{"id":"https://openalex.org/W4281556338","doi":"https://doi.org/10.1109/imw52921.2022.9779248","title":"An Analytical Model for Thin Film Pattern-dependent Asymmetric Wafer Warpage Prediction","display_name":"An Analytical Model for Thin Film Pattern-dependent Asymmetric Wafer Warpage Prediction","publication_year":2022,"publication_date":"2022-05-01","ids":{"openalex":"https://openalex.org/W4281556338","doi":"https://doi.org/10.1109/imw52921.2022.9779248"},"language":"en","primary_location":{"id":"doi:10.1109/imw52921.2022.9779248","is_oa":false,"landing_page_url":"https://doi.org/10.1109/imw52921.2022.9779248","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE International Memory Workshop (IMW)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026822143","display_name":"Weishen Chu","orcid":"https://orcid.org/0000-0002-8571-5763"},"institutions":[{"id":"https://openalex.org/I4210121352","display_name":"Western Digital (United States)","ror":"https://ror.org/02hqwnx33","country_code":"US","type":"company","lineage":["https://openalex.org/I4210121352"]},{"id":"https://openalex.org/I118271192","display_name":"Western Digital (Japan)","ror":"https://ror.org/0521k5n17","country_code":"JP","type":"company","lineage":["https://openalex.org/I118271192","https://openalex.org/I4210121352"]}],"countries":["JP","US"],"is_corresponding":true,"raw_author_name":"Weishen Chu","raw_affiliation_strings":["Western Digital Corporation,Milpitas,CA,USA","Western Digital Corporation, Milpitas, CA, USA"],"affiliations":[{"raw_affiliation_string":"Western Digital Corporation,Milpitas,CA,USA","institution_ids":["https://openalex.org/I4210121352","https://openalex.org/I118271192"]},{"raw_affiliation_string":"Western Digital Corporation, Milpitas, CA, USA","institution_ids":["https://openalex.org/I4210121352"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013383022","display_name":"Seyyed Ehsan Esfahani Rashidi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210121352","display_name":"Western Digital (United States)","ror":"https://ror.org/02hqwnx33","country_code":"US","type":"company","lineage":["https://openalex.org/I4210121352"]},{"id":"https://openalex.org/I118271192","display_name":"Western Digital (Japan)","ror":"https://ror.org/0521k5n17","country_code":"JP","type":"company","lineage":["https://openalex.org/I118271192","https://openalex.org/I4210121352"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Seyyed Ehsan Esfahani Rashidi","raw_affiliation_strings":["Western Digital Corporation,Milpitas,CA,USA","Western Digital Corporation, Milpitas, CA, USA"],"affiliations":[{"raw_affiliation_string":"Western Digital Corporation,Milpitas,CA,USA","institution_ids":["https://openalex.org/I4210121352","https://openalex.org/I118271192"]},{"raw_affiliation_string":"Western Digital Corporation, Milpitas, CA, USA","institution_ids":["https://openalex.org/I4210121352"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100435019","display_name":"Yanli Zhang","orcid":"https://orcid.org/0000-0003-0614-2096"},"institutions":[{"id":"https://openalex.org/I118271192","display_name":"Western Digital (Japan)","ror":"https://ror.org/0521k5n17","country_code":"JP","type":"company","lineage":["https://openalex.org/I118271192","https://openalex.org/I4210121352"]},{"id":"https://openalex.org/I4210121352","display_name":"Western Digital (United States)","ror":"https://ror.org/02hqwnx33","country_code":"US","type":"company","lineage":["https://openalex.org/I4210121352"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Yanli Zhang","raw_affiliation_strings":["Western Digital Corporation,Milpitas,CA,USA","Western Digital Corporation, Milpitas, CA, USA"],"affiliations":[{"raw_affiliation_string":"Western Digital Corporation,Milpitas,CA,USA","institution_ids":["https://openalex.org/I4210121352","https://openalex.org/I118271192"]},{"raw_affiliation_string":"Western Digital Corporation, Milpitas, CA, USA","institution_ids":["https://openalex.org/I4210121352"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004499658","display_name":"J. Alsmeier","orcid":null},"institutions":[{"id":"https://openalex.org/I118271192","display_name":"Western Digital (Japan)","ror":"https://ror.org/0521k5n17","country_code":"JP","type":"company","lineage":["https://openalex.org/I118271192","https://openalex.org/I4210121352"]},{"id":"https://openalex.org/I4210121352","display_name":"Western Digital (United States)","ror":"https://ror.org/02hqwnx33","country_code":"US","type":"company","lineage":["https://openalex.org/I4210121352"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Johann Alsmeier","raw_affiliation_strings":["Western Digital Corporation,Milpitas,CA,USA","Western Digital Corporation, Milpitas, CA, USA"],"affiliations":[{"raw_affiliation_string":"Western Digital Corporation,Milpitas,CA,USA","institution_ids":["https://openalex.org/I4210121352","https://openalex.org/I118271192"]},{"raw_affiliation_string":"Western Digital Corporation, Milpitas, CA, USA","institution_ids":["https://openalex.org/I4210121352"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110551658","display_name":"T. Sega","orcid":null},"institutions":[{"id":"https://openalex.org/I118271192","display_name":"Western Digital (Japan)","ror":"https://ror.org/0521k5n17","country_code":"JP","type":"company","lineage":["https://openalex.org/I118271192","https://openalex.org/I4210121352"]},{"id":"https://openalex.org/I4210121352","display_name":"Western Digital (United States)","ror":"https://ror.org/02hqwnx33","country_code":"US","type":"company","lineage":["https://openalex.org/I4210121352"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Toshiyuki Sega","raw_affiliation_strings":["Western Digital Corporation,Milpitas,CA,USA","Western Digital Corporation, Milpitas, CA, USA"],"affiliations":[{"raw_affiliation_string":"Western Digital Corporation,Milpitas,CA,USA","institution_ids":["https://openalex.org/I4210121352","https://openalex.org/I118271192"]},{"raw_affiliation_string":"Western Digital Corporation, Milpitas, CA, USA","institution_ids":["https://openalex.org/I4210121352"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5026822143"],"corresponding_institution_ids":["https://openalex.org/I118271192","https://openalex.org/I4210121352"],"apc_list":null,"apc_paid":null,"fwci":0.3202,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.48980726,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8531428575515747},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6379749178886414},{"id":"https://openalex.org/keywords/stiffness","display_name":"Stiffness","score":0.5447297096252441},{"id":"https://openalex.org/keywords/parametric-statistics","display_name":"Parametric statistics","score":0.5226224064826965},{"id":"https://openalex.org/keywords/nand-gate","display_name":"NAND gate","score":0.4875606894493103},{"id":"https://openalex.org/keywords/semiconductor-device-modeling","display_name":"Semiconductor device modeling","score":0.4805474877357483},{"id":"https://openalex.org/keywords/parametric-model","display_name":"Parametric model","score":0.4445640742778778},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.42094454169273376},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4190005362033844},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.41592758893966675},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2955191135406494},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24221807718276978},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.1841573417186737},{"id":"https://openalex.org/keywords/logic-gate","display_name":"Logic gate","score":0.14317753911018372},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.10217761993408203},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.06403568387031555}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8531428575515747},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6379749178886414},{"id":"https://openalex.org/C2779372316","wikidata":"https://www.wikidata.org/wiki/Q569057","display_name":"Stiffness","level":2,"score":0.5447297096252441},{"id":"https://openalex.org/C117251300","wikidata":"https://www.wikidata.org/wiki/Q1849855","display_name":"Parametric statistics","level":2,"score":0.5226224064826965},{"id":"https://openalex.org/C124296912","wikidata":"https://www.wikidata.org/wiki/Q575178","display_name":"NAND gate","level":3,"score":0.4875606894493103},{"id":"https://openalex.org/C4775677","wikidata":"https://www.wikidata.org/wiki/Q7449393","display_name":"Semiconductor device modeling","level":3,"score":0.4805474877357483},{"id":"https://openalex.org/C24574437","wikidata":"https://www.wikidata.org/wiki/Q7135228","display_name":"Parametric model","level":3,"score":0.4445640742778778},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.42094454169273376},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4190005362033844},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.41592758893966675},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2955191135406494},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24221807718276978},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1841573417186737},{"id":"https://openalex.org/C131017901","wikidata":"https://www.wikidata.org/wiki/Q170451","display_name":"Logic gate","level":2,"score":0.14317753911018372},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.10217761993408203},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.06403568387031555},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/imw52921.2022.9779248","is_oa":false,"landing_page_url":"https://doi.org/10.1109/imw52921.2022.9779248","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE International Memory Workshop (IMW)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.6399999856948853}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W599916913","https://openalex.org/W1594292718","https://openalex.org/W1999210942","https://openalex.org/W2037047108","https://openalex.org/W2049884947","https://openalex.org/W2056123664","https://openalex.org/W2069343396","https://openalex.org/W2321219388","https://openalex.org/W2413566075","https://openalex.org/W3138359038","https://openalex.org/W3199816777","https://openalex.org/W3216710934","https://openalex.org/W6804211541"],"related_works":["https://openalex.org/W2992897358","https://openalex.org/W2327254200","https://openalex.org/W2287022550","https://openalex.org/W2027697249","https://openalex.org/W2154446560","https://openalex.org/W1965337273","https://openalex.org/W1849611347","https://openalex.org/W2050503762","https://openalex.org/W2284242891","https://openalex.org/W2149504766"],"abstract_inverted_index":{"Wafer":[0],"warpage":[1,15,37,50,68],"can":[2],"cause":[3],"severe":[4],"issues":[5],"in":[6,38],"semiconductor":[7],"fabrication":[8],"process.":[9],"In":[10],"3D":[11,21],"Flash":[12],"industry,":[13],"wafer":[14,36,49,67,86],"control":[16],"is":[17],"crucial":[18],"to":[19,30,53,75],"achieve":[20],"NAND":[22,40,81],"scaling.":[23],"This":[24],"study":[25],"proposed":[26],"an":[27],"analytical":[28],"model":[29,55,62],"rapidly":[31],"predict":[32],"the":[33,39,54,77],"stepwise":[34,66],"asymmetric":[35,85],"integration":[41],"procedure.":[42],"The":[43,61],"impact":[44],"of":[45,79],"film":[46],"pattern":[47],"on":[48,84],"was":[51,63,73],"introduced":[52],"via":[56],"effective":[57],"material":[58],"stiffness":[59],"calculation.":[60],"validated":[64],"by":[65],"measurements,":[69],"and":[70],"parametric":[71],"analysis":[72],"conducted":[74],"investigate":[76],"effects":[78],"key":[80],"design":[82],"parameters":[83],"warpage.":[87]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}