{"id":"https://openalex.org/W3039027195","doi":"https://doi.org/10.1109/irps45951.2020.9128322","title":"Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology","display_name":"Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology","publication_year":2020,"publication_date":"2020-04-01","ids":{"openalex":"https://openalex.org/W3039027195","doi":"https://doi.org/10.1109/irps45951.2020.9128322","mag":"3039027195"},"language":"en","primary_location":{"id":"doi:10.1109/irps45951.2020.9128322","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps45951.2020.9128322","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102017116","display_name":"Hai Jiang","orcid":"https://orcid.org/0000-0002-6653-2304"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Hai Jiang","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021180754","display_name":"Hyun Chul Sagong","orcid":"https://orcid.org/0009-0003-0236-6698"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyunchul Sagong","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101930746","display_name":"Jinju Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jinju Kim","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043564438","display_name":"Hyewon Shim","orcid":"https://orcid.org/0000-0003-2132-4701"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyewon Shim","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061255515","display_name":"Yoohwan Kim","orcid":"https://orcid.org/0000-0002-7321-9527"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yoohwan Kim","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068746977","display_name":"Junekyun Park","orcid":"https://orcid.org/0000-0001-9582-8246"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Junekyun Park","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102998461","display_name":"Taiki Uemura","orcid":"https://orcid.org/0000-0002-6028-547X"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Taiki Uemura","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110666730","display_name":"Yongsung Ji","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yongsung Ji","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008417725","display_name":"Tae-Young Jeong","orcid":"https://orcid.org/0000-0002-1699-0200"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Taeyoung Jeong","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060502104","display_name":"Dongkyun Kwon","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Dongkyun Kwon","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102380978","display_name":"Hwasung Rhee","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hwasung Rhee","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010124316","display_name":"Sangwoo Pae","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sangwoo Pae","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5023694795","display_name":"Brandon Lee","orcid":"https://orcid.org/0000-0002-2043-6827"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Brandon Lee","raw_affiliation_strings":["Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea"],"affiliations":[{"raw_affiliation_string":"Foundry Business, Samsung Electronics, Giheung-gu, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I2250650973"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":13,"corresponding_author_ids":["https://openalex.org/A5102017116"],"corresponding_institution_ids":["https://openalex.org/I2250650973"],"apc_list":null,"apc_paid":null,"fwci":0.5137,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.64344368,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/superposition-principle","display_name":"Superposition principle","score":0.6201820969581604},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4854781925678253},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.4490512013435364},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.34452787041664124},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.3234351873397827},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.28713592886924744},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.22448652982711792},{"id":"https://openalex.org/keywords/combinatorics","display_name":"Combinatorics","score":0.18849357962608337},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.17920386791229248},{"id":"https://openalex.org/keywords/mathematical-analysis","display_name":"Mathematical analysis","score":0.1113688051700592}],"concepts":[{"id":"https://openalex.org/C27753989","wikidata":"https://www.wikidata.org/wiki/Q284885","display_name":"Superposition principle","level":2,"score":0.6201820969581604},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4854781925678253},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.4490512013435364},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.34452787041664124},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.3234351873397827},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.28713592886924744},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.22448652982711792},{"id":"https://openalex.org/C114614502","wikidata":"https://www.wikidata.org/wiki/Q76592","display_name":"Combinatorics","level":1,"score":0.18849357962608337},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.17920386791229248},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.1113688051700592}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps45951.2020.9128322","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps45951.2020.9128322","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W2043440527","https://openalex.org/W2050540090","https://openalex.org/W2076306082","https://openalex.org/W2125049412","https://openalex.org/W2149472303","https://openalex.org/W2171188814","https://openalex.org/W2292956491","https://openalex.org/W2526944027","https://openalex.org/W2588213994","https://openalex.org/W2745102677","https://openalex.org/W2776510075","https://openalex.org/W2801519812","https://openalex.org/W2898826866","https://openalex.org/W2899406092","https://openalex.org/W6697258222"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W4308749380","https://openalex.org/W2037841693","https://openalex.org/W2372481764","https://openalex.org/W1977264433","https://openalex.org/W2746368218","https://openalex.org/W4308448008","https://openalex.org/W2347371661"],"abstract_inverted_index":{"Self-heating":[0],"effect":[1,86],"(SHE,":[2],"\u0394T":[3,92],"<sub":[4,67,73,93],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[5,68,74,94],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">sh</sub>":[6,95],")":[7],"has":[8],"become":[9],"a":[10,46],"significant":[11],"concern":[12],"for":[13,82,104],"device":[14],"performance,":[15],"variability":[16],"and":[17,26],"reliability":[18],"co-optimization":[19],"due":[20],"to":[21,54,59,80],"more":[22,99],"confined":[23],"layout":[24,60,84],"geometry":[25],"lower-thermal-conductivity":[27],"materials":[28],"adopted":[29],"in":[30],"advanced":[31],"technology,":[32],"which":[33],"substantially":[34],"impacts":[35],"on":[36],"the":[37,56],"integrated":[38],"circuit":[39],"(IC)'s":[40],"design":[41],"schemes.":[42],"In":[43],"this":[44],"work,":[45],"new":[47],"heat-dissipation-path":[48],"based":[49],"SHE":[50,83],"model":[51],"is":[52,78],"proposed":[53],"describe":[55],"heat":[57],"spreading":[58],"proximity":[61,85],"by":[62,87],"interactive":[63],"thermal":[64,105],"resistance":[65],"(R":[66],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">th(i,j)</sub>":[69],").":[70],"Meanwhile,":[71],"R":[72],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">th</sub>":[75],"-matrix":[76],"methodology":[77],"employed":[79],"account":[81,103],"linear":[88],"superposition":[89],"algorithm.":[90],"Therefore,":[91],"profile":[96],"can":[97],"be":[98],"accurately":[100],"reckoned":[101],"with":[102],"interaction":[106],"effect.":[107]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}