":[153],"understood":[154],"advanced.":[156]},"counts_by_year":[{"year":2026,"cited_by_count":2}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}