{"id":"https://openalex.org/W2999608978","doi":"https://doi.org/10.1109/ipccc47392.2019.8958735","title":"High-Precision Adaptive Slope Compensation Circuit for System-on-Chip Power Management","display_name":"High-Precision Adaptive Slope Compensation Circuit for System-on-Chip Power Management","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W2999608978","doi":"https://doi.org/10.1109/ipccc47392.2019.8958735","mag":"2999608978"},"language":"en","primary_location":{"id":"doi:10.1109/ipccc47392.2019.8958735","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ipccc47392.2019.8958735","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 38th International Performance Computing and Communications Conference (IPCCC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5007863540","display_name":"Hua Fan","orcid":"https://orcid.org/0000-0001-7629-2183"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]},{"id":"https://openalex.org/I4210124847","display_name":"National Engineering Research Center of Electromagnetic Radiation Control Materials","ror":"https://ror.org/02k4dcs46","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210124847"]},{"id":"https://openalex.org/I4391767659","display_name":"State Key Laboratory of Electronic Thin Films and Integrated Devices","ror":"https://ror.org/01t9yse95","country_code":null,"type":"facility","lineage":["https://openalex.org/I150229711","https://openalex.org/I4391767659"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hua Fan","raw_affiliation_strings":["University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering,Chengdu,China","State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711","https://openalex.org/I4210124847","https://openalex.org/I4391767659"]},{"raw_affiliation_string":"State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711","https://openalex.org/I4210124847"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061727044","display_name":"Weiping Cheng","orcid":"https://orcid.org/0000-0001-9770-4554"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]},{"id":"https://openalex.org/I4210124847","display_name":"National Engineering Research Center of Electromagnetic Radiation Control Materials","ror":"https://ror.org/02k4dcs46","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210124847"]},{"id":"https://openalex.org/I4391767659","display_name":"State Key Laboratory of Electronic Thin Films and Integrated Devices","ror":"https://ror.org/01t9yse95","country_code":null,"type":"facility","lineage":["https://openalex.org/I150229711","https://openalex.org/I4391767659"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Weiping Cheng","raw_affiliation_strings":["University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering,Chengdu,China","Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711","https://openalex.org/I4210124847","https://openalex.org/I4391767659"]},{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100421668","display_name":"Yang Li","orcid":"https://orcid.org/0000-0002-9454-4660"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]},{"id":"https://openalex.org/I4210124847","display_name":"National Engineering Research Center of Electromagnetic Radiation Control Materials","ror":"https://ror.org/02k4dcs46","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210124847"]},{"id":"https://openalex.org/I4391767659","display_name":"State Key Laboratory of Electronic Thin Films and Integrated Devices","ror":"https://ror.org/01t9yse95","country_code":null,"type":"facility","lineage":["https://openalex.org/I150229711","https://openalex.org/I4391767659"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Li","raw_affiliation_strings":["University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering,Chengdu,China","Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711","https://openalex.org/I4210124847","https://openalex.org/I4391767659"]},{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030864853","display_name":"Quanyuan Feng","orcid":"https://orcid.org/0000-0003-4139-2015"},"institutions":[{"id":"https://openalex.org/I4800084","display_name":"Southwest Jiaotong University","ror":"https://ror.org/00hn7w693","country_code":"CN","type":"education","lineage":["https://openalex.org/I4800084"]},{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["CN","GB"],"is_corresponding":false,"raw_author_name":"Quanyuan Feng","raw_affiliation_strings":["Southwest Jiaotong University,The school of information science and technology,Chengdu,China","Electronics and Nanoscale Engineering Division, School of Engineering, University of Glasgow, Glasgow, UK"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Southwest Jiaotong University,The school of information science and technology,Chengdu,China","institution_ids":["https://openalex.org/I4800084"]},{"raw_affiliation_string":"Electronics and Nanoscale Engineering Division, School of Engineering, University of Glasgow, Glasgow, UK","institution_ids":["https://openalex.org/I7882870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067575102","display_name":"Hongrui Che","orcid":null},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Hongrui Che","raw_affiliation_strings":["Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","Electronics and Nanoscale Engineering Division, School of Engineering, University of Glasgow, Glasgow, UK"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","institution_ids":[]},{"raw_affiliation_string":"Electronics and Nanoscale Engineering Division, School of Engineering, University of Glasgow, Glasgow, UK","institution_ids":["https://openalex.org/I7882870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079293650","display_name":"Xuanhong Zeng","orcid":null},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]},{"id":"https://openalex.org/I4210124847","display_name":"National Engineering Research Center of Electromagnetic Radiation Control Materials","ror":"https://ror.org/02k4dcs46","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210124847"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xuanhong Zeng","raw_affiliation_strings":["Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","institution_ids":[]},{"raw_affiliation_string":"State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711","https://openalex.org/I4210124847"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102973407","display_name":"Haizhu Wang","orcid":"https://orcid.org/0000-0002-9164-2759"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]},{"id":"https://openalex.org/I4210124847","display_name":"National Engineering Research Center of Electromagnetic Radiation Control Materials","ror":"https://ror.org/02k4dcs46","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210124847"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haizhu Wang","raw_affiliation_strings":["Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","institution_ids":[]},{"raw_affiliation_string":"State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711","https://openalex.org/I4210124847"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Hongquan Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I4800084","display_name":"Southwest Jiaotong University","ror":"https://ror.org/00hn7w693","country_code":"CN","type":"education","lineage":["https://openalex.org/I4800084"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hongquan Wang","raw_affiliation_strings":["Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","The school of information science and technology, Southwest Jiaotong University, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","institution_ids":[]},{"raw_affiliation_string":"The school of information science and technology, Southwest Jiaotong University, Chengdu, China","institution_ids":["https://openalex.org/I4800084"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100605480","display_name":"Dagang Li","orcid":"https://orcid.org/0000-0001-7896-7818"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dagang Li","raw_affiliation_strings":["Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","institution_ids":[]},{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055642992","display_name":"Kelin Zhang","orcid":"https://orcid.org/0000-0001-8398-070X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Kelin Zhang","raw_affiliation_strings":["Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","institution_ids":[]},{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077519613","display_name":"Yuanjun Cen","orcid":"https://orcid.org/0000-0002-9028-8241"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yuanjun Cen","raw_affiliation_strings":["Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China","institution_ids":[]},{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058753254","display_name":"Kaung Oo Htet","orcid":"https://orcid.org/0000-0002-8958-5310"},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Kaung Oo Htet","raw_affiliation_strings":["University of Glasgow,Electronics and Nanoscale Engineering Division, School of Engineering,Glasgow,UK,G12 8QQ","Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Glasgow,Electronics and Nanoscale Engineering Division, School of Engineering,Glasgow,UK,G12 8QQ","institution_ids":["https://openalex.org/I7882870"]},{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100700922","display_name":"Hadi Heidari","orcid":"https://orcid.org/0000-0001-8412-8164"},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Hadi Heidari","raw_affiliation_strings":["University of Glasgow,Electronics and Nanoscale Engineering Division, School of Engineering,Glasgow,UK,G12 8QQ","Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Glasgow,Electronics and Nanoscale Engineering Division, School of Engineering,Glasgow,UK,G12 8QQ","institution_ids":["https://openalex.org/I7882870"]},{"raw_affiliation_string":"Chengdu Sino Microelectronics Technology Co.,Ltd, Chengdu, China","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/compensation","display_name":"Compensation (psychology)","score":0.7365225553512573},{"id":"https://openalex.org/keywords/power-management","display_name":"Power management","score":0.6034079790115356},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.6010281443595886},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.559196949005127},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5403289198875427},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.48771438002586365},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.43113577365875244},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3251377046108246},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2538326382637024},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18766072392463684},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.13483360409736633},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06930616497993469}],"concepts":[{"id":"https://openalex.org/C2780023022","wikidata":"https://www.wikidata.org/wiki/Q1338171","display_name":"Compensation (psychology)","level":2,"score":0.7365225553512573},{"id":"https://openalex.org/C2778774385","wikidata":"https://www.wikidata.org/wiki/Q4437810","display_name":"Power management","level":3,"score":0.6034079790115356},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.6010281443595886},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.559196949005127},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5403289198875427},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.48771438002586365},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.43113577365875244},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3251377046108246},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2538326382637024},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18766072392463684},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.13483360409736633},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06930616497993469},{"id":"https://openalex.org/C11171543","wikidata":"https://www.wikidata.org/wiki/Q41630","display_name":"Psychoanalysis","level":1,"score":0.0},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ipccc47392.2019.8958735","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ipccc47392.2019.8958735","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 38th International Performance Computing and Communications Conference (IPCCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.7799999713897705,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W2064745015","https://openalex.org/W2101973855","https://openalex.org/W2138351331","https://openalex.org/W2164437773","https://openalex.org/W2315134540","https://openalex.org/W2604284017","https://openalex.org/W2611273982","https://openalex.org/W2745291097","https://openalex.org/W6742677317"],"related_works":["https://openalex.org/W2361249445","https://openalex.org/W2095623310","https://openalex.org/W2405556982","https://openalex.org/W2612055717","https://openalex.org/W1584909421","https://openalex.org/W1579887339","https://openalex.org/W3001933403","https://openalex.org/W2048700411","https://openalex.org/W4285357516","https://openalex.org/W2385160685"],"abstract_inverted_index":{"In":[0,50],"this":[1,28,51],"work,":[2],"a":[3],"high":[4],"precision":[5,75],"adaptive":[6,24],"slope":[7,25,78],"compensation":[8,26,74],"circuit":[9,54],"is":[10,55],"proposed":[11],"used":[12],"in":[13],"DC-DC":[14],"converter":[15],"for":[16],"System-on-Chip":[17],"Power":[18],"Management.":[19],"Compared":[20],"with":[21,89],"the":[22,31,35,39,44,53,73,77,86,95],"conventional":[23],"circuit,":[27],"work":[29],"uses":[30],"comparator":[32],"to":[33],"sample":[34],"output":[36,90,96],"voltage":[37,88,91,97,101],"and":[38,63],"input":[40,87,100],"voltage,":[41],"so":[42],"that":[43],"accuracy":[45],"has":[46],"been":[47],"greatly":[48],"improved.":[49],"paper,":[52],"designed":[56],"based":[57],"on":[58],"UMC":[59],"0.18-\u03bcm":[60],"CMOS":[61],"Technology":[62],"verified":[64],"by":[65],"Cadence":[66],"simulation":[67],"environment.":[68],"Simulation":[69],"results":[70],"show":[71],"that,":[72],"of":[76],"can":[79],"reach":[80],"more":[81],"than":[82],"96%":[83],"when":[84],"changes":[85,94],"fixed":[92],"or":[93],"while":[98],"keeping":[99],"constant.":[102]},"counts_by_year":[{"year":2022,"cited_by_count":3}],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2025-10-10T00:00:00"}