{"id":"https://openalex.org/W3159601891","doi":"https://doi.org/10.1109/irps46558.2021.9405091","title":"Electromigration limits of copper nano-interconnects","display_name":"Electromigration limits of copper nano-interconnects","publication_year":2021,"publication_date":"2021-03-01","ids":{"openalex":"https://openalex.org/W3159601891","doi":"https://doi.org/10.1109/irps46558.2021.9405091","mag":"3159601891"},"language":"en","primary_location":{"id":"doi:10.1109/irps46558.2021.9405091","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps46558.2021.9405091","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5006611169","display_name":"Houman Zahedmaesh","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":true,"raw_author_name":"Houman Zahedmaesh","raw_affiliation_strings":["imec, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"imec, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033858378","display_name":"Olalla Varela Pedreira","orcid":"https://orcid.org/0000-0002-2987-1972"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Olalla Varela Pedreira","raw_affiliation_strings":["imec, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"imec, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083194625","display_name":"Zsolt T\u00f6kei","orcid":"https://orcid.org/0000-0003-3545-3424"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Zsolt Tokei","raw_affiliation_strings":["imec, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"imec, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080591280","display_name":"Kristof Croes","orcid":"https://orcid.org/0000-0002-3955-0638"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Kristof Croes","raw_affiliation_strings":["imec, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"imec, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5006611169"],"corresponding_institution_ids":["https://openalex.org/I4210114974"],"apc_list":null,"apc_paid":null,"fwci":0.9102,"has_fulltext":false,"cited_by_count":20,"citation_normalized_percentile":{"value":0.69660592,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.9203155040740967},{"id":"https://openalex.org/keywords/laser-linewidth","display_name":"Laser linewidth","score":0.8887462615966797},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7297086715698242},{"id":"https://openalex.org/keywords/nano","display_name":"Nano-","score":0.6592209339141846},{"id":"https://openalex.org/keywords/trench","display_name":"Trench","score":0.5919941663742065},{"id":"https://openalex.org/keywords/nanoscopic-scale","display_name":"Nanoscopic scale","score":0.545936107635498},{"id":"https://openalex.org/keywords/current-density","display_name":"Current density","score":0.5348924994468689},{"id":"https://openalex.org/keywords/copper-interconnect","display_name":"Copper interconnect","score":0.5282097458839417},{"id":"https://openalex.org/keywords/crystallite","display_name":"Crystallite","score":0.518071174621582},{"id":"https://openalex.org/keywords/microstructure","display_name":"Microstructure","score":0.510216474533081},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5059704184532166},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.49220624566078186},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.4806736409664154},{"id":"https://openalex.org/keywords/drop","display_name":"Drop (telecommunication)","score":0.4695452153682709},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.44915029406547546},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3014233112335205},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.2674887180328369},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.2422288954257965},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.19125831127166748},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.17953097820281982},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.07407030463218689},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.061597228050231934},{"id":"https://openalex.org/keywords/laser","display_name":"Laser","score":0.05939033627510071}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9203155040740967},{"id":"https://openalex.org/C142181693","wikidata":"https://www.wikidata.org/wiki/Q6493080","display_name":"Laser linewidth","level":3,"score":0.8887462615966797},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7297086715698242},{"id":"https://openalex.org/C2780357685","wikidata":"https://www.wikidata.org/wiki/Q154357","display_name":"Nano-","level":2,"score":0.6592209339141846},{"id":"https://openalex.org/C155310634","wikidata":"https://www.wikidata.org/wiki/Q1852785","display_name":"Trench","level":3,"score":0.5919941663742065},{"id":"https://openalex.org/C45206210","wikidata":"https://www.wikidata.org/wiki/Q2415817","display_name":"Nanoscopic scale","level":2,"score":0.545936107635498},{"id":"https://openalex.org/C207740977","wikidata":"https://www.wikidata.org/wiki/Q234072","display_name":"Current density","level":2,"score":0.5348924994468689},{"id":"https://openalex.org/C116372231","wikidata":"https://www.wikidata.org/wiki/Q605757","display_name":"Copper interconnect","level":3,"score":0.5282097458839417},{"id":"https://openalex.org/C137637335","wikidata":"https://www.wikidata.org/wiki/Q899604","display_name":"Crystallite","level":2,"score":0.518071174621582},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.510216474533081},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5059704184532166},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.49220624566078186},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.4806736409664154},{"id":"https://openalex.org/C2781345722","wikidata":"https://www.wikidata.org/wiki/Q5308388","display_name":"Drop (telecommunication)","level":2,"score":0.4695452153682709},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.44915029406547546},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3014233112335205},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.2674887180328369},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.2422288954257965},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.19125831127166748},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.17953097820281982},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.07407030463218689},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.061597228050231934},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.05939033627510071},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps46558.2021.9405091","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps46558.2021.9405091","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1975694124","https://openalex.org/W1980303205","https://openalex.org/W2009520737","https://openalex.org/W2015762781","https://openalex.org/W2071455226","https://openalex.org/W2096570580","https://openalex.org/W2112903419","https://openalex.org/W2132679502","https://openalex.org/W2513391298","https://openalex.org/W2734588019","https://openalex.org/W2800334986","https://openalex.org/W2801472322","https://openalex.org/W2911367753","https://openalex.org/W2914446819","https://openalex.org/W2965000499"],"related_works":["https://openalex.org/W1982820757","https://openalex.org/W2082831914","https://openalex.org/W2075171636","https://openalex.org/W2106480950","https://openalex.org/W2128384320","https://openalex.org/W2039036129","https://openalex.org/W1976947690","https://openalex.org/W2154887827","https://openalex.org/W1994213108","https://openalex.org/W2133958474"],"abstract_inverted_index":{"In":[0],"this":[1,95],"paper":[2],"the":[3,13,47,85,104],"electromigration":[4],"(EM)":[5],"limits":[6],"of":[7,15,34,46,84,101,135,155],"Cu":[8,125],"nano-interconnects":[9],"are":[10],"studied":[11],"considering":[12],"impact":[14],"microstructure":[16],"in":[17,70,124],"Co":[18,128,156],"cap":[19,157],"schemes":[20],"and":[21,28,36,64,67,158,169],"performance":[22],"booster":[23],"technologies":[24],"i.e.":[25,59,103],"via":[26,159],"pre-fill":[27],"scaled":[29],"barrier-liner":[30],"schemes.":[31],"A":[32,98],"combination":[33],"experimental":[35],"physics-based":[37],"modelling":[38],"approaches":[39],"is":[40,88,96],"employed":[41],"to":[42,121,137,140,148,163],"provide":[43],"fundamental":[44],"understanding":[45],"involved":[48],"mechanisms.":[49],"The":[50],"results":[51],"show":[52,131],"that":[53,78,107],"linewidth":[54,94,117],"reduction,":[55],"higher":[56],"trench":[57],"depth,":[58],"larger":[60],"aspect":[61],"ratio":[62],"(AR)":[63],"thinner":[65],"barrier":[66,141],"liners":[68],"result":[69],"more":[71],"polycrystalline":[72,89],"copper":[73],"texture.":[74],"It":[75],"was":[76,113],"found":[77,114,162],"at":[79,110],"10.5":[80,122],"nm":[81,93,120,123,147,150],"linewidth,":[82],"~95%":[83],"nano-interconnect":[86],"length":[87],"while":[90],"for":[91,151],"25":[92,119],"~85%.":[97],"90%":[99],"drop":[100,134],"jfail":[102,165],"current":[105],"density":[106],"induces":[108],"failure":[109,138],"10":[111],"years,":[112],"by":[115,166],"scaling":[116,144],"from":[118,145],"interconnects":[126],"with":[127],"cap.":[129],"Experiments":[130],"a":[132],"70%":[133],"time":[136],"due":[139],"film":[142],"thickness":[143],"3":[146],"2":[149],"PVD":[152],"TaN.":[153],"Utilization":[154],"prefill":[160],"were":[161],"increase":[164],"~10":[167],"fold":[168],"~3":[170],"fold,":[171],"respectively.":[172]},"counts_by_year":[{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":4},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}