{"id":"https://openalex.org/W1571415011","doi":"https://doi.org/10.1109/irps.2015.7112732","title":"Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability","display_name":"Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability","publication_year":2015,"publication_date":"2015-04-01","ids":{"openalex":"https://openalex.org/W1571415011","doi":"https://doi.org/10.1109/irps.2015.7112732","mag":"1571415011"},"language":"en","primary_location":{"id":"doi:10.1109/irps.2015.7112732","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2015.7112732","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Reliability Physics Symposium","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5000312313","display_name":"Mukta Farooq","orcid":"https://orcid.org/0009-0009-5641-1398"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"M. G. Farooq","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090403345","display_name":"Giuseppe La Rosa","orcid":"https://orcid.org/0000-0003-2714-3493"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. La Rosa","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110263288","display_name":"F. Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"F. Chen","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081182441","display_name":"Prakash Periasamy","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P. Periasamy","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086680692","display_name":"Troy Graves-Abe","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. L. Graves-Abe","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108429941","display_name":"C. Kothandaraman","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Kothandaraman","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089598712","display_name":"C. J. Collins","orcid":"https://orcid.org/0000-0001-9943-5714"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Collins","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087128831","display_name":"W. Landers","orcid":"https://orcid.org/0000-0001-7416-898X"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"W. Landers","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024125112","display_name":"Jennifer Oakley","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Oakley","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085263960","display_name":"J. Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Liu","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034793002","display_name":"John Safran","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Safran","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033374091","display_name":"Somnath Ghosh","orcid":"https://orcid.org/0000-0003-4311-3577"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Ghosh","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110892443","display_name":"S. Mittl","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Mittl","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005172598","display_name":"Dimitris P. Ioannou","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Ioannou","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001541684","display_name":"Carole Graas","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Graas","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063512602","display_name":"Daniel S. Berger","orcid":"https://orcid.org/0000-0002-3911-1512"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Berger","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5091022757","display_name":"Subramanian S. Iyer","orcid":"https://orcid.org/0000-0003-1220-031X"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. S. Iyer","raw_affiliation_strings":["IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]"],"affiliations":[{"raw_affiliation_string":"IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"[IBM Corporation, Semiconductor Research & Development Center, Hopewell Junction, NY 12533 USA]","institution_ids":["https://openalex.org/I1341412227"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":17,"corresponding_author_ids":["https://openalex.org/A5000312313"],"corresponding_institution_ids":["https://openalex.org/I1341412227"],"apc_list":null,"apc_paid":null,"fwci":0.7891,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.75155864,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"4C.1.1","last_page":"4C.1.8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/back-end-of-line","display_name":"Back end of line","score":0.9049113988876343},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.7898737192153931},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7163829207420349},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7141577005386353},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.6375170946121216},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.6197938323020935},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.542746365070343},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.5412942171096802},{"id":"https://openalex.org/keywords/trench","display_name":"Trench","score":0.5202480554580688},{"id":"https://openalex.org/keywords/shallow-trench-isolation","display_name":"Shallow trench isolation","score":0.45975399017333984},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.454680472612381},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.451923131942749},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.4487971067428589},{"id":"https://openalex.org/keywords/capacitor","display_name":"Capacitor","score":0.42657166719436646},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.40443646907806396},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.3902954161167145},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.3407439589500427},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3078896403312683},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.21569949388504028},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19489938020706177},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.16037023067474365},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.12650448083877563},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.10711786150932312}],"concepts":[{"id":"https://openalex.org/C2776628375","wikidata":"https://www.wikidata.org/wiki/Q4839229","display_name":"Back end of line","level":3,"score":0.9049113988876343},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.7898737192153931},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7163829207420349},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7141577005386353},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.6375170946121216},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.6197938323020935},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.542746365070343},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5412942171096802},{"id":"https://openalex.org/C155310634","wikidata":"https://www.wikidata.org/wiki/Q1852785","display_name":"Trench","level":3,"score":0.5202480554580688},{"id":"https://openalex.org/C105066941","wikidata":"https://www.wikidata.org/wiki/Q1424524","display_name":"Shallow trench isolation","level":4,"score":0.45975399017333984},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.454680472612381},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.451923131942749},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.4487971067428589},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.42657166719436646},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.40443646907806396},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3902954161167145},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.3407439589500427},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3078896403312683},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.21569949388504028},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19489938020706177},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.16037023067474365},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.12650448083877563},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.10711786150932312},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps.2015.7112732","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2015.7112732","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Reliability Physics Symposium","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1778573787","https://openalex.org/W1969486543","https://openalex.org/W1981220134","https://openalex.org/W1993142701","https://openalex.org/W2050832669","https://openalex.org/W2058032318","https://openalex.org/W2060061156","https://openalex.org/W2061141647","https://openalex.org/W2064263658","https://openalex.org/W2115829439","https://openalex.org/W2133543885","https://openalex.org/W2147960451","https://openalex.org/W2164381108"],"related_works":["https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2089377260","https://openalex.org/W2919724632","https://openalex.org/W2046139226","https://openalex.org/W2513353273","https://openalex.org/W2549021975","https://openalex.org/W2333804548","https://openalex.org/W2541572734","https://openalex.org/W2142764951"],"abstract_inverted_index":{"We":[0],"integrated":[1],"a":[2,10],"copper":[3],"TSV":[4,77,117,149],"(Through":[5],"Silicon":[6],"Via)":[7],"cell":[8],"in":[9,142],"qualified":[11],"32SOI":[12],"CMOS":[13],"logic":[14],"technology":[15],"with":[16,85],"high-K/metal":[17],"gate":[18],"and":[19,28,40,47,68,78,97,133],"DT":[20],"(Deep":[21],"Trench)":[22],"capacitors.":[23],"Extensive":[24],"wafer":[25],"level":[26],"characterization":[27],"reliability":[29,52,83,146],"stressing":[30],"were":[31],"performed":[32],"to":[33,87,125],"evaluate":[34],"the":[35,38,76,88,105,126],"impact":[36],"of":[37,50,75,95,101,144],"TSVs":[39],"3D":[41,107],"(3-Dimensional)":[42],"integration":[43,74],"processing":[44,150],"on":[45],"device":[46,132],"back":[48],"end":[49,143],"line":[51],"performance.":[53],"This":[54],"included":[55],"bias":[56],"temperature":[57],"instability":[58],"stress,":[59],"hot":[60],"carrier":[61],"injection,":[62],"thermal":[63],"cycling,":[64],"wiring":[65],"electromigration":[66],"testing,":[67],"time-dependent":[69],"dielectric":[70],"breakdown":[71],"studies.":[72],"The":[73],"process":[79],"shows":[80],"an":[81],"equivalent":[82],"performance":[84],"respect":[86],"2D":[89],"baseline":[90],"for":[91],"FEOL":[92],"(Front":[93],"End":[94,100],"Line)":[96,102],"BEOL":[98,120],"(Back":[99],"structures":[103,121],"within":[104],"assigned":[106],"design":[108,118],"rules.":[109],"In":[110],"particular":[111],"it":[112],"is":[113,139],"demonstrated":[114],"that":[115,137],"this":[116],"allows":[119],"at":[122],"zero":[123],"proximity":[124],"KOZ":[127],"(Keep":[128],"Out":[129],"Zone).":[130],"Further,":[131],"functional":[134],"data":[135],"indicate":[136],"there":[138],"no":[140],"change":[141],"life":[145],"targets":[147],"from":[148],"and/or":[151],"proximity.":[152]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}