{"id":"https://openalex.org/W2977461577","doi":"https://doi.org/10.1109/iolts.2019.8854437","title":"Methodology for Tradeoffs between Performance and Lifetimes of Integrated Circuits","display_name":"Methodology for Tradeoffs between Performance and Lifetimes of Integrated Circuits","publication_year":2019,"publication_date":"2019-07-01","ids":{"openalex":"https://openalex.org/W2977461577","doi":"https://doi.org/10.1109/iolts.2019.8854437","mag":"2977461577"},"language":"en","primary_location":{"id":"doi:10.1109/iolts.2019.8854437","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iolts.2019.8854437","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 25th International Symposium on On-Line Testing and Robust System Design (IOLTS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5022123752","display_name":"Daniel Weyer","orcid":"https://orcid.org/0000-0002-8355-9402"},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Daniel Weyer","raw_affiliation_strings":["Case Western Reserve University, Cleveland, Ohio, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Case Western Reserve University, Cleveland, Ohio, USA","institution_ids":["https://openalex.org/I58956616"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110198567","display_name":"Francis Wolff","orcid":null},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Francis Wolff","raw_affiliation_strings":["Case Western Reserve University, Cleveland, Ohio, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Case Western Reserve University, Cleveland, Ohio, USA","institution_ids":["https://openalex.org/I58956616"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046620750","display_name":"C. Papachristou","orcid":"https://orcid.org/0000-0002-5399-3208"},"institutions":[{"id":"https://openalex.org/I58956616","display_name":"Case Western Reserve University","ror":"https://ror.org/051fd9666","country_code":"US","type":"education","lineage":["https://openalex.org/I58956616"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chris Papachristou","raw_affiliation_strings":["Case Western Reserve University, Cleveland, Ohio, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Case Western Reserve University, Cleveland, Ohio, USA","institution_ids":["https://openalex.org/I58956616"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5028763280","display_name":"Steve Clay","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Steve Clay","raw_affiliation_strings":["C. W. Consultants, Medina, Ohio, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"C. W. Consultants, Medina, Ohio, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.2422,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.5618347,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"59","issue":null,"first_page":"60","last_page":"63"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.9880999326705933},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.6554497480392456},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.6027564406394958},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5722223520278931},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5235311985015869},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.5102241039276123},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.49525633454322815},{"id":"https://openalex.org/keywords/sign","display_name":"Sign (mathematics)","score":0.47895580530166626},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.47601252794265747},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2747477889060974},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21116620302200317},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.14860305190086365}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9880999326705933},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.6554497480392456},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.6027564406394958},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5722223520278931},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5235311985015869},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.5102241039276123},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.49525633454322815},{"id":"https://openalex.org/C139676723","wikidata":"https://www.wikidata.org/wiki/Q1193832","display_name":"Sign (mathematics)","level":2,"score":0.47895580530166626},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.47601252794265747},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2747477889060974},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21116620302200317},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.14860305190086365},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iolts.2019.8854437","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iolts.2019.8854437","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 25th International Symposium on On-Line Testing and Robust System Design (IOLTS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Reduced inequalities","score":0.4399999976158142,"id":"https://metadata.un.org/sdg/10"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W653832283","https://openalex.org/W1551399607","https://openalex.org/W1981724941","https://openalex.org/W1982551908","https://openalex.org/W1986545147","https://openalex.org/W1997326261","https://openalex.org/W2010945721","https://openalex.org/W2011480165","https://openalex.org/W2111639188","https://openalex.org/W2114853176","https://openalex.org/W2513743422","https://openalex.org/W2546163117","https://openalex.org/W4235924676","https://openalex.org/W4239466105"],"related_works":["https://openalex.org/W2169154812","https://openalex.org/W2318525917","https://openalex.org/W2108703634","https://openalex.org/W2086910809","https://openalex.org/W1984394007","https://openalex.org/W3215142653","https://openalex.org/W2071520186","https://openalex.org/W1487051936","https://openalex.org/W3094423394","https://openalex.org/W1553422968"],"abstract_inverted_index":{"Integrated":[0],"Circuits":[1],"(IC)":[2],"are":[3],"typically":[4],"designed":[5],"based":[6],"on":[7],"tradeoffs":[8,41],"among":[9],"performance,":[10],"power":[11],"and":[12],"cost.":[13],"Designers":[14],"perceive":[15],"electromigration":[16],"as":[17,22,28],"a":[18,23,36],"failure":[19],"mechanism":[20],"or":[21],"sign-off":[24],"rule":[25],"rather":[26],"than":[27],"an":[29],"additional":[30],"tradeoff":[31],"parameter.":[32],"This":[33],"paper":[34],"describes":[35],"design":[37],"methodology":[38],"to":[39,47],"perform":[40],"driven":[42],"by":[43],"lifetime":[44],"concerns":[45],"due":[46],"electromigration.":[48]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}