{"id":"https://openalex.org/W1606311381","doi":"https://doi.org/10.1109/irps.2015.7112675","title":"Time-integrated photon emission as a function of temperature in 32 nm CMOS","display_name":"Time-integrated photon emission as a function of temperature in 32 nm CMOS","publication_year":2015,"publication_date":"2015-04-01","ids":{"openalex":"https://openalex.org/W1606311381","doi":"https://doi.org/10.1109/irps.2015.7112675","mag":"1606311381"},"language":"en","primary_location":{"id":"doi:10.1109/irps.2015.7112675","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2015.7112675","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Reliability Physics Symposium","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112583463","display_name":"Andrea Bahgat Shehata","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]},{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Andrea Bahgat Shehata","raw_affiliation_strings":["IBM T.J. Watson Research Center, Yorktown Heights, NY, USA","IBM T.J. Watson Research Center, Yorktown Heights, 10598 NY, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"IBM T.J. Watson Research Center, Yorktown Heights, NY, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM T.J. Watson Research Center, Yorktown Heights, 10598 NY, USA#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088957863","display_name":"Alan J. Weger","orcid":"https://orcid.org/0000-0001-8557-9573"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alan J. Weger","raw_affiliation_strings":["IBM T.J. Watson Research Center, Yorktown Heights, NY, USA","IBM T.J. Watson Research Center, Yorktown Heights, 10598 NY, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"IBM T.J. Watson Research Center, Yorktown Heights, NY, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM T.J. Watson Research Center, Yorktown Heights, 10598 NY, USA#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043549704","display_name":"Franco Stellari","orcid":"https://orcid.org/0000-0002-1510-6882"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Franco Stellari","raw_affiliation_strings":["IBM T.J. Watson Research Center, Yorktown Heights, NY, USA","IBM T.J. Watson Research Center, Yorktown Heights, 10598 NY, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"IBM T.J. Watson Research Center, Yorktown Heights, NY, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM T.J. Watson Research Center, Yorktown Heights, 10598 NY, USA#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080343787","display_name":"Peilin Song","orcid":"https://orcid.org/0000-0003-4793-3230"},"institutions":[{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]},{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Peilin Song","raw_affiliation_strings":["IBM T.J. Watson Research Center, Yorktown Heights, NY, USA","IBM T.J. Watson Research Center, Yorktown Heights, 10598 NY, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"IBM T.J. Watson Research Center, Yorktown Heights, NY, USA","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM T.J. Watson Research Center, Yorktown Heights, 10598 NY, USA#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028923909","display_name":"Herv\u00e9 Deslandes","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Herve Deslandes","raw_affiliation_strings":["DCG Systems, Fremont, CA, USA","DCG Systems, Fremont, 94538 CA, USA"],"affiliations":[{"raw_affiliation_string":"DCG Systems, Fremont, CA, USA","institution_ids":[]},{"raw_affiliation_string":"DCG Systems, Fremont, 94538 CA, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113560459","display_name":"Ted Lundquist","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ted Lundquist","raw_affiliation_strings":["DCG Systems, Fremont, CA, USA","DCG Systems, Fremont, 94538 CA, USA"],"affiliations":[{"raw_affiliation_string":"DCG Systems, Fremont, CA, USA","institution_ids":[]},{"raw_affiliation_string":"DCG Systems, Fremont, 94538 CA, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5065949849","display_name":"E. Ramsay","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Euan Ramsay","raw_affiliation_strings":["DCG Systems, Fremont, CA, USA","DCG Systems, Fremont, 94538 CA, USA"],"affiliations":[{"raw_affiliation_string":"DCG Systems, Fremont, CA, USA","institution_ids":[]},{"raw_affiliation_string":"DCG Systems, Fremont, 94538 CA, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5112583463"],"corresponding_institution_ids":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"],"apc_list":null,"apc_paid":null,"fwci":0.7891,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.75274951,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"2B.4.1","last_page":"2B.4.7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12466","display_name":"Near-Field Optical Microscopy","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.67759108543396},{"id":"https://openalex.org/keywords/leakage","display_name":"Leakage (economics)","score":0.6309592127799988},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6213544607162476},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.6049444675445557},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5837690830230713},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.5394561886787415},{"id":"https://openalex.org/keywords/sensitivity","display_name":"Sensitivity (control systems)","score":0.5047441720962524},{"id":"https://openalex.org/keywords/photon","display_name":"Photon","score":0.47372761368751526},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.47096067667007446},{"id":"https://openalex.org/keywords/infrared","display_name":"Infrared","score":0.4673614501953125},{"id":"https://openalex.org/keywords/radiation","display_name":"Radiation","score":0.46014437079429626},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.4590751826763153},{"id":"https://openalex.org/keywords/microscopy","display_name":"Microscopy","score":0.4439226984977722},{"id":"https://openalex.org/keywords/operating-temperature","display_name":"Operating temperature","score":0.44194936752319336},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.4157170057296753},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.411484956741333},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.22104626893997192},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.2072872519493103},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.20243871212005615},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.15617060661315918},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.09144711494445801},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.06644639372825623}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.67759108543396},{"id":"https://openalex.org/C2777042071","wikidata":"https://www.wikidata.org/wiki/Q6509304","display_name":"Leakage (economics)","level":2,"score":0.6309592127799988},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6213544607162476},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.6049444675445557},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5837690830230713},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.5394561886787415},{"id":"https://openalex.org/C21200559","wikidata":"https://www.wikidata.org/wiki/Q7451068","display_name":"Sensitivity (control systems)","level":2,"score":0.5047441720962524},{"id":"https://openalex.org/C159317903","wikidata":"https://www.wikidata.org/wiki/Q3198","display_name":"Photon","level":2,"score":0.47372761368751526},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.47096067667007446},{"id":"https://openalex.org/C158355884","wikidata":"https://www.wikidata.org/wiki/Q11388","display_name":"Infrared","level":2,"score":0.4673614501953125},{"id":"https://openalex.org/C153385146","wikidata":"https://www.wikidata.org/wiki/Q18335","display_name":"Radiation","level":2,"score":0.46014437079429626},{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.4590751826763153},{"id":"https://openalex.org/C147080431","wikidata":"https://www.wikidata.org/wiki/Q1074953","display_name":"Microscopy","level":2,"score":0.4439226984977722},{"id":"https://openalex.org/C131321042","wikidata":"https://www.wikidata.org/wiki/Q656685","display_name":"Operating temperature","level":2,"score":0.44194936752319336},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.4157170057296753},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.411484956741333},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.22104626893997192},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.2072872519493103},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.20243871212005615},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.15617060661315918},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.09144711494445801},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.06644639372825623},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps.2015.7112675","is_oa":false,"landing_page_url":"https://doi.org/10.1109/irps.2015.7112675","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Reliability Physics Symposium","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.7900000214576721,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1988702033","https://openalex.org/W2007446253","https://openalex.org/W2027913349","https://openalex.org/W2031108558","https://openalex.org/W2114764949","https://openalex.org/W2138717158","https://openalex.org/W2165598099","https://openalex.org/W2523096576","https://openalex.org/W2524825477","https://openalex.org/W2781733450","https://openalex.org/W3117270412","https://openalex.org/W6727229882","https://openalex.org/W6747212902","https://openalex.org/W6787792131"],"related_works":["https://openalex.org/W2104300577","https://openalex.org/W4206445530","https://openalex.org/W2771786520","https://openalex.org/W2034653092","https://openalex.org/W2898619109","https://openalex.org/W2763509612","https://openalex.org/W2004913861","https://openalex.org/W2132503478","https://openalex.org/W3143832965","https://openalex.org/W3120273781"],"abstract_inverted_index":{"This":[0],"work":[1],"presents":[2],"a":[3,45,60],"study":[4],"of":[5,8,27,30,47,101],"the":[6,28,48,70,78,83],"effect":[7],"chip":[9,93],"temperature":[10,95],"on":[11,75,88],"Photon":[12],"Emission":[13,55],"Microscopy":[14],"(PEM)":[15],"images":[16],"acquired":[17],"with":[18],"an":[19],"extended":[20],"sensitivity":[21],"near-infrared":[22],"camera.":[23],"A":[24],"detailed":[25],"analysis":[26],"detection":[29],"thermal":[31],"radiation,":[32],"as":[33,35,44],"well":[34],"leakage":[36,71],"and":[37,53,92],"switching":[38,79],"signal":[39],"components":[40],"will":[41],"be":[42],"presented":[43],"function":[46],"camera":[49,89],"spectral":[50,90],"tailoring.":[51],"Time-integrated":[52],"Time-Resolved":[54],"(TRE)":[56],"measurements":[57],"collected":[58],"from":[59],"32":[61],"nm":[62],"SOI":[63],"testchip":[64],"are":[65],"used":[66],"to":[67],"show":[68],"that":[69],"component":[72],"is":[73,80,96],"dependent":[74],"temperature,":[76],"while":[77],"not.":[81],"Moreover,":[82],"different":[84,99],"SNR":[85],"optimization":[86],"based":[87],"tailoring":[91],"operating":[94],"shown":[97],"for":[98],"types":[100],"measurements.":[102]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}