{"id":"https://openalex.org/W2946610882","doi":"https://doi.org/10.1109/irps.2019.8720532","title":"Bilayer Passivation Film for Cu Interconnects on Si Interconnect Fabric","display_name":"Bilayer Passivation Film for Cu Interconnects on Si Interconnect Fabric","publication_year":2019,"publication_date":"2019-03-01","ids":{"openalex":"https://openalex.org/W2946610882","doi":"https://doi.org/10.1109/irps.2019.8720532","mag":"2946610882"},"language":"en","primary_location":{"id":"doi:10.1109/irps.2019.8720532","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2019.8720532","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5084193537","display_name":"Niloofar Shakoorzadeh","orcid":null},"institutions":[{"id":"https://openalex.org/I161318765","display_name":"University of California, Los Angeles","ror":"https://ror.org/046rm7j60","country_code":"US","type":"education","lineage":["https://openalex.org/I161318765"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Niloofar Shakoorzadeh","raw_affiliation_strings":["Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, USA","institution_ids":["https://openalex.org/I161318765"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004607866","display_name":"Amir N. Hanna","orcid":"https://orcid.org/0000-0003-4679-366X"},"institutions":[{"id":"https://openalex.org/I161318765","display_name":"University of California, Los Angeles","ror":"https://ror.org/046rm7j60","country_code":"US","type":"education","lineage":["https://openalex.org/I161318765"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Amir Hanna","raw_affiliation_strings":["Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, USA","institution_ids":["https://openalex.org/I161318765"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5091022757","display_name":"Subramanian S. Iyer","orcid":"https://orcid.org/0000-0003-1220-031X"},"institutions":[{"id":"https://openalex.org/I161318765","display_name":"University of California, Los Angeles","ror":"https://ror.org/046rm7j60","country_code":"US","type":"education","lineage":["https://openalex.org/I161318765"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Subramanian Iyer","raw_affiliation_strings":["Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, USA","institution_ids":["https://openalex.org/I161318765"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I161318765"],"apc_list":null,"apc_paid":null,"fwci":0.7965,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.62373979,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/passivation","display_name":"Passivation","score":0.8543791174888611},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7022146582603455},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6955943703651428},{"id":"https://openalex.org/keywords/bilayer","display_name":"Bilayer","score":0.6608092188835144},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5743630528450012},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.48171287775039673},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3076228201389313},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.22076183557510376},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.21359750628471375},{"id":"https://openalex.org/keywords/membrane","display_name":"Membrane","score":0.1418675184249878},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.07426020503044128},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.06935718655586243}],"concepts":[{"id":"https://openalex.org/C33574316","wikidata":"https://www.wikidata.org/wiki/Q917260","display_name":"Passivation","level":3,"score":0.8543791174888611},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7022146582603455},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6955943703651428},{"id":"https://openalex.org/C192157962","wikidata":"https://www.wikidata.org/wiki/Q4087243","display_name":"Bilayer","level":3,"score":0.6608092188835144},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5743630528450012},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.48171287775039673},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3076228201389313},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.22076183557510376},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.21359750628471375},{"id":"https://openalex.org/C41625074","wikidata":"https://www.wikidata.org/wiki/Q176088","display_name":"Membrane","level":2,"score":0.1418675184249878},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.07426020503044128},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.06935718655586243},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps.2019.8720532","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2019.8720532","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/12","score":0.5199999809265137,"display_name":"Responsible consumption and production"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2095072896","https://openalex.org/W2162738176","https://openalex.org/W2320552075","https://openalex.org/W2493925267","https://openalex.org/W2607085576","https://openalex.org/W2742519254","https://openalex.org/W2786326398","https://openalex.org/W2885213983","https://openalex.org/W2888088501","https://openalex.org/W6684060349","https://openalex.org/W6736638932"],"related_works":["https://openalex.org/W2893117232","https://openalex.org/W2368982584","https://openalex.org/W957405543","https://openalex.org/W2100154643","https://openalex.org/W81629128","https://openalex.org/W2326159057","https://openalex.org/W1965743066","https://openalex.org/W1979157137","https://openalex.org/W2949086270","https://openalex.org/W1968447035"],"abstract_inverted_index":{"The":[0,139],"Silicon":[1],"Interconnect":[2],"Fabric":[3],"(Si-IF)":[4],"is":[5,33,86],"a":[6,17,43,46,72,145,180],"heterogenous":[7],"integration":[8],"platform":[9],"where":[10],"heterogeneous":[11],"bare":[12],"dies":[13],"are":[14],"bonded":[15,56],"to":[16,35,53,63,96,111,124,132,155,172,190,214],"Si":[18],"substrate":[19],"at":[20],"fine":[21,37],"die-to-wafer":[22,38],"interconnect":[23,39,58],"pitches":[24],"(2-10":[25],"\u03bcm),":[26],"Since":[27],"Cu-Cu":[28],"thermo":[29],"compression":[30],"bonding":[31],"(TCB)":[32],"needed":[34],"enable":[36],"pitches,":[40],"there":[41],"arises":[42],"need":[44],"for":[45,88,232,250],"novel":[47,73],"low":[48],"thermal-budget":[49],"passivation":[50,89],"thin":[51,79,201],"film":[52,80],"protect":[54],"the":[55,91,116,130,194,211],"Cu":[57,65,196,221],"pillars":[59],"against":[60],"moisture":[61,174],"ingress":[62,175],"prevent":[64],"oxidation.":[66],"In":[67,219],"this":[68],"paper,":[69],"we":[70],"present":[71],"low-thermal":[74],"budget":[75],"(130":[76],"\u00b0C)":[77],"bilayer":[78,131,200],"made":[81],"of":[82,90,108,121,182,208,217,223],"SiNx/Parylene":[83],"C,":[84],"which":[85],"used":[87,171],"Si-IF.":[92],"Parylene":[93,109,122],"C":[94,110,123],"adhesion":[95,101,161],"SiNxwas":[97,112],"optimized":[98],"using":[99,115],"an":[100],"promoter":[102],"under":[103],"various":[104,224],"annealing":[105],"conditions.":[106],"Adhesion":[107,120],"then":[113],"tested":[114,231],"ASTM":[117],"D3359":[118],"standard.":[119],"SiNxsubstrate":[125],"was":[126,142,169,188,244],"evaluated":[127],"after":[128,236,248],"subjecting":[129],"\u201c85/85\u201d":[133,167],"Steady-State":[134],"Humidity":[135],"Life":[136],"Test":[137],"standard\u201d.":[138],"tape":[140],"test":[141,165,168],"performed":[143],"on":[144],"passivated":[146,198,229],"sample":[147],"every":[148],"24":[149],"hours":[150,216],"during":[151],"humidity":[152],"testing":[153,249],"up":[154,213],"144":[156],"hours.":[157,184,252],"Results":[158],"show":[159],"that":[160],"remains":[162],"constant":[163],"throughout":[164],"duration.":[166],"also":[170],"study":[173],"induced":[176],"failure":[177],"mechanisms":[178],"in":[179,193,210,241],"period":[181],"168":[183,215,251],"X-Ray":[185],"Diffraction":[186],"(XRD)":[187],"utilized":[189],"detect":[191],"oxidation":[192,209],"blanket":[195],"samples":[197,212],"with":[199],"film.":[202],"XRD":[203],"scans":[204],"showed":[205],"no":[206],"signs":[207],"testing.":[218],"addition,":[220],"interconnects":[222],"widths":[225],"(10-100":[226],"\u03bcm)":[227],"were":[228],"and":[230],"electrical":[233],"resistance":[234,243],"change":[235],"similar":[237],"stress":[238],"time.":[239],"Change":[240],"average":[242],"less":[245],"than":[246],"3%":[247]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}