{"id":"https://openalex.org/W3040665813","doi":"https://doi.org/10.1109/irps45951.2020.9128331","title":"Reliability of Metal-Dielectric Structures Under Intermittent Current Pulsing","display_name":"Reliability of Metal-Dielectric Structures Under Intermittent Current Pulsing","publication_year":2020,"publication_date":"2020-04-01","ids":{"openalex":"https://openalex.org/W3040665813","doi":"https://doi.org/10.1109/irps45951.2020.9128331","mag":"3040665813"},"language":"en","primary_location":{"id":"doi:10.1109/irps45951.2020.9128331","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps45951.2020.9128331","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044892307","display_name":"Chong Soo Lee","orcid":"https://orcid.org/0000-0003-2156-4422"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"C-S. Lee","raw_affiliation_strings":["Department of Mechanical Engineering, Purdue University, West Lafayette, IN, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072392703","display_name":"Pavan Kumar Vaitheeswaran","orcid":"https://orcid.org/0000-0002-0429-534X"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P. Vaitheeswaran","raw_affiliation_strings":["Department of Mechanical Engineering, Purdue University, West Lafayette, IN, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080314217","display_name":"Ganesh Subbarayan","orcid":"https://orcid.org/0000-0003-0462-1130"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. Subbarayan","raw_affiliation_strings":["Department of Mechanical Engineering, Purdue University, West Lafayette, IN, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051975840","display_name":"Y-J. Park","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Y-J. Park","raw_affiliation_strings":["Texas Instruments, Dallas, TX, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034404786","display_name":"Jaehak Chung","orcid":"https://orcid.org/0000-0001-5993-3698"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Chung","raw_affiliation_strings":["Texas Instruments, Dallas, TX, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5032818658","display_name":"S. Krishnan","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Krishnan","raw_affiliation_strings":["Texas Instruments, Dallas, TX, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5044892307"],"corresponding_institution_ids":["https://openalex.org/I219193219"],"apc_list":null,"apc_paid":null,"fwci":0.0664,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.26957181,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.993399977684021,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8026841282844543},{"id":"https://openalex.org/keywords/duty-cycle","display_name":"Duty cycle","score":0.6247539520263672},{"id":"https://openalex.org/keywords/aluminium","display_name":"Aluminium","score":0.5832467079162598},{"id":"https://openalex.org/keywords/current","display_name":"Current (fluid)","score":0.5617219805717468},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.5347505807876587},{"id":"https://openalex.org/keywords/current-density","display_name":"Current density","score":0.5136065483093262},{"id":"https://openalex.org/keywords/failure-mode-and-effects-analysis","display_name":"Failure mode and effects analysis","score":0.5019919872283936},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.4754968583583832},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.47337836027145386},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.47190600633621216},{"id":"https://openalex.org/keywords/dielectric-strength","display_name":"Dielectric strength","score":0.4448115825653076},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.43531325459480286},{"id":"https://openalex.org/keywords/line","display_name":"Line (geometry)","score":0.41101783514022827},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.3379461169242859},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.26979130506515503},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2554245591163635},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.20904597640037537},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.15388226509094238},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.10693204402923584},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.10411468148231506}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8026841282844543},{"id":"https://openalex.org/C199822604","wikidata":"https://www.wikidata.org/wiki/Q557120","display_name":"Duty cycle","level":3,"score":0.6247539520263672},{"id":"https://openalex.org/C513153333","wikidata":"https://www.wikidata.org/wiki/Q663","display_name":"Aluminium","level":2,"score":0.5832467079162598},{"id":"https://openalex.org/C148043351","wikidata":"https://www.wikidata.org/wiki/Q4456944","display_name":"Current (fluid)","level":2,"score":0.5617219805717468},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.5347505807876587},{"id":"https://openalex.org/C207740977","wikidata":"https://www.wikidata.org/wiki/Q234072","display_name":"Current density","level":2,"score":0.5136065483093262},{"id":"https://openalex.org/C66283442","wikidata":"https://www.wikidata.org/wiki/Q1389268","display_name":"Failure mode and effects analysis","level":2,"score":0.5019919872283936},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4754968583583832},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.47337836027145386},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.47190600633621216},{"id":"https://openalex.org/C70401718","wikidata":"https://www.wikidata.org/wiki/Q343241","display_name":"Dielectric strength","level":3,"score":0.4448115825653076},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.43531325459480286},{"id":"https://openalex.org/C198352243","wikidata":"https://www.wikidata.org/wiki/Q37105","display_name":"Line (geometry)","level":2,"score":0.41101783514022827},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3379461169242859},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.26979130506515503},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2554245591163635},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.20904597640037537},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.15388226509094238},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.10693204402923584},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.10411468148231506},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps45951.2020.9128331","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps45951.2020.9128331","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1598972148","https://openalex.org/W1966404162","https://openalex.org/W1968181068","https://openalex.org/W1986545147","https://openalex.org/W2112985169","https://openalex.org/W2140340054","https://openalex.org/W2146977498","https://openalex.org/W2157644015","https://openalex.org/W2504664024","https://openalex.org/W4255063241","https://openalex.org/W6642062188"],"related_works":["https://openalex.org/W2900105712","https://openalex.org/W4385507351","https://openalex.org/W881306924","https://openalex.org/W2885118911","https://openalex.org/W2808114008","https://openalex.org/W2017269528","https://openalex.org/W4252409419","https://openalex.org/W2064026228","https://openalex.org/W2062671627","https://openalex.org/W2050050727"],"abstract_inverted_index":{"Design":[0],"rules":[1],"for":[2,29,129,186],"specification":[3],"of":[4,13,41,76,97,102,120,144,174],"current":[5,21,65,81,121,183],"densities":[6,82],"in":[7,99,113],"lines":[8,150,159],"are":[9,25,86,107],"driven":[10],"by":[11,109],"consideration":[12],"possible":[14],"failure":[15,33,98],"mechanisms.":[16],"Under":[17],"large":[18],"amplitude":[19],"intermittent":[20],"pulses,":[22],"thermal":[23],"stresses":[24],"the":[26,42,94,100,110,114,117,130,157,175],"dominant":[27,95],"cause":[28],"failure,":[30],"with":[31,54],"chief":[32],"mechanisms":[34],"being":[35],"cyclic":[36],"fatigue":[37,89],"and":[38,59,83,116,148,153],"plastic":[39],"ratcheting":[40],"metal":[43],"line":[44,84,115],"or":[45,56],"dielectric":[46,62,170],"fracture.":[47],"In":[48],"this":[49],"study,":[50],"a":[51,161,168],"BEOL":[52],"structure":[53],"aluminum":[55,147],"copper":[57,149,158],"interconnects":[58],"silicon":[60],"dioxide":[61],"under":[63],"well-separated":[64],"pulses":[66],"is":[67,90,125,138,151,155],"studied":[68],"numerically":[69],"through":[70],"finite":[71],"element":[72],"simulations.":[73],"The":[74,105,172],"effects":[75],"varying":[77],"duty":[78,118],"cycles,":[79],"peak":[80,182],"widths":[85],"studied.":[87],"Line":[88],"found":[91,126],"to":[92,127,180],"be":[93,178],"mode":[96],"absence":[101],"package":[103],"structure.":[104],"results":[106,173],"characterized":[108],"temperature":[111,133,164],"rise":[112,134],"cycle":[119,132],"pulses.":[122],"A":[123,142],"threshold":[124,163],"exist":[128],"per":[131],"below":[135],"which":[136],"there":[137],"no":[139],"observable":[140],"fatigue.":[141],"comparison":[143],"reliability":[145],"between":[146],"made":[152],"it":[154],"observed":[156],"permit":[160],"lower":[162,169],"rise,":[165],"but":[166],"induce":[167],"stress.":[171],"study":[176],"may":[177],"used":[179],"develop":[181],"density":[184],"specifications":[185],"dies.":[187]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}