{"id":"https://openalex.org/W2945057316","doi":"https://doi.org/10.1109/irps.2019.8720457","title":"From Device Aging Physics to Automated Circuit Reliability Sign Off","display_name":"From Device Aging Physics to Automated Circuit Reliability Sign Off","publication_year":2019,"publication_date":"2019-03-01","ids":{"openalex":"https://openalex.org/W2945057316","doi":"https://doi.org/10.1109/irps.2019.8720457","mag":"2945057316"},"language":"en","primary_location":{"id":"doi:10.1109/irps.2019.8720457","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2019.8720457","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5000945421","display_name":"Christian Schl\u00fcnder","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Christian Schlunder","raw_affiliation_strings":["Design Enabling & Services Department, Infineon Technologies AG, Germany"],"affiliations":[{"raw_affiliation_string":"Design Enabling & Services Department, Infineon Technologies AG, Germany","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112915941","display_name":"Katja Waschneck","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Katja Waschneck","raw_affiliation_strings":["Reliability & Qualification Department, Infineon Technologies AG, Germany"],"affiliations":[{"raw_affiliation_string":"Reliability & Qualification Department, Infineon Technologies AG, Germany","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075302237","display_name":"P. Rotter","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Peter Rotter","raw_affiliation_strings":["Design Enabling & Services Department, Infineon Technologies AG, Germany"],"affiliations":[{"raw_affiliation_string":"Design Enabling & Services Department, Infineon Technologies AG, Germany","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039437602","display_name":"Susanne Lachenmann","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Susanne Lachenmann","raw_affiliation_strings":["Design Enabling & Services Department, Infineon Technologies AG, Germany"],"affiliations":[{"raw_affiliation_string":"Design Enabling & Services Department, Infineon Technologies AG, Germany","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081937576","display_name":"H. Reisinger","orcid":"https://orcid.org/0000-0001-6776-349X"},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Hans Reisinger","raw_affiliation_strings":["Reliability & Qualification Department, Infineon Technologies AG, Germany"],"affiliations":[{"raw_affiliation_string":"Reliability & Qualification Department, Infineon Technologies AG, Germany","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027644540","display_name":"F. Ungar","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Franz Ungar","raw_affiliation_strings":["Design Enabling & Services Department, Infineon Technologies AG, Germany"],"affiliations":[{"raw_affiliation_string":"Design Enabling & Services Department, Infineon Technologies AG, Germany","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5015790505","display_name":"Georg Georgakos","orcid":"https://orcid.org/0009-0006-4695-4637"},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Georg Georgakos","raw_affiliation_strings":["Design Enabling & Services Department, Infineon Technologies AG, Germany"],"affiliations":[{"raw_affiliation_string":"Design Enabling & Services Department, Infineon Technologies AG, Germany","institution_ids":["https://openalex.org/I137594350"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5000945421"],"corresponding_institution_ids":["https://openalex.org/I137594350"],"apc_list":null,"apc_paid":null,"fwci":0.3577,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.59748616,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"12"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7723130583763123},{"id":"https://openalex.org/keywords/electronic-design-automation","display_name":"Electronic design automation","score":0.653117835521698},{"id":"https://openalex.org/keywords/automation","display_name":"Automation","score":0.6233927607536316},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.6113914847373962},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6052698493003845},{"id":"https://openalex.org/keywords/task","display_name":"Task (project management)","score":0.6026502251625061},{"id":"https://openalex.org/keywords/circuit-reliability","display_name":"Circuit reliability","score":0.5835700035095215},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5283268690109253},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.5144462585449219},{"id":"https://openalex.org/keywords/product","display_name":"Product (mathematics)","score":0.43571770191192627},{"id":"https://openalex.org/keywords/product-design","display_name":"Product design","score":0.43566659092903137},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.4284239411354065},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.41502898931503296},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.39352431893348694},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3362444043159485},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.2849401831626892},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27376508712768555},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2525861859321594},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.06628063321113586}],"concepts":[{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7723130583763123},{"id":"https://openalex.org/C64260653","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design automation","level":2,"score":0.653117835521698},{"id":"https://openalex.org/C115901376","wikidata":"https://www.wikidata.org/wiki/Q184199","display_name":"Automation","level":2,"score":0.6233927607536316},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.6113914847373962},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6052698493003845},{"id":"https://openalex.org/C2780451532","wikidata":"https://www.wikidata.org/wiki/Q759676","display_name":"Task (project management)","level":2,"score":0.6026502251625061},{"id":"https://openalex.org/C2778309119","wikidata":"https://www.wikidata.org/wiki/Q5121614","display_name":"Circuit reliability","level":4,"score":0.5835700035095215},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5283268690109253},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.5144462585449219},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.43571770191192627},{"id":"https://openalex.org/C120823896","wikidata":"https://www.wikidata.org/wiki/Q1043226","display_name":"Product design","level":3,"score":0.43566659092903137},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4284239411354065},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.41502898931503296},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.39352431893348694},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3362444043159485},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.2849401831626892},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27376508712768555},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2525861859321594},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.06628063321113586},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps.2019.8720457","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2019.8720457","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE International Reliability Physics Symposium (IRPS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.5199999809265137}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":23,"referenced_works":["https://openalex.org/W1514948031","https://openalex.org/W1537720823","https://openalex.org/W1917961388","https://openalex.org/W1957474874","https://openalex.org/W2010906761","https://openalex.org/W2031517912","https://openalex.org/W2104946435","https://openalex.org/W2114859176","https://openalex.org/W2143097907","https://openalex.org/W2147381694","https://openalex.org/W2153685625","https://openalex.org/W2157180100","https://openalex.org/W2161687201","https://openalex.org/W2524699596","https://openalex.org/W2533493724","https://openalex.org/W2544741739","https://openalex.org/W2548602630","https://openalex.org/W2580436849","https://openalex.org/W2621242658","https://openalex.org/W2784109122","https://openalex.org/W2898581147","https://openalex.org/W2920836843","https://openalex.org/W6732010037"],"related_works":["https://openalex.org/W2744643496","https://openalex.org/W2391863233","https://openalex.org/W1970528334","https://openalex.org/W1992128702","https://openalex.org/W2048419807","https://openalex.org/W1563430967","https://openalex.org/W2039041127","https://openalex.org/W3075611072","https://openalex.org/W1974416117","https://openalex.org/W4391129830"],"abstract_inverted_index":{"For":[0],"modern":[1],"semiconductor":[2],"product":[3],"design,":[4],"reliability":[5,42,84],"aspects":[6],"have":[7,29],"to":[8,30,34,51,81],"be":[9,78],"considered":[10],"not":[11],"only":[12],"for":[13,73],"technology":[14],"process":[15],"development":[16],"but":[17],"inevitable":[18],"also":[19],"during":[20],"circuit":[21,32,45],"design":[22,25],"phase.":[23],"Electronic":[24],"automation":[26],"tools":[27,71],"(EDA)":[28],"support":[31],"designers":[33,48],"analyze":[35],"the":[36,44,53,57,60,64],"impact":[37],"of":[38,56,63],"device":[39],"and":[40],"interconnect":[41],"on":[43],"behavior.":[46],"The":[47],"task":[49],"is":[50],"ensure":[52],"specified":[54],"characteristic":[55],"circuits":[58],"throughout":[59],"entire":[61],"lifetime":[62],"product.":[65],"Meanwhile":[66],"there":[67],"are":[68],"many":[69],"different":[70],"available":[72],"this":[74],"task.":[75],"They":[76],"can":[77],"categorized":[79],"according":[80],"their":[82],"basic":[83],"assessment":[85],"approach.":[86]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}