{"id":"https://openalex.org/W1580474714","doi":"https://doi.org/10.1109/irps.2015.7112733","title":"Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM","display_name":"Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM","publication_year":2015,"publication_date":"2015-04-01","ids":{"openalex":"https://openalex.org/W1580474714","doi":"https://doi.org/10.1109/irps.2015.7112733","mag":"1580474714"},"language":"en","primary_location":{"id":"doi:10.1109/irps.2015.7112733","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2015.7112733","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Reliability Physics Symposium","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101899300","display_name":"Kangwook Lee","orcid":"https://orcid.org/0000-0002-3360-9678"},"institutions":[{"id":"https://openalex.org/I201726411","display_name":"United Arab Emirates University","ror":"https://ror.org/01km6p862","country_code":"AE","type":"education","lineage":["https://openalex.org/I201726411"]}],"countries":["AE"],"is_corresponding":true,"raw_author_name":"Kang-Wook Lee","raw_affiliation_strings":["Department of Mechanical Engineering, United Arab Emirates University, Al Ain, UAE","[Department of Mechanical Engineering, United Arab Emirates University, Al Ain, UAE]"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, United Arab Emirates University, Al Ain, UAE","institution_ids":["https://openalex.org/I201726411"]},{"raw_affiliation_string":"[Department of Mechanical Engineering, United Arab Emirates University, Al Ain, UAE]","institution_ids":["https://openalex.org/I201726411"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113819122","display_name":"Ji-Chel Bea","orcid":null},"institutions":[{"id":"https://openalex.org/I201726411","display_name":"United Arab Emirates University","ror":"https://ror.org/01km6p862","country_code":"AE","type":"education","lineage":["https://openalex.org/I201726411"]}],"countries":["AE"],"is_corresponding":false,"raw_author_name":"Ji-Chel Bea","raw_affiliation_strings":["Department of Electrical Engineering, United Arab Emirates University, AlAin, UAE","[Department of Electrical Engineering, United Arab Emirates University, AlAin, UAE]"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, United Arab Emirates University, AlAin, UAE","institution_ids":["https://openalex.org/I201726411"]},{"raw_affiliation_string":"[Department of Electrical Engineering, United Arab Emirates University, AlAin, UAE]","institution_ids":["https://openalex.org/I201726411"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101440058","display_name":"M. Murugesan","orcid":"https://orcid.org/0000-0002-3510-7110"},"institutions":[{"id":"https://openalex.org/I201726411","display_name":"United Arab Emirates University","ror":"https://ror.org/01km6p862","country_code":"AE","type":"education","lineage":["https://openalex.org/I201726411"]}],"countries":["AE"],"is_corresponding":false,"raw_author_name":"Mariappan Murugesan","raw_affiliation_strings":["Department of Electrical Engineering, United Arab Emirates University, AlAin, UAE","[Department of Electrical Engineering, United Arab Emirates University, AlAin, UAE]"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, United Arab Emirates University, AlAin, UAE","institution_ids":["https://openalex.org/I201726411"]},{"raw_affiliation_string":"[Department of Electrical Engineering, United Arab Emirates University, AlAin, UAE]","institution_ids":["https://openalex.org/I201726411"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takafumi Fukushima","raw_affiliation_strings":["Tohoku University, Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Tetsu Tanaka","raw_affiliation_strings":["MEN - Biomedical Engineering"],"affiliations":[{"raw_affiliation_string":"MEN - Biomedical Engineering","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059487693","display_name":"Mitsumasa Koyanagi","orcid":"https://orcid.org/0000-0003-4726-4217"},"institutions":[{"id":"https://openalex.org/I137844521","display_name":"Hatch (Canada)","ror":"https://ror.org/017fcpb94","country_code":"CA","type":"company","lineage":["https://openalex.org/I137844521"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Mitsumasa Koyanagi","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe)"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe)","institution_ids":["https://openalex.org/I137844521"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5101899300"],"corresponding_institution_ids":["https://openalex.org/I201726411"],"apc_list":null,"apc_paid":null,"fwci":0.5918,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.7103733,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":"32","issue":null,"first_page":"4C.2.1","last_page":"4C.2.6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.95447838306427},{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.7626466751098633},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.721001148223877},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.47950583696365356},{"id":"https://openalex.org/keywords/data-retention","display_name":"Data retention","score":0.42685163021087646},{"id":"https://openalex.org/keywords/dynamic-random-access-memory","display_name":"Dynamic random-access memory","score":0.4149317145347595},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.41430747509002686},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.37020158767700195},{"id":"https://openalex.org/keywords/analytical-chemistry","display_name":"Analytical Chemistry (journal)","score":0.34215715527534485},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2951144576072693},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.2755011320114136},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.2058989703655243},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1775115728378296},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.12290966510772705},{"id":"https://openalex.org/keywords/chromatography","display_name":"Chromatography","score":0.1089499294757843}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.95447838306427},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.7626466751098633},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.721001148223877},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.47950583696365356},{"id":"https://openalex.org/C2780866740","wikidata":"https://www.wikidata.org/wiki/Q5227345","display_name":"Data retention","level":2,"score":0.42685163021087646},{"id":"https://openalex.org/C118702147","wikidata":"https://www.wikidata.org/wiki/Q189396","display_name":"Dynamic random-access memory","level":3,"score":0.4149317145347595},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.41430747509002686},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37020158767700195},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.34215715527534485},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2951144576072693},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.2755011320114136},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.2058989703655243},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1775115728378296},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.12290966510772705},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.1089499294757843},{"id":"https://openalex.org/C98986596","wikidata":"https://www.wikidata.org/wiki/Q1143031","display_name":"Semiconductor memory","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps.2015.7112733","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2015.7112733","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Reliability Physics Symposium","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Sustainable cities and communities","id":"https://metadata.un.org/sdg/11","score":0.4000000059604645}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":23,"referenced_works":["https://openalex.org/W1970164715","https://openalex.org/W1999095731","https://openalex.org/W2009195513","https://openalex.org/W2009824414","https://openalex.org/W2011694493","https://openalex.org/W2015217276","https://openalex.org/W2035113186","https://openalex.org/W2036404459","https://openalex.org/W2056399224","https://openalex.org/W2057450859","https://openalex.org/W2061191508","https://openalex.org/W2064676658","https://openalex.org/W2080451420","https://openalex.org/W2096042906","https://openalex.org/W2096991703","https://openalex.org/W2105978452","https://openalex.org/W2127622913","https://openalex.org/W2130095812","https://openalex.org/W2144149750","https://openalex.org/W2151613126","https://openalex.org/W2532338040","https://openalex.org/W6659957655","https://openalex.org/W6681541026"],"related_works":["https://openalex.org/W2074922484","https://openalex.org/W2130607063","https://openalex.org/W2063061014","https://openalex.org/W2149227206","https://openalex.org/W2001316072","https://openalex.org/W2473808647","https://openalex.org/W3004383742","https://openalex.org/W2105633922","https://openalex.org/W2540867894","https://openalex.org/W2067914900"],"abstract_inverted_index":{"Impacts":[0],"of":[1,17,66,110,117],"3-D":[2],"integration":[3],"processes":[4],"on":[5,23],"device":[6],"reliabilities":[7],"in":[8,34,58,69,98,159],"thinned":[9,71,100],"DRAM":[10,67,72,101,161],"chip":[11,26,73,102,162],"were":[12,20,43],"evaluated.":[13],"The":[14,63,114],"retention":[15,41,64,96,115],"characteristics":[16,42,65,97,116],"memory":[18,119],"cells":[19],"degraded":[21,30,47,54,78],"depending":[22],"the":[24,35,40,59,70,84,95,99,111,140,160],"decreased":[25],"thickness,":[27,51],"especially":[28],"dramatically":[29,77],"below":[31,55],"40-\u03bcm":[32],"thickness":[33,57],"case":[36,60],"with":[37,122],"under-fill,":[38],"meanwhile,":[39],"relatively":[44],"not":[45,107],"so":[46],"until":[48],"to":[49,127],"30-\u03bcm":[50],"but":[52],"suddenly":[53],"20-\u03bcm":[56],"without":[61],"under-fill.":[62],"cell":[68,120],"which":[74,103],"was":[75,104],"CMP-treated":[76],"after":[79,129],"intentional":[80],"Cu":[81,123,151],"diffusion":[82],"from":[83],"backside":[85],"surface":[86],"at":[87,131],"300":[88,132],"<sup":[89,133,147],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[90,134,148],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">o</sup>":[91,135,149],"C":[92,136],"annealing.":[93],"Meanwhile,":[94],"DP-treated":[105],"did":[106],"degrade":[108,128],"regardless":[109],"well":[112],"structure.":[113],"some":[118],"arrays":[121,125],"TSV":[124],"began":[126],"annealing":[130,141],"for":[137],"30min.":[138],"As":[139],"temperature":[142],"increase":[143],"higher":[144],"than":[145],"400":[146],"C,":[150],"atoms":[152],"more":[153],"spread":[154],"out":[155],"into":[156],"larger":[157],"area":[158],"via":[163],"poor":[164],"barrier":[165],"layers.":[166]},"counts_by_year":[{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}