{"id":"https://openalex.org/W1537946400","doi":"https://doi.org/10.1109/irps.2015.7112801","title":"Short localization in CPU FlipChip using thermal imaging and magnetic current imaging: Advanced fault isolation technique comparison","display_name":"Short localization in CPU FlipChip using thermal imaging and magnetic current imaging: Advanced fault isolation technique comparison","publication_year":2015,"publication_date":"2015-04-01","ids":{"openalex":"https://openalex.org/W1537946400","doi":"https://doi.org/10.1109/irps.2015.7112801","mag":"1537946400"},"language":"en","primary_location":{"id":"doi:10.1109/irps.2015.7112801","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2015.7112801","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Reliability Physics Symposium","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019808670","display_name":"Jan O. Gaudestad","orcid":null},"institutions":[{"id":"https://openalex.org/I4210141219","display_name":"Neocera (United States)","ror":"https://ror.org/03exvmb50","country_code":"US","type":"company","lineage":["https://openalex.org/I4210141219"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Jan Gaudestad","raw_affiliation_strings":["Neocera, LLC, Beltsville, MD, USA","Neocera, LLC, 10000 Virginia Manor Rd., Beltsville, MD 20705, USA"],"affiliations":[{"raw_affiliation_string":"Neocera, LLC, Beltsville, MD, USA","institution_ids":["https://openalex.org/I4210141219"]},{"raw_affiliation_string":"Neocera, LLC, 10000 Virginia Manor Rd., Beltsville, MD 20705, USA","institution_ids":["https://openalex.org/I4210141219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075572496","display_name":"Antonio Orozco","orcid":null},"institutions":[{"id":"https://openalex.org/I4210141219","display_name":"Neocera (United States)","ror":"https://ror.org/03exvmb50","country_code":"US","type":"company","lineage":["https://openalex.org/I4210141219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Antonio Orozco","raw_affiliation_strings":["Neocera, LLC, Beltsville, MD, USA","Neocera, LLC, 10000 Virginia Manor Rd., Beltsville, MD 20705, USA"],"affiliations":[{"raw_affiliation_string":"Neocera, LLC, Beltsville, MD, USA","institution_ids":["https://openalex.org/I4210141219"]},{"raw_affiliation_string":"Neocera, LLC, 10000 Virginia Manor Rd., Beltsville, MD 20705, USA","institution_ids":["https://openalex.org/I4210141219"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077015329","display_name":"Jack Chen","orcid":"https://orcid.org/0000-0003-4693-5234"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jack Chen","raw_affiliation_strings":["Honyang Global Technology Co., LTD, Hsinchu County, Taiwan","Honyang Global Technology Co., LTD, 10F-6, No. 8, Zihciang S. Rd. Jhubei City, Hsinchu County 302, Taiwan"],"affiliations":[{"raw_affiliation_string":"Honyang Global Technology Co., LTD, Hsinchu County, Taiwan","institution_ids":[]},{"raw_affiliation_string":"Honyang Global Technology Co., LTD, 10F-6, No. 8, Zihciang S. Rd. Jhubei City, Hsinchu County 302, Taiwan","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5019808670"],"corresponding_institution_ids":["https://openalex.org/I4210141219"],"apc_list":null,"apc_paid":null,"fwci":0.1973,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.55771353,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"FA.3.1","last_page":"FA.3.5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9959999918937683,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11856","display_name":"Thermography and Photoacoustic Techniques","score":0.9883000254631042,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6314232349395752},{"id":"https://openalex.org/keywords/offset","display_name":"Offset (computer science)","score":0.6241729259490967},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5167702436447144},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.4828105866909027},{"id":"https://openalex.org/keywords/fault-detection-and-isolation","display_name":"Fault detection and isolation","score":0.4712543785572052},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.42059171199798584},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.36431121826171875},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.26983579993247986},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18631300330162048},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1343475580215454}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6314232349395752},{"id":"https://openalex.org/C175291020","wikidata":"https://www.wikidata.org/wiki/Q1156822","display_name":"Offset (computer science)","level":2,"score":0.6241729259490967},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5167702436447144},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4828105866909027},{"id":"https://openalex.org/C152745839","wikidata":"https://www.wikidata.org/wiki/Q5438153","display_name":"Fault detection and isolation","level":3,"score":0.4712543785572052},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.42059171199798584},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.36431121826171875},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.26983579993247986},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18631300330162048},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1343475580215454},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C172707124","wikidata":"https://www.wikidata.org/wiki/Q423488","display_name":"Actuator","level":2,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps.2015.7112801","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2015.7112801","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Reliability Physics Symposium","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1975756527","https://openalex.org/W2066876292","https://openalex.org/W2113821998","https://openalex.org/W2123872245","https://openalex.org/W2144402917","https://openalex.org/W2168094804","https://openalex.org/W2529216533","https://openalex.org/W3116626063","https://openalex.org/W6644065918","https://openalex.org/W6728481278","https://openalex.org/W6787599838"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W3011831393","https://openalex.org/W2518845051","https://openalex.org/W2017572878","https://openalex.org/W2389680235","https://openalex.org/W3022853057","https://openalex.org/W2895059647","https://openalex.org/W2377728464","https://openalex.org/W2366625390","https://openalex.org/W4388308858"],"abstract_inverted_index":{"Magnetic":[0],"Current":[1],"Imaging":[2],"(MCI)":[3],"and":[4],"static":[5],"Thermal":[6],"Emission":[7],"(TE),":[8],"two":[9,42],"commonly":[10],"used":[11],"Electrical":[12],"Fault":[13],"Isolation":[14],"(EFI)":[15],"tools,":[16],"are":[17],"compared":[18],"on":[19,63],"their":[20],"ability":[21],"to":[22,60],"localize":[23],"a":[24,28,54],"short":[25,36],"defect":[26],"in":[27],"mobile":[29],"device":[30],"central":[31],"processing":[32],"unit":[33],"(CPU).":[34],"The":[35],"was":[37],"localized":[38],"by":[39],"MCI":[40],"between":[41],"micro":[43],"bumps":[44],"below":[45],"the":[46,64],"100\u03bcm":[47],"thick":[48],"silicon":[49],"die":[50,65],"while":[51],"TE":[52],"detected":[53],"thermal":[55],"signal":[56],"slightly":[57],"offset":[58],"due":[59],"laser":[61],"scribing":[62],"surface.":[66]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2016,"cited_by_count":1}],"updated_date":"2026-02-25T23:00:34.991745","created_date":"2025-10-10T00:00:00"}