{"id":"https://openalex.org/W3157632438","doi":"https://doi.org/10.1109/irps46558.2021.9405131","title":"Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages","display_name":"Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages","publication_year":2021,"publication_date":"2021-03-01","ids":{"openalex":"https://openalex.org/W3157632438","doi":"https://doi.org/10.1109/irps46558.2021.9405131","mag":"3157632438"},"language":"en","primary_location":{"id":"doi:10.1109/irps46558.2021.9405131","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps46558.2021.9405131","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083600029","display_name":"Allison T. Osmanson","orcid":null},"institutions":[{"id":"https://openalex.org/I189196454","display_name":"The University of Texas at Arlington","ror":"https://ror.org/019kgqr73","country_code":"US","type":"education","lineage":["https://openalex.org/I189196454"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"A.T. Osmanson","raw_affiliation_strings":["University of Texas at Arlington, Arlington, Texas, USA"],"affiliations":[{"raw_affiliation_string":"University of Texas at Arlington, Arlington, Texas, USA","institution_ids":["https://openalex.org/I189196454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090960021","display_name":"Mohsen Tajedini","orcid":null},"institutions":[{"id":"https://openalex.org/I189196454","display_name":"The University of Texas at Arlington","ror":"https://ror.org/019kgqr73","country_code":"US","type":"education","lineage":["https://openalex.org/I189196454"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Tajedini","raw_affiliation_strings":["University of Texas at Arlington, Arlington, Texas, USA"],"affiliations":[{"raw_affiliation_string":"University of Texas at Arlington, Arlington, Texas, USA","institution_ids":["https://openalex.org/I189196454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100670717","display_name":"Yonghee Kim","orcid":"https://orcid.org/0000-0002-8843-8474"},"institutions":[{"id":"https://openalex.org/I189196454","display_name":"The University of Texas at Arlington","ror":"https://ror.org/019kgqr73","country_code":"US","type":"education","lineage":["https://openalex.org/I189196454"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Y.R. Kim","raw_affiliation_strings":["University of Texas at Arlington, Arlington, Texas, USA"],"affiliations":[{"raw_affiliation_string":"University of Texas at Arlington, Arlington, Texas, USA","institution_ids":["https://openalex.org/I189196454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019573659","display_name":"Hossein Madanipour","orcid":null},"institutions":[{"id":"https://openalex.org/I189196454","display_name":"The University of Texas at Arlington","ror":"https://ror.org/019kgqr73","country_code":"US","type":"education","lineage":["https://openalex.org/I189196454"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H. Madanipour","raw_affiliation_strings":["University of Texas at Arlington, Arlington, Texas, USA"],"affiliations":[{"raw_affiliation_string":"University of Texas at Arlington, Arlington, Texas, USA","institution_ids":["https://openalex.org/I189196454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079548488","display_name":"Chan-Joong Kim","orcid":"https://orcid.org/0000-0001-5349-038X"},"institutions":[{"id":"https://openalex.org/I189196454","display_name":"The University of Texas at Arlington","ror":"https://ror.org/019kgqr73","country_code":"US","type":"education","lineage":["https://openalex.org/I189196454"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Kim","raw_affiliation_strings":["University of Texas at Arlington, Arlington, Texas, USA"],"affiliations":[{"raw_affiliation_string":"University of Texas at Arlington, Arlington, Texas, USA","institution_ids":["https://openalex.org/I189196454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082803281","display_name":"Bradley Glasscock","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. Glasscock","raw_affiliation_strings":["Texas Instruments, Inc., Dallas, Texas, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., Dallas, Texas, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101654368","display_name":"M.A. Khan","orcid":"https://orcid.org/0000-0001-7740-6154"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Khan","raw_affiliation_strings":["Texas Instruments, Inc., Dallas, Texas, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., Dallas, Texas, USA","institution_ids":["https://openalex.org/I74760111"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5083600029"],"corresponding_institution_ids":["https://openalex.org/I189196454"],"apc_list":null,"apc_paid":null,"fwci":0.1003,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.40372794,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9954000115394592,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8060733675956726},{"id":"https://openalex.org/keywords/contact-resistance","display_name":"Contact resistance","score":0.6914472579956055},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.6658098101615906},{"id":"https://openalex.org/keywords/ball","display_name":"Ball (mathematics)","score":0.6224349141120911},{"id":"https://openalex.org/keywords/work-hardening","display_name":"Work hardening","score":0.5498858690261841},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.54393470287323},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.5099459886550903},{"id":"https://openalex.org/keywords/contact-area","display_name":"Contact area","score":0.4677949547767639},{"id":"https://openalex.org/keywords/hardening","display_name":"Hardening (computing)","score":0.43134090304374695},{"id":"https://openalex.org/keywords/contact-mechanics","display_name":"Contact mechanics","score":0.42840760946273804},{"id":"https://openalex.org/keywords/microstructure","display_name":"Microstructure","score":0.40906956791877747},{"id":"https://openalex.org/keywords/forensic-engineering","display_name":"Forensic engineering","score":0.344054639339447},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.2199329435825348},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.11539614200592041},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.10712209343910217}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8060733675956726},{"id":"https://openalex.org/C123671423","wikidata":"https://www.wikidata.org/wiki/Q332329","display_name":"Contact resistance","level":3,"score":0.6914472579956055},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.6658098101615906},{"id":"https://openalex.org/C122041747","wikidata":"https://www.wikidata.org/wiki/Q838611","display_name":"Ball (mathematics)","level":2,"score":0.6224349141120911},{"id":"https://openalex.org/C2776704300","wikidata":"https://www.wikidata.org/wiki/Q1501203","display_name":"Work hardening","level":3,"score":0.5498858690261841},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.54393470287323},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.5099459886550903},{"id":"https://openalex.org/C33373654","wikidata":"https://www.wikidata.org/wiki/Q5164821","display_name":"Contact area","level":2,"score":0.4677949547767639},{"id":"https://openalex.org/C44255700","wikidata":"https://www.wikidata.org/wiki/Q978423","display_name":"Hardening (computing)","level":3,"score":0.43134090304374695},{"id":"https://openalex.org/C179909247","wikidata":"https://www.wikidata.org/wiki/Q1783143","display_name":"Contact mechanics","level":3,"score":0.42840760946273804},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.40906956791877747},{"id":"https://openalex.org/C77595967","wikidata":"https://www.wikidata.org/wiki/Q3151013","display_name":"Forensic engineering","level":1,"score":0.344054639339447},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.2199329435825348},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.11539614200592041},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.10712209343910217},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps46558.2021.9405131","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps46558.2021.9405131","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1971897257","https://openalex.org/W1978381258","https://openalex.org/W1990215011","https://openalex.org/W2001351244","https://openalex.org/W2001449184","https://openalex.org/W2007215424","https://openalex.org/W2007719944","https://openalex.org/W2012081612","https://openalex.org/W2081864739","https://openalex.org/W2101822810","https://openalex.org/W2102687431","https://openalex.org/W2142352610","https://openalex.org/W2155717529","https://openalex.org/W2156327154","https://openalex.org/W2546163117","https://openalex.org/W2604577368","https://openalex.org/W6683090901"],"related_works":["https://openalex.org/W2057782916","https://openalex.org/W1997603075","https://openalex.org/W2522763245","https://openalex.org/W1984993747","https://openalex.org/W2035069628","https://openalex.org/W1967931121","https://openalex.org/W1996230665","https://openalex.org/W2222868738","https://openalex.org/W4311138406","https://openalex.org/W2410760766"],"abstract_inverted_index":{"This":[0,79,145,181],"paper":[1,46],"concerns":[2],"the":[3,8,12,33,38,48,51,74,87,93,99,103,127,131,151,156,160,164,169,177,185,187,204,208,216,221,240,245,267,278,281,285],"microstructural":[4],"mechanism":[5],"responsible":[6],"for":[7,295],"variation":[9],"seen":[10],"in":[11,190,203,239,289],"contact":[13,34,52,57,90,128,157,188,198,213,241,268,286],"resistance":[14,129,199],"of":[15,41,56,89,95,102,150,163,171,210],"ball":[16,132,165,178,205,222],"bonds":[17],"made":[18,270],"on":[19,32,50,126],"Al":[20],"pads":[21],"with":[22,59,271,297],"wire":[23,60,63],"materials":[24,64],"and":[25,27,62,66,70,108,130,134,229,257,284],"dimensions":[26],"discusses":[28],"its":[29],"potential":[30],"impact":[31],"properties":[35],"related":[36,111,135],"to":[37,73,137,155,207,223,251,263],"physical":[39],"reliability":[40,101],"wirebond":[42],"packaging.":[43],"Specifically,":[44],"this":[45,118,237],"reports":[47],"characterization":[49,124],"resistance,":[53],"a":[54,84,122,196,211,225,253,272],"reflection":[55],"area,":[58],"dimension":[61],"(Cu":[65],"Pd":[67,201],"coated":[68,193],"Cu),":[69],"their":[71],"susceptibility":[72],"electromigration":[75],"(EM)":[76],"induced":[77],"failures.":[78],"study":[80,125,146,291],"is":[81,92,159,182,269],"motivated":[82],"by":[83,184,249],"belief":[85],"that":[86,148,174,236,277],"property":[88,162],"interface":[91,247],"one":[94,149],"leading":[96],"factors":[97,154],"affecting":[98],"overall":[100],"bond":[104,246],"especially":[105],"against":[106,232],"delamination":[107],"EM,":[109],"yet":[110],"studies":[112],"are":[113],"critically":[114],"lacking.":[115],"To":[116],"solve":[117],"problem,":[119],"we":[120],"conducted":[121],"comprehensive":[123],"microstructure":[133],"those":[136],"samples":[138],"which":[139],"were":[140],"evaluated":[141],"under":[142],"EM":[143,264],"loads.":[144],"reveals":[147],"critical":[152],"contributing":[153],"formation":[158,189,209],"work-hardening":[161,227],"because":[166,215],"it":[167],"limits":[168],"level":[170],"plastic":[172],"deformation":[173],"occurs":[175],"during":[176],"bonding":[179],"process.":[180],"supported":[183],"fact":[186],"PCC":[191,250],"(Pd":[192],"Cu)":[194],"has":[195],"high":[197,226],"since":[200],"alloying":[202],"leads":[206],"smaller":[212],"area":[214,242,287],"solid":[217],"solution":[218],"hardening":[219,283],"causes":[220],"attain":[224],"rate,":[228],"thus":[230],"resist":[231],"deformation.":[233],"We":[234,275],"believe":[235,276],"reduction":[238],"may":[243],"cause":[244],"formed":[248],"have":[252],"lower":[254],"adhesion":[255],"strength":[256],"also":[258],"possibly":[259],"be":[260],"more":[261],"susceptible":[262],"failure,":[265],"unless":[266],"greater":[273],"force.":[274],"correlation":[279],"between":[280],"strain":[282],"found":[288],"our":[290],"can":[292],"provide":[293],"guidance":[294],"wirebonding":[296],"enhanced":[298],"reliability.":[299]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2026-01-13T01:12:25.745995","created_date":"2025-10-10T00:00:00"}