{"id":"https://openalex.org/W3112488682","doi":"https://doi.org/10.1109/ipta50016.2020.9286656","title":"Robust Image Wafer Inspection","display_name":"Robust Image Wafer Inspection","publication_year":2020,"publication_date":"2020-11-09","ids":{"openalex":"https://openalex.org/W3112488682","doi":"https://doi.org/10.1109/ipta50016.2020.9286656","mag":"3112488682"},"language":"en","primary_location":{"id":"doi:10.1109/ipta50016.2020.9286656","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ipta50016.2020.9286656","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 Tenth International Conference on Image Processing Theory, Tools and Applications (IPTA)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109064750","display_name":"M. Barone","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":true,"raw_author_name":"Massimiliano Barone","raw_affiliation_strings":["STMicroelectronics, Agrate Brianza, Milano, Italy"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Agrate Brianza, Milano, Italy","institution_ids":["https://openalex.org/I4210154781"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5109064750"],"corresponding_institution_ids":["https://openalex.org/I4210154781"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.22943583,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"61","issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12549","display_name":"Image and Object Detection Techniques","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13114","display_name":"Image Processing Techniques and Applications","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7925931215286255},{"id":"https://openalex.org/keywords/pixel","display_name":"Pixel","score":0.6507223844528198},{"id":"https://openalex.org/keywords/template-matching","display_name":"Template matching","score":0.6299428939819336},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.622619092464447},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.5994656682014465},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.5854349732398987},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.5516263246536255},{"id":"https://openalex.org/keywords/wafer-scale-integration","display_name":"Wafer-scale integration","score":0.5502128005027771},{"id":"https://openalex.org/keywords/matching","display_name":"Matching (statistics)","score":0.5489965677261353},{"id":"https://openalex.org/keywords/distortion","display_name":"Distortion (music)","score":0.5031737685203552},{"id":"https://openalex.org/keywords/image","display_name":"Image (mathematics)","score":0.4542633891105652},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.328612357378006},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.30956339836120605},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.19519329071044922},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1808362901210785},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.14266470074653625},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.13762906193733215},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.12240594625473022},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.10369613766670227}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7925931215286255},{"id":"https://openalex.org/C160633673","wikidata":"https://www.wikidata.org/wiki/Q355198","display_name":"Pixel","level":2,"score":0.6507223844528198},{"id":"https://openalex.org/C158096908","wikidata":"https://www.wikidata.org/wiki/Q3983303","display_name":"Template matching","level":3,"score":0.6299428939819336},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.622619092464447},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.5994656682014465},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.5854349732398987},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.5516263246536255},{"id":"https://openalex.org/C2778638305","wikidata":"https://www.wikidata.org/wiki/Q7406100","display_name":"Wafer-scale integration","level":3,"score":0.5502128005027771},{"id":"https://openalex.org/C165064840","wikidata":"https://www.wikidata.org/wiki/Q1321061","display_name":"Matching (statistics)","level":2,"score":0.5489965677261353},{"id":"https://openalex.org/C126780896","wikidata":"https://www.wikidata.org/wiki/Q899871","display_name":"Distortion (music)","level":4,"score":0.5031737685203552},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.4542633891105652},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.328612357378006},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.30956339836120605},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.19519329071044922},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1808362901210785},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.14266470074653625},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.13762906193733215},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.12240594625473022},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.10369613766670227},{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ipta50016.2020.9286656","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ipta50016.2020.9286656","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 Tenth International Conference on Image Processing Theory, Tools and Applications (IPTA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1565383065","https://openalex.org/W1806471916","https://openalex.org/W1968427760","https://openalex.org/W1975419982","https://openalex.org/W1978314095","https://openalex.org/W1985665526","https://openalex.org/W1986703546","https://openalex.org/W1991375681","https://openalex.org/W2003352944","https://openalex.org/W2004229479","https://openalex.org/W2004241456","https://openalex.org/W2007864695","https://openalex.org/W2018055769","https://openalex.org/W2042873108","https://openalex.org/W2048640201","https://openalex.org/W2066589851","https://openalex.org/W2095905764","https://openalex.org/W2118901564","https://openalex.org/W2128131274","https://openalex.org/W2149659501","https://openalex.org/W2156915894","https://openalex.org/W2163602155","https://openalex.org/W2164741953","https://openalex.org/W2186233030","https://openalex.org/W2345620643","https://openalex.org/W2535538881","https://openalex.org/W2786309582","https://openalex.org/W4235668093","https://openalex.org/W6655286451","https://openalex.org/W6684127936"],"related_works":["https://openalex.org/W2970498257","https://openalex.org/W2140660040","https://openalex.org/W2041316527","https://openalex.org/W2036313051","https://openalex.org/W4400034431","https://openalex.org/W2065601166","https://openalex.org/W2160598879","https://openalex.org/W2146366317","https://openalex.org/W993605666","https://openalex.org/W2164231539"],"abstract_inverted_index":{"This":[0,20],"paper":[1],"presents":[2],"a":[3,79,90,100],"deep":[4],"improvement":[5],"of":[6,46,115],"template":[7,45,85,122],"matching":[8,86,123],"technique":[9,124],"for":[10,89,105],"detecting":[11],"defects":[12],"in":[13],"VLSI,":[14],"very":[15],"large-scale":[16],"integration,":[17],"wafer":[18,36,49,58,95],"images.":[19],"method":[21,118],"is":[22,75,87,103,125],"more":[23,80,91],"robust":[24,81],"to":[25,32,62],"the":[26,47,57,63,113,116,120],"large":[27],"device":[28,96],"size,":[29],"distortion":[30],"due":[31],"image":[33,50,59],"acquisition":[34],"and":[35,72,97,119],"rotations.":[37],"Image":[38],"registration":[39],"includes":[40],"several":[41],"steps.":[42],"A":[43,67,110],"golden":[44],"patterned":[48],"under":[51],"inspection":[52],"can":[53],"be":[54],"obtained":[55],"from":[56],"itself":[60],"mixed":[61],"VLSI":[64],"design":[65],"layout.":[66],"mapping":[68],"between":[69,94,112],"physical":[70],"space":[71,74],"pixel":[73],"needed.":[76],"In":[77],"addition,":[78],"topology":[82],"based":[83],"on":[84],"applied":[88],"accurate":[92],"alignment":[93],"template.":[98],"Finally,":[99],"segmented":[101],"comparison":[102,111],"used":[104],"finding":[106],"out":[107],"possible":[108],"defects.":[109],"results":[114],"proposed":[117],"previous":[121],"presented.":[126]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}