{"id":"https://openalex.org/W3003421008","doi":"https://doi.org/10.1109/indin41052.2019.8972030","title":"Characterization of Liquid Cooled Cold Plates for a Multi Chip Module (MCM) and their Impact on Data Center Chiller Operation","display_name":"Characterization of Liquid Cooled Cold Plates for a Multi Chip Module (MCM) and their Impact on Data Center Chiller Operation","publication_year":2019,"publication_date":"2019-07-01","ids":{"openalex":"https://openalex.org/W3003421008","doi":"https://doi.org/10.1109/indin41052.2019.8972030","mag":"3003421008"},"language":"en","primary_location":{"id":"doi:10.1109/indin41052.2019.8972030","is_oa":false,"landing_page_url":"https://doi.org/10.1109/indin41052.2019.8972030","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 17th International Conference on Industrial Informatics (INDIN)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5052428562","display_name":"Bharath Ramakrishnan","orcid":"https://orcid.org/0000-0002-2858-3557"},"institutions":[{"id":"https://openalex.org/I123946342","display_name":"Binghamton University","ror":"https://ror.org/008rmbt77","country_code":"US","type":"education","lineage":["https://openalex.org/I123946342"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Bharath Ramakrishnan","raw_affiliation_strings":["Binghamton University,Department of Mechanical Engineering,Binghamton,USA","Department of Mechanical Engineering, Binghamton University, Binghamton, USA"],"affiliations":[{"raw_affiliation_string":"Binghamton University,Department of Mechanical Engineering,Binghamton,USA","institution_ids":["https://openalex.org/I123946342"]},{"raw_affiliation_string":"Department of Mechanical Engineering, Binghamton University, Binghamton, USA","institution_ids":["https://openalex.org/I123946342"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056875085","display_name":"Mohammad Tradat","orcid":"https://orcid.org/0000-0002-1232-9036"},"institutions":[{"id":"https://openalex.org/I123946342","display_name":"Binghamton University","ror":"https://ror.org/008rmbt77","country_code":"US","type":"education","lineage":["https://openalex.org/I123946342"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mohammad Tradat","raw_affiliation_strings":["Binghamton University,Department of Mechanical Engineering,Binghamton,USA","Department of Mechanical Engineering, Binghamton University, Binghamton, USA"],"affiliations":[{"raw_affiliation_string":"Binghamton University,Department of Mechanical Engineering,Binghamton,USA","institution_ids":["https://openalex.org/I123946342"]},{"raw_affiliation_string":"Department of Mechanical Engineering, Binghamton University, Binghamton, USA","institution_ids":["https://openalex.org/I123946342"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109394984","display_name":"Yaser Hadad","orcid":null},"institutions":[{"id":"https://openalex.org/I123946342","display_name":"Binghamton University","ror":"https://ror.org/008rmbt77","country_code":"US","type":"education","lineage":["https://openalex.org/I123946342"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yaser Hadad","raw_affiliation_strings":["Binghamton University,Department of Mechanical Engineering,Binghamton,USA","Department of Mechanical Engineering, Binghamton University, Binghamton, USA"],"affiliations":[{"raw_affiliation_string":"Binghamton University,Department of Mechanical Engineering,Binghamton,USA","institution_ids":["https://openalex.org/I123946342"]},{"raw_affiliation_string":"Department of Mechanical Engineering, Binghamton University, Binghamton, USA","institution_ids":["https://openalex.org/I123946342"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043921638","display_name":"Kanad Ghose","orcid":"https://orcid.org/0000-0002-5509-6543"},"institutions":[{"id":"https://openalex.org/I123946342","display_name":"Binghamton University","ror":"https://ror.org/008rmbt77","country_code":"US","type":"education","lineage":["https://openalex.org/I123946342"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kanad Ghose","raw_affiliation_strings":["Binghamton University,Department of Computer Science,Binghamton,USA","Department of Computer Science, Binghamton University, Binghamton, USA"],"affiliations":[{"raw_affiliation_string":"Binghamton University,Department of Computer Science,Binghamton,USA","institution_ids":["https://openalex.org/I123946342"]},{"raw_affiliation_string":"Department of Computer Science, Binghamton University, Binghamton, USA","institution_ids":["https://openalex.org/I123946342"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5067342954","display_name":"Bahgat Sammakia","orcid":null},"institutions":[{"id":"https://openalex.org/I123946342","display_name":"Binghamton University","ror":"https://ror.org/008rmbt77","country_code":"US","type":"education","lineage":["https://openalex.org/I123946342"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bahgat Sammakia","raw_affiliation_strings":["Binghamton University,Department of Mechanical Engineering,Binghamton,USA","Department of Mechanical Engineering, Binghamton University, Binghamton, USA"],"affiliations":[{"raw_affiliation_string":"Binghamton University,Department of Mechanical Engineering,Binghamton,USA","institution_ids":["https://openalex.org/I123946342"]},{"raw_affiliation_string":"Department of Mechanical Engineering, Binghamton University, Binghamton, USA","institution_ids":["https://openalex.org/I123946342"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5052428562"],"corresponding_institution_ids":["https://openalex.org/I123946342"],"apc_list":null,"apc_paid":null,"fwci":0.1457,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.50603756,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1419","last_page":"1424"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11945","display_name":"Heat Transfer Mechanisms","score":0.9793000221252441,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microchannel","display_name":"Microchannel","score":0.7311712503433228},{"id":"https://openalex.org/keywords/chiller","display_name":"Chiller","score":0.6918119788169861},{"id":"https://openalex.org/keywords/computer-cooling","display_name":"Computer cooling","score":0.6759181618690491},{"id":"https://openalex.org/keywords/coolant","display_name":"Coolant","score":0.59327632188797},{"id":"https://openalex.org/keywords/nuclear-engineering","display_name":"Nuclear engineering","score":0.5501427054405212},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5358093976974487},{"id":"https://openalex.org/keywords/heat-spreader","display_name":"Heat spreader","score":0.5297098159790039},{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.5210956335067749},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.5188652276992798},{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.5172843933105469},{"id":"https://openalex.org/keywords/pressure-drop","display_name":"Pressure drop","score":0.4932679533958435},{"id":"https://openalex.org/keywords/miniaturization","display_name":"Miniaturization","score":0.4864199161529541},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.4721424877643585},{"id":"https://openalex.org/keywords/heat-flux","display_name":"Heat flux","score":0.46840566396713257},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.33824554085731506},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27038559317588806},{"id":"https://openalex.org/keywords/mechanics","display_name":"Mechanics","score":0.1973390281200409},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.1418820321559906},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.1355341374874115}],"concepts":[{"id":"https://openalex.org/C63662833","wikidata":"https://www.wikidata.org/wiki/Q6839341","display_name":"Microchannel","level":2,"score":0.7311712503433228},{"id":"https://openalex.org/C4638862","wikidata":"https://www.wikidata.org/wiki/Q1501558","display_name":"Chiller","level":2,"score":0.6918119788169861},{"id":"https://openalex.org/C11026015","wikidata":"https://www.wikidata.org/wiki/Q840551","display_name":"Computer cooling","level":3,"score":0.6759181618690491},{"id":"https://openalex.org/C91914117","wikidata":"https://www.wikidata.org/wiki/Q1056832","display_name":"Coolant","level":2,"score":0.59327632188797},{"id":"https://openalex.org/C116915560","wikidata":"https://www.wikidata.org/wiki/Q83504","display_name":"Nuclear engineering","level":1,"score":0.5501427054405212},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5358093976974487},{"id":"https://openalex.org/C48632124","wikidata":"https://www.wikidata.org/wiki/Q617088","display_name":"Heat spreader","level":3,"score":0.5297098159790039},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.5210956335067749},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.5188652276992798},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.5172843933105469},{"id":"https://openalex.org/C114088122","wikidata":"https://www.wikidata.org/wiki/Q1261069","display_name":"Pressure drop","level":2,"score":0.4932679533958435},{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.4864199161529541},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.4721424877643585},{"id":"https://openalex.org/C159188206","wikidata":"https://www.wikidata.org/wiki/Q1478382","display_name":"Heat flux","level":3,"score":0.46840566396713257},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.33824554085731506},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27038559317588806},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.1973390281200409},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.1418820321559906},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.1355341374874115},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/indin41052.2019.8972030","is_oa":false,"landing_page_url":"https://doi.org/10.1109/indin41052.2019.8972030","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 17th International Conference on Industrial Informatics (INDIN)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.7099999785423279,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W190397983","https://openalex.org/W2022101489","https://openalex.org/W2024096165","https://openalex.org/W2179559420","https://openalex.org/W2736578080","https://openalex.org/W2785243009","https://openalex.org/W2800183313","https://openalex.org/W2886578477","https://openalex.org/W2908100370","https://openalex.org/W4214894150","https://openalex.org/W6685789349"],"related_works":["https://openalex.org/W2115443918","https://openalex.org/W1970519079","https://openalex.org/W1965965304","https://openalex.org/W1977927964","https://openalex.org/W2152436995","https://openalex.org/W4386799735","https://openalex.org/W2061729874","https://openalex.org/W2797447523","https://openalex.org/W4312336109","https://openalex.org/W1998158740"],"abstract_inverted_index":{"Miniaturization":[0],"of":[1,8,20,31,79,114,210,228],"microelectronic":[2,33],"components":[3],"comes":[4],"at":[5,120,131,169],"a":[6,40,104,185,196,217,229],"price":[7],"high":[9,21],"heat":[10,22,52,64,105,133],"flux":[11,23],"density.":[12],"By":[13],"adopting":[14],"liquid":[15],"cooling,":[16],"the":[17,29,32,76,111,132,146,151,160,162,176],"rising":[18],"demand":[19],"devices":[24,34],"can":[25,35],"be":[26,37],"met":[27],"while":[28,109],"reliability":[30],"also":[36],"improved":[38,204],"to":[39,61,74,150,184,226],"greater":[41],"extent.":[42],"Liquid":[43],"cooled":[44,220,233],"cold":[45,81,117,152,166],"plates":[46,82],"are":[47],"largely":[48],"replacing":[49],"air":[50,219],"based":[51],"sinks":[53],"for":[54,89,135,203,216],"electronics":[55],"in":[56,144],"data":[57],"center":[58],"applications,":[59],"thanks":[60],"its":[62],"large":[63],"carrying":[65],"capacity.":[66],"A":[67,95],"bench":[68],"level":[69],"study":[70],"was":[71,107,157,214],"carried":[72],"out":[73],"characterize":[75],"thermohydraulic":[77],"performance":[78,113,156,225],"microchannel":[80,178,188],"which":[83,199],"uses":[84],"warm":[85,231],"De-Ionized":[86],"(DI)":[87],"water":[88,232],"cooling":[90],"Multi":[91],"Chip":[92],"Modules":[93],"(MCM).":[94],"laboratory":[96],"built":[97],"mock":[98,101],"package":[99],"housing":[100],"chips":[102],"and":[103,125,139,222],"spreader":[106,134],"employed":[108],"assessing":[110],"thermal":[112],"three":[115],"different":[116],"plate":[118,167,174],"designs":[119],"varying":[121,136,170],"coolant":[122],"flow":[123,137,155,171],"rate":[124],"temperature.":[126],"The":[127,154,190],"case":[128],"temperature":[129],"measured":[130],"rates":[138],"input":[140],"power":[141],"were":[142,193],"essential":[143],"identifying":[145],"convective":[147],"resistance":[148],"corresponding":[149],"plates.":[153],"evaluated":[158],"by":[159],"measuring":[161],"pressure":[163],"drop":[164],"across":[165],"module":[168],"rates.":[172],"Cold":[173],"with":[175],"enhanced":[177],"design":[179],"yielded":[180],"better":[181],"results":[182,192],"compared":[183,223],"traditional":[186],"parallel":[187],"design.":[189],"experimental":[191],"validated":[194],"using":[195],"numerical":[197],"model":[198],"is":[200],"further":[201],"optimized":[202],"geometric":[205],"designs.":[206],"Finally,":[207],"an":[208],"estimation":[209],"chiller":[211],"operating":[212],"cost":[213],"obtained":[215],"100%":[218],"facility":[221],"their":[224],"that":[227],"60%":[230],"facility.":[234]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}