{"id":"https://openalex.org/W4376606677","doi":"https://doi.org/10.1109/irps48203.2023.10117795","title":"A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects","display_name":"A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects","publication_year":2023,"publication_date":"2023-03-01","ids":{"openalex":"https://openalex.org/W4376606677","doi":"https://doi.org/10.1109/irps48203.2023.10117795"},"language":"en","primary_location":{"id":"doi:10.1109/irps48203.2023.10117795","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48203.2023.10117795","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5076572432","display_name":"Y.H. Lin","orcid":"https://orcid.org/0000-0002-0757-4109"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Y.H. Lin","raw_affiliation_strings":["National Tsing Hua University,Department of Power Mechanical Engineering,Hsinchu,Taiwan","Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"National Tsing Hua University,Department of Power Mechanical Engineering,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021628010","display_name":"Chang\u2010Chun Lee","orcid":"https://orcid.org/0000-0002-4278-6510"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C.C. Lee","raw_affiliation_strings":["National Tsing Hua University,Department of Power Mechanical Engineering,Hsinchu,Taiwan","Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"National Tsing Hua University,Department of Power Mechanical Engineering,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102835295","display_name":"Chan-Yu Liao","orcid":"https://orcid.org/0000-0002-6413-2710"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C.Y. Liao","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080337961","display_name":"Ming\u2010Hsien Lin","orcid":"https://orcid.org/0000-0001-6374-4945"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"M.H. Lin","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035964466","display_name":"Wu\u2010Chun Tu","orcid":"https://orcid.org/0000-0002-9882-9778"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"W. C. Tu","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023724901","display_name":"Robin Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Robin Chen","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020121625","display_name":"H.P. Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"H.P. Chen","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044172644","display_name":"W.S. Shue","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Winston S. Shue","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5039944102","display_name":"Min Cao","orcid":"https://orcid.org/0000-0001-6199-7797"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Min Cao","raw_affiliation_strings":["Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5076572432"],"corresponding_institution_ids":["https://openalex.org/I25846049"],"apc_list":null,"apc_paid":null,"fwci":0.6694,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.67702124,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/back-end-of-line","display_name":"Back end of line","score":0.7697544693946838},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7209121584892273},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6416699886322021},{"id":"https://openalex.org/keywords/residual-stress","display_name":"Residual stress","score":0.5541118383407593},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5069715976715088},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4981076717376709},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.45898377895355225},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.42147183418273926},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.4188900589942932},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3336431384086609},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.20687901973724365},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1722198724746704}],"concepts":[{"id":"https://openalex.org/C2776628375","wikidata":"https://www.wikidata.org/wiki/Q4839229","display_name":"Back end of line","level":3,"score":0.7697544693946838},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7209121584892273},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6416699886322021},{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.5541118383407593},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5069715976715088},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4981076717376709},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.45898377895355225},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.42147183418273926},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4188900589942932},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3336431384086609},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.20687901973724365},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1722198724746704},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps48203.2023.10117795","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps48203.2023.10117795","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W2006574902","https://openalex.org/W2011608685","https://openalex.org/W2012241126","https://openalex.org/W2054704593","https://openalex.org/W2054756602","https://openalex.org/W2066874036","https://openalex.org/W2074817624","https://openalex.org/W2094207420","https://openalex.org/W2803220408","https://openalex.org/W3203623795","https://openalex.org/W4206664965","https://openalex.org/W4213438078","https://openalex.org/W4285121195","https://openalex.org/W4292062813","https://openalex.org/W6667330730"],"related_works":["https://openalex.org/W3127495135","https://openalex.org/W2045245345","https://openalex.org/W1969790797","https://openalex.org/W2018651675","https://openalex.org/W1604746479","https://openalex.org/W3092159757","https://openalex.org/W2011027483","https://openalex.org/W2073261424","https://openalex.org/W2167541987","https://openalex.org/W2137075194"],"abstract_inverted_index":{"Process-induced":[0],"warpage":[1,72],"caused":[2],"by":[3],"high-density":[4],"interconnects":[5],"in":[6,66],"the":[7,15,18,21,24,43,56,75],"back-end":[8],"of":[9,20],"line":[10],"(BEOL)":[11],"structure,":[12],"may":[13],"affect":[14],"performance":[16],"and":[17,45,52,60],"reliability":[19],"product":[22],"during":[23],"packaging":[25],"process.":[26],"In":[27],"this":[28],"paper,":[29],"a":[30,37],"BEOL":[31],"structure":[32],"is":[33],"used":[34,65],"to":[35,41],"develop":[36],"process-oriented":[38],"simulation":[39,50],"methodology":[40],"optimize":[42],"design":[44],"predict":[46],"warpage.":[47],"To":[48],"reduce":[49],"time":[51],"obtain":[53],"accurate":[54],"predictions,":[55],"equivalent":[57,61],"material":[58],"method":[59],"residual":[62],"stress":[63],"are":[64],"our":[67],"proposed":[68],"method.":[69],"The":[70],"layer-by-layer":[71],"predictions":[73],"matched":[74],"measurement":[76],"data.":[77]},"counts_by_year":[{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}