{"id":"https://openalex.org/W2944821157","doi":"https://doi.org/10.1109/irps.2019.8720501","title":"Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression","display_name":"Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression","publication_year":2019,"publication_date":"2019-03-01","ids":{"openalex":"https://openalex.org/W2944821157","doi":"https://doi.org/10.1109/irps.2019.8720501","mag":"2944821157"},"language":"en","primary_location":{"id":"doi:10.1109/irps.2019.8720501","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2019.8720501","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111554563","display_name":"Hideaki Tsuchiya","orcid":null},"institutions":[{"id":"https://openalex.org/I65143321","display_name":"Hitachi (Japan)","ror":"https://ror.org/02exqgm79","country_code":"JP","type":"company","lineage":["https://openalex.org/I65143321"]},{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Hideaki Tsuchiya","raw_affiliation_strings":["Advanced Device Technology Department, Renesas Electronics Corporation, Hitachinaka, Ibaraki, Japan"],"affiliations":[{"raw_affiliation_string":"Advanced Device Technology Department, Renesas Electronics Corporation, Hitachinaka, Ibaraki, Japan","institution_ids":["https://openalex.org/I4210153176","https://openalex.org/I65143321"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069165104","display_name":"N. Suzumura","orcid":null},"institutions":[{"id":"https://openalex.org/I65143321","display_name":"Hitachi (Japan)","ror":"https://ror.org/02exqgm79","country_code":"JP","type":"company","lineage":["https://openalex.org/I65143321"]},{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Naohito Suzumura","raw_affiliation_strings":["Advanced Device Technology Department, Renesas Electronics Corporation, Hitachinaka, Ibaraki, Japan"],"affiliations":[{"raw_affiliation_string":"Advanced Device Technology Department, Renesas Electronics Corporation, Hitachinaka, Ibaraki, Japan","institution_ids":["https://openalex.org/I4210153176","https://openalex.org/I65143321"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112435712","display_name":"Ryuji Shibata","orcid":null},"institutions":[{"id":"https://openalex.org/I65143321","display_name":"Hitachi (Japan)","ror":"https://ror.org/02exqgm79","country_code":"JP","type":"company","lineage":["https://openalex.org/I65143321"]},{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Ryuji Shibata","raw_affiliation_strings":["Advanced Device Technology Department, Renesas Electronics Corporation, Hitachinaka, Ibaraki, Japan"],"affiliations":[{"raw_affiliation_string":"Advanced Device Technology Department, Renesas Electronics Corporation, Hitachinaka, Ibaraki, Japan","institution_ids":["https://openalex.org/I4210153176","https://openalex.org/I65143321"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032104320","display_name":"H. Aono","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]},{"id":"https://openalex.org/I65143321","display_name":"Hitachi (Japan)","ror":"https://ror.org/02exqgm79","country_code":"JP","type":"company","lineage":["https://openalex.org/I65143321"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hideki Aono","raw_affiliation_strings":["Advanced Device Technology Department, Renesas Electronics Corporation, Hitachinaka, Ibaraki, Japan"],"affiliations":[{"raw_affiliation_string":"Advanced Device Technology Department, Renesas Electronics Corporation, Hitachinaka, Ibaraki, Japan","institution_ids":["https://openalex.org/I4210153176","https://openalex.org/I65143321"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102286096","display_name":"Makoto Ogasawara","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]},{"id":"https://openalex.org/I65143321","display_name":"Hitachi (Japan)","ror":"https://ror.org/02exqgm79","country_code":"JP","type":"company","lineage":["https://openalex.org/I65143321"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Makoto Ogasawara","raw_affiliation_strings":["Advanced Device Technology Department, Renesas Electronics Corporation, Hitachinaka, Ibaraki, Japan"],"affiliations":[{"raw_affiliation_string":"Advanced Device Technology Department, Renesas Electronics Corporation, Hitachinaka, Ibaraki, Japan","institution_ids":["https://openalex.org/I4210153176","https://openalex.org/I65143321"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035522595","display_name":"Toshihiko Akiba","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Toshihiko Akiba","raw_affiliation_strings":["LSI Package Development Department, Renesas Electronics Corporation, Kodaira, Tokyo, Japan"],"affiliations":[{"raw_affiliation_string":"LSI Package Development Department, Renesas Electronics Corporation, Kodaira, Tokyo, Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080123995","display_name":"Kenji Sakata","orcid":"https://orcid.org/0000-0002-6312-8912"},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kenji Sakata","raw_affiliation_strings":["LSI Package Development Department, Renesas Electronics Corporation, Kodaira, Tokyo, Japan"],"affiliations":[{"raw_affiliation_string":"LSI Package Development Department, Renesas Electronics Corporation, Kodaira, Tokyo, Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113999552","display_name":"Kazuyuki Nakagawa","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kazuyuki Nakagawa","raw_affiliation_strings":["LSI Package Development Department, Renesas Electronics Corporation, Kodaira, Tokyo, Japan"],"affiliations":[{"raw_affiliation_string":"LSI Package Development Department, Renesas Electronics Corporation, Kodaira, Tokyo, Japan","institution_ids":["https://openalex.org/I4210153176"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5082198488","display_name":"Takuo Funaya","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takuo Funaya","raw_affiliation_strings":["LSI Package Development Department, Renesas Electronics Corporation, Kodaira, Tokyo, Japan"],"affiliations":[{"raw_affiliation_string":"LSI Package Development Department, Renesas Electronics Corporation, Kodaira, Tokyo, Japan","institution_ids":["https://openalex.org/I4210153176"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5111554563"],"corresponding_institution_ids":["https://openalex.org/I4210153176","https://openalex.org/I65143321"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.03258992,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.9658781290054321},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.8220691680908203},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8001501560211182},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7790235280990601},{"id":"https://openalex.org/keywords/pillar","display_name":"Pillar","score":0.6504580974578857},{"id":"https://openalex.org/keywords/failure-mode-and-effects-analysis","display_name":"Failure mode and effects analysis","score":0.6163789629936218},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.5981267690658569},{"id":"https://openalex.org/keywords/diffusion-barrier","display_name":"Diffusion barrier","score":0.47978121042251587},{"id":"https://openalex.org/keywords/palladium","display_name":"Palladium","score":0.4558923542499542},{"id":"https://openalex.org/keywords/diffusion","display_name":"Diffusion","score":0.4395748972892761},{"id":"https://openalex.org/keywords/nickel","display_name":"Nickel","score":0.41975969076156616},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.33511918783187866},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.3279688358306885},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.08997607231140137},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.06023728847503662}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9658781290054321},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8220691680908203},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8001501560211182},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7790235280990601},{"id":"https://openalex.org/C105289051","wikidata":"https://www.wikidata.org/wiki/Q1930094","display_name":"Pillar","level":2,"score":0.6504580974578857},{"id":"https://openalex.org/C66283442","wikidata":"https://www.wikidata.org/wiki/Q1389268","display_name":"Failure mode and effects analysis","level":2,"score":0.6163789629936218},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.5981267690658569},{"id":"https://openalex.org/C2778836790","wikidata":"https://www.wikidata.org/wiki/Q5275435","display_name":"Diffusion barrier","level":3,"score":0.47978121042251587},{"id":"https://openalex.org/C502130503","wikidata":"https://www.wikidata.org/wiki/Q1089","display_name":"Palladium","level":3,"score":0.4558923542499542},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.4395748972892761},{"id":"https://openalex.org/C504270822","wikidata":"https://www.wikidata.org/wiki/Q744","display_name":"Nickel","level":2,"score":0.41975969076156616},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.33511918783187866},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.3279688358306885},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.08997607231140137},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.06023728847503662},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C161790260","wikidata":"https://www.wikidata.org/wiki/Q82264","display_name":"Catalysis","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps.2019.8720501","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2019.8720501","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1518992349","https://openalex.org/W1589055794","https://openalex.org/W1600292568","https://openalex.org/W1970180601","https://openalex.org/W2011089787","https://openalex.org/W2022458231","https://openalex.org/W2058479907","https://openalex.org/W2061883437","https://openalex.org/W2105951391","https://openalex.org/W2126920592","https://openalex.org/W2137275622","https://openalex.org/W2289113703","https://openalex.org/W2545944470","https://openalex.org/W2776903783","https://openalex.org/W6680471382"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2138118262","https://openalex.org/W2542708587","https://openalex.org/W4229007131","https://openalex.org/W2364197307","https://openalex.org/W4381800218","https://openalex.org/W2034853009","https://openalex.org/W2991870636","https://openalex.org/W2029363190"],"abstract_inverted_index":{"The":[0,24],"lifetime":[1,35],"distribution":[2,36],"of":[3,60,74,90],"electromigration":[4],"in":[5,57],"a":[6,29,33,54,87],"Cu":[7,25,76],"pillar":[8,26],"interconnection":[9,27],"with":[10,28],"Electroless":[11,13],"Nickel":[12],"Palladium":[14],"Immersion":[15],"Gold":[16],"(ENEPIG":[17],"or":[18],"Ni-P/Pd/Au)":[19],"pad":[20,49],"finish":[21,50],"was":[22,42],"investigated.":[23],"Ni":[30,45,68],"cap":[31,69],"showed":[32],"bimodal":[34],"under":[37],"high":[38],"current":[39],"stressing.":[40],"It":[41],"found":[43],"that":[44],"diffusion":[46],"from":[47],"the":[48,58,67,72,75,91],"to":[51,79],"solder":[52,80],"plays":[53],"key":[55],"role":[56],"mechanism":[59],"this":[61],"early":[62,92],"failure":[63],"mode.":[64],"By":[65],"removing":[66],"and":[70],"increasing":[71],"ratio":[73],"post":[77],"diameter":[78],"resist":[81],"opening":[82],"size,":[83],"we":[84],"could":[85],"achieve":[86],"significant":[88],"suppression":[89],"failure.":[93]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}