{"id":"https://openalex.org/W1663225302","doi":"https://doi.org/10.1109/ipdps.2003.1213459","title":"An object-oriented programming framework for parallel finite element analysis with application: liquid composite molding","display_name":"An object-oriented programming framework for parallel finite element analysis with application: liquid composite molding","publication_year":2004,"publication_date":"2004-03-22","ids":{"openalex":"https://openalex.org/W1663225302","doi":"https://doi.org/10.1109/ipdps.2003.1213459","mag":"1663225302"},"language":"en","primary_location":{"id":"doi:10.1109/ipdps.2003.1213459","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ipdps.2003.1213459","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings International Parallel and Distributed Processing Symposium","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026875183","display_name":"Brian J. Henz","orcid":null},"institutions":[{"id":"https://openalex.org/I1304082316","display_name":"United States Department of the Army","ror":"https://ror.org/035w1gb98","country_code":"US","type":"government","lineage":["https://openalex.org/I1304082316","https://openalex.org/I1330347796"]},{"id":"https://openalex.org/I166416128","display_name":"DEVCOM Army Research Laboratory","ror":"https://ror.org/011hc8f90","country_code":"US","type":"government","lineage":["https://openalex.org/I1304082316","https://openalex.org/I1330347796","https://openalex.org/I166416128","https://openalex.org/I2802705668","https://openalex.org/I4210154437"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"B.J. Henz","raw_affiliation_strings":["AMSRL-CI-HC, U.S. Army Research Laboratory, MD, USA","AMSRL-CI-HC, US Army Res. Lab., Aberdeen Proving Ground, MD, USA"],"affiliations":[{"raw_affiliation_string":"AMSRL-CI-HC, U.S. Army Research Laboratory, MD, USA","institution_ids":["https://openalex.org/I166416128","https://openalex.org/I1304082316"]},{"raw_affiliation_string":"AMSRL-CI-HC, US Army Res. Lab., Aberdeen Proving Ground, MD, USA","institution_ids":["https://openalex.org/I166416128"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5053719539","display_name":"Dale R. Shires","orcid":null},"institutions":[{"id":"https://openalex.org/I1304082316","display_name":"United States Department of the Army","ror":"https://ror.org/035w1gb98","country_code":"US","type":"government","lineage":["https://openalex.org/I1304082316","https://openalex.org/I1330347796"]},{"id":"https://openalex.org/I166416128","display_name":"DEVCOM Army Research Laboratory","ror":"https://ror.org/011hc8f90","country_code":"US","type":"government","lineage":["https://openalex.org/I1304082316","https://openalex.org/I1330347796","https://openalex.org/I166416128","https://openalex.org/I2802705668","https://openalex.org/I4210154437"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D.R. Shires","raw_affiliation_strings":["AMSRL-CI-HC, U.S. Army Research Laboratory, MD, USA","AMSRL-CI-HC, US Army Res. Lab., Aberdeen Proving Ground, MD, USA"],"affiliations":[{"raw_affiliation_string":"AMSRL-CI-HC, U.S. Army Research Laboratory, MD, USA","institution_ids":["https://openalex.org/I166416128","https://openalex.org/I1304082316"]},{"raw_affiliation_string":"AMSRL-CI-HC, US Army Res. Lab., Aberdeen Proving Ground, MD, USA","institution_ids":["https://openalex.org/I166416128"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5026875183"],"corresponding_institution_ids":["https://openalex.org/I1304082316","https://openalex.org/I166416128"],"apc_list":null,"apc_paid":null,"fwci":2.5173,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.88205659,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"8","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9952999949455261,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.9815999865531921,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.7268754839897156},{"id":"https://openalex.org/keywords/composite-number","display_name":"Composite number","score":0.6680293083190918},{"id":"https://openalex.org/keywords/molding","display_name":"Molding (decorative)","score":0.6183276772499084},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.599830150604248},{"id":"https://openalex.org/keywords/object-oriented-programming","display_name":"Object-oriented programming","score":0.5737861394882202},{"id":"https://openalex.org/keywords/element","display_name":"Element (criminal law)","score":0.5068684220314026},{"id":"https://openalex.org/keywords/object","display_name":"Object (grammar)","score":0.4412986636161804},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.31443095207214355},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.284292995929718},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.2461586892604828},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.1936645209789276},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16313689947128296},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.15428835153579712},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.1369217336177826}],"concepts":[{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.7268754839897156},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.6680293083190918},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.6183276772499084},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.599830150604248},{"id":"https://openalex.org/C73752529","wikidata":"https://www.wikidata.org/wiki/Q79872","display_name":"Object-oriented programming","level":2,"score":0.5737861394882202},{"id":"https://openalex.org/C200288055","wikidata":"https://www.wikidata.org/wiki/Q2621792","display_name":"Element (criminal law)","level":2,"score":0.5068684220314026},{"id":"https://openalex.org/C2781238097","wikidata":"https://www.wikidata.org/wiki/Q175026","display_name":"Object (grammar)","level":2,"score":0.4412986636161804},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.31443095207214355},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.284292995929718},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2461586892604828},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.1936645209789276},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16313689947128296},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.15428835153579712},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.1369217336177826},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ipdps.2003.1213459","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ipdps.2003.1213459","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings International Parallel and Distributed Processing Symposium","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4099999964237213,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W90568776","https://openalex.org/W133347211","https://openalex.org/W144696928","https://openalex.org/W148823471","https://openalex.org/W1593897711","https://openalex.org/W1996122805","https://openalex.org/W1996905476","https://openalex.org/W2011774250","https://openalex.org/W2022619415","https://openalex.org/W2063714639","https://openalex.org/W2070541425","https://openalex.org/W2078948956","https://openalex.org/W2113230306","https://openalex.org/W2150637273","https://openalex.org/W2154224762","https://openalex.org/W2157078732","https://openalex.org/W2333901257","https://openalex.org/W2764568110","https://openalex.org/W3104001151","https://openalex.org/W3199452472","https://openalex.org/W6605288105","https://openalex.org/W6605891591"],"related_works":["https://openalex.org/W2380000090","https://openalex.org/W2374797863","https://openalex.org/W2349308527","https://openalex.org/W2364153536","https://openalex.org/W2903605038","https://openalex.org/W1578809901","https://openalex.org/W2611825707","https://openalex.org/W1580516753","https://openalex.org/W2552002334","https://openalex.org/W1547394117"],"abstract_inverted_index":{"The":[0],"use":[1,89],"of":[2,8,59,86,90,103],"object-oriented":[3,27],"programming":[4,28,76],"techniques":[5],"in":[6,80],"development":[7,20,58],"parallel,":[9],"finite":[10,33,65],"element":[11,34,66],"analysis":[12],"software":[13,15,35,97],"enhances":[14],"reuse":[16],"and":[17,45,51,78,93],"makes":[18],"application":[19],"more":[21],"efficient.":[22],"In":[23],"this":[24],"paper,":[25],"an":[26],"framework":[29,100],"for":[30,96],"developing":[31],"parallel":[32,64],"is":[36,70],"described.":[37],"All":[38],"required":[39],"steps,":[40],"from":[41,72],"data":[42],"file":[43],"parsing":[44],"equation":[46],"solving":[47],"to":[48,106],"post":[49],"processing":[50],"graphical":[52],"user":[53],"interfaces,":[54],"are":[55],"discussed.":[56],"After":[57],"the":[60,81,88,99],"framework,":[61],"a":[62],"sample":[63],"code,":[67],"namely":[68],"COMPOSE,":[69],"taken":[71],"its":[73],"original":[74],"functional":[75],"paradigm":[77],"implemented":[79],"new":[82],"framework.":[83],"Besides":[84],"ease":[85],"development,":[87],"generic":[91],"visualization":[92],"interface":[94],"tools":[95],"utilizing":[98],"speeds":[101],"delivery":[102],"research":[104],"codes":[105],"end":[107],"users.":[108]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}