{"id":"https://openalex.org/W1555188096","doi":"https://doi.org/10.1109/irps.2015.7112657","title":"Keynote Address 2: \u201cHybrid memory cube: Achieving high performance and high reliability\u201d","display_name":"Keynote Address 2: \u201cHybrid memory cube: Achieving high performance and high reliability\u201d","publication_year":2015,"publication_date":"2015-04-01","ids":{"openalex":"https://openalex.org/W1555188096","doi":"https://doi.org/10.1109/irps.2015.7112657","mag":"1555188096"},"language":"en","primary_location":{"id":"doi:10.1109/irps.2015.7112657","is_oa":true,"landing_page_url":"https://doi.org/10.1109/irps.2015.7112657","pdf_url":"https://ieeexplore.ieee.org/ielx7/7106273/7112653/07112657.pdf","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Reliability Physics Symposium","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/7106273/7112653/07112657.pdf","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072285955","display_name":"Brent Keeth","orcid":null},"institutions":[{"id":"https://openalex.org/I11912373","display_name":"Micron (United States)","ror":"https://ror.org/02fv52296","country_code":"US","type":"company","lineage":["https://openalex.org/I11912373"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Brent Keeth","raw_affiliation_strings":["Advanced DRAM Architectures, Micron Technology, Inc"],"affiliations":[{"raw_affiliation_string":"Advanced DRAM Architectures, Micron Technology, Inc","institution_ids":["https://openalex.org/I11912373"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5072285955"],"corresponding_institution_ids":["https://openalex.org/I11912373"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.02665015,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9775000214576721,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9628999829292297,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.881231427192688},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6698935031890869},{"id":"https://openalex.org/keywords/context","display_name":"Context (archaeology)","score":0.6512660384178162},{"id":"https://openalex.org/keywords/presentation","display_name":"Presentation (obstetrics)","score":0.6071234941482544},{"id":"https://openalex.org/keywords/holy-grail","display_name":"Holy Grail","score":0.5297091007232666},{"id":"https://openalex.org/keywords/key","display_name":"Key (lock)","score":0.5177899599075317},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5094557404518127},{"id":"https://openalex.org/keywords/cube","display_name":"Cube (algebra)","score":0.49221983551979065},{"id":"https://openalex.org/keywords/scrap","display_name":"Scrap","score":0.419671893119812},{"id":"https://openalex.org/keywords/flexibility","display_name":"Flexibility (engineering)","score":0.4106466472148895},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.398776113986969},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.36093810200691223},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3285738229751587},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.3240385949611664},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24685096740722656},{"id":"https://openalex.org/keywords/world-wide-web","display_name":"World Wide Web","score":0.16065698862075806},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.14912468194961548},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.11754301190376282},{"id":"https://openalex.org/keywords/medicine","display_name":"Medicine","score":0.11405578255653381},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.09956830739974976}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.881231427192688},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6698935031890869},{"id":"https://openalex.org/C2779343474","wikidata":"https://www.wikidata.org/wiki/Q3109175","display_name":"Context (archaeology)","level":2,"score":0.6512660384178162},{"id":"https://openalex.org/C2777601897","wikidata":"https://www.wikidata.org/wiki/Q3409113","display_name":"Presentation (obstetrics)","level":2,"score":0.6071234941482544},{"id":"https://openalex.org/C2781270358","wikidata":"https://www.wikidata.org/wiki/Q5885594","display_name":"Holy Grail","level":2,"score":0.5297091007232666},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.5177899599075317},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5094557404518127},{"id":"https://openalex.org/C53051483","wikidata":"https://www.wikidata.org/wiki/Q861555","display_name":"Cube (algebra)","level":2,"score":0.49221983551979065},{"id":"https://openalex.org/C192097918","wikidata":"https://www.wikidata.org/wiki/Q917714","display_name":"Scrap","level":2,"score":0.419671893119812},{"id":"https://openalex.org/C2780598303","wikidata":"https://www.wikidata.org/wiki/Q65921492","display_name":"Flexibility (engineering)","level":2,"score":0.4106466472148895},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.398776113986969},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.36093810200691223},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3285738229751587},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3240385949611664},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24685096740722656},{"id":"https://openalex.org/C136764020","wikidata":"https://www.wikidata.org/wiki/Q466","display_name":"World Wide Web","level":1,"score":0.16065698862075806},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.14912468194961548},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.11754301190376282},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.11405578255653381},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.09956830739974976},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C126838900","wikidata":"https://www.wikidata.org/wiki/Q77604","display_name":"Radiology","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C114614502","wikidata":"https://www.wikidata.org/wiki/Q76592","display_name":"Combinatorics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/irps.2015.7112657","is_oa":true,"landing_page_url":"https://doi.org/10.1109/irps.2015.7112657","pdf_url":"https://ieeexplore.ieee.org/ielx7/7106273/7112653/07112657.pdf","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Reliability Physics Symposium","raw_type":"proceedings-article"}],"best_oa_location":{"id":"doi:10.1109/irps.2015.7112657","is_oa":true,"landing_page_url":"https://doi.org/10.1109/irps.2015.7112657","pdf_url":"https://ieeexplore.ieee.org/ielx7/7106273/7112653/07112657.pdf","source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Reliability Physics Symposium","raw_type":"proceedings-article"},"sustainable_development_goals":[{"score":0.5299999713897705,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W1555188096.pdf","grobid_xml":"https://content.openalex.org/works/W1555188096.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2520165268","https://openalex.org/W2370781105","https://openalex.org/W2162526451","https://openalex.org/W2512008118","https://openalex.org/W3022945664","https://openalex.org/W2357572353","https://openalex.org/W4386435900","https://openalex.org/W4240135517","https://openalex.org/W2517367191","https://openalex.org/W2377250750"],"abstract_inverted_index":{"Summary":[0],"form":[1],"only":[2],"given.":[3],"This":[4,39],"keynote":[5],"presentation":[6,20,91],"will":[7,21,40,77,92],"explore":[8],"the":[9,15,35,47,52,56,81,90],"genesis,":[10],"architecture":[11],"and":[12,30,58,86,105],"construction":[13],"of":[14,37,83,99],"Hybrid":[16],"Memory":[17],"Cube.":[18],"The":[19],"open":[22],"with":[23],"a":[24,44,62,97],"discussion":[25],"on":[26],"how":[27,59,94],"both":[28],"technical":[29],"market":[31],"forces":[32],"led":[33],"to":[34,102,106],"creation":[36],"HMC.":[38,73],"be":[41,78],"followed":[42],"by":[43],"dive":[45],"into":[46],"Gen":[48],"2":[49],"HMC":[50,95],"design-detailing":[51],"design":[53],"goals":[54],"for":[55,72],"device":[57,110],"manufacturability":[60,104],"was":[61],"priority":[63],"from":[64],"day":[65],"one.":[66],"3D":[67],"integration":[68],"is":[69],"pivotal":[70],"technology":[71],"As":[74],"such,":[75],"it":[76],"explored":[79],"in":[80],"context":[82],"key":[84],"enablers":[85],"ongoing":[87],"challenges.":[88],"Finally,":[89],"discuss":[93],"encompasses":[96],"variety":[98],"RAS":[100],"features":[101],"improve":[103],"ensure":[107],"long":[108],"term":[109],"reliability.":[111]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}