{"id":"https://openalex.org/W2789902386","doi":"https://doi.org/10.1109/igcc.2017.8323583","title":"Increasing interposer utilization: A scalable, energy efficient and high bandwidth multicore-multichip integration solution","display_name":"Increasing interposer utilization: A scalable, energy efficient and high bandwidth multicore-multichip integration solution","publication_year":2017,"publication_date":"2017-10-01","ids":{"openalex":"https://openalex.org/W2789902386","doi":"https://doi.org/10.1109/igcc.2017.8323583","mag":"2789902386"},"language":"en","primary_location":{"id":"doi:10.1109/igcc.2017.8323583","is_oa":false,"landing_page_url":"https://doi.org/10.1109/igcc.2017.8323583","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 Eighth International Green and Sustainable Computing Conference (IGSC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101929190","display_name":"M Meraj Ahmed","orcid":"https://orcid.org/0000-0001-8711-0162"},"institutions":[{"id":"https://openalex.org/I155173764","display_name":"Rochester Institute of Technology","ror":"https://ror.org/00v4yb702","country_code":"US","type":"education","lineage":["https://openalex.org/I155173764"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"M Meraj Ahmed","raw_affiliation_strings":["Rochester Institute of Technology, Rochester, NY, USA"],"affiliations":[{"raw_affiliation_string":"Rochester Institute of Technology, Rochester, NY, USA","institution_ids":["https://openalex.org/I155173764"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017946271","display_name":"Md. Shahriar Shamim","orcid":null},"institutions":[{"id":"https://openalex.org/I155173764","display_name":"Rochester Institute of Technology","ror":"https://ror.org/00v4yb702","country_code":"US","type":"education","lineage":["https://openalex.org/I155173764"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Md. Shahriar Shamim","raw_affiliation_strings":["Rochester Institute of Technology, Rochester, NY, USA"],"affiliations":[{"raw_affiliation_string":"Rochester Institute of Technology, Rochester, NY, USA","institution_ids":["https://openalex.org/I155173764"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004003516","display_name":"Naseef Mansoor","orcid":"https://orcid.org/0000-0003-4280-697X"},"institutions":[{"id":"https://openalex.org/I155173764","display_name":"Rochester Institute of Technology","ror":"https://ror.org/00v4yb702","country_code":"US","type":"education","lineage":["https://openalex.org/I155173764"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Naseef Mansoor","raw_affiliation_strings":["Rochester Institute of Technology, Rochester, NY, USA"],"affiliations":[{"raw_affiliation_string":"Rochester Institute of Technology, Rochester, NY, USA","institution_ids":["https://openalex.org/I155173764"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047268116","display_name":"Sayed Ashraf Mamun","orcid":"https://orcid.org/0000-0002-0639-8801"},"institutions":[{"id":"https://openalex.org/I155173764","display_name":"Rochester Institute of Technology","ror":"https://ror.org/00v4yb702","country_code":"US","type":"education","lineage":["https://openalex.org/I155173764"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sayed Ashraf Mamun","raw_affiliation_strings":["Rochester Institute of Technology, Rochester, NY, USA"],"affiliations":[{"raw_affiliation_string":"Rochester Institute of Technology, Rochester, NY, USA","institution_ids":["https://openalex.org/I155173764"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051765631","display_name":"Amlan Ganguly","orcid":"https://orcid.org/0000-0002-3616-7596"},"institutions":[{"id":"https://openalex.org/I155173764","display_name":"Rochester Institute of Technology","ror":"https://ror.org/00v4yb702","country_code":"US","type":"education","lineage":["https://openalex.org/I155173764"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Amlan Ganguly","raw_affiliation_strings":["Rochester Institute of Technology, Rochester, NY, USA"],"affiliations":[{"raw_affiliation_string":"Rochester Institute of Technology, Rochester, NY, USA","institution_ids":["https://openalex.org/I155173764"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5101929190"],"corresponding_institution_ids":["https://openalex.org/I155173764"],"apc_list":null,"apc_paid":null,"fwci":2.072,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.89294191,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9927999973297119,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.9133915901184082},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7450008988380432},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.6559186577796936},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6153422594070435},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.49636131525039673},{"id":"https://openalex.org/keywords/network-on-a-chip","display_name":"Network on a chip","score":0.4701298177242279},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4534369707107544},{"id":"https://openalex.org/keywords/multistage-interconnection-networks","display_name":"Multistage interconnection networks","score":0.42846250534057617},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.41987675428390503},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.24343937635421753},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.1577019989490509},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.1526072919368744},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10663479566574097}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.9133915901184082},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7450008988380432},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.6559186577796936},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6153422594070435},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.49636131525039673},{"id":"https://openalex.org/C128519102","wikidata":"https://www.wikidata.org/wiki/Q339554","display_name":"Network on a chip","level":2,"score":0.4701298177242279},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4534369707107544},{"id":"https://openalex.org/C2776832011","wikidata":"https://www.wikidata.org/wiki/Q6935099","display_name":"Multistage interconnection networks","level":3,"score":0.42846250534057617},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.41987675428390503},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.24343937635421753},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.1577019989490509},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.1526072919368744},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10663479566574097},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/igcc.2017.8323583","is_oa":false,"landing_page_url":"https://doi.org/10.1109/igcc.2017.8323583","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 Eighth International Green and Sustainable Computing Conference (IGSC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8600000143051147,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W1900372095","https://openalex.org/W1939228150","https://openalex.org/W1994881154","https://openalex.org/W1994968689","https://openalex.org/W2002857293","https://openalex.org/W2022272076","https://openalex.org/W2034822545","https://openalex.org/W2051357385","https://openalex.org/W2065653320","https://openalex.org/W2071003187","https://openalex.org/W2072155733","https://openalex.org/W2072614763","https://openalex.org/W2098156582","https://openalex.org/W2128513214","https://openalex.org/W2234584938","https://openalex.org/W2471077310","https://openalex.org/W2510490015","https://openalex.org/W2553576255","https://openalex.org/W3102583595","https://openalex.org/W3169463464","https://openalex.org/W4234262577","https://openalex.org/W4253374773","https://openalex.org/W4254031053","https://openalex.org/W6648901303","https://openalex.org/W6663453407","https://openalex.org/W6720284283","https://openalex.org/W6785201681"],"related_works":["https://openalex.org/W2189226368","https://openalex.org/W4321520003","https://openalex.org/W2264708074","https://openalex.org/W3147216279","https://openalex.org/W2528892790","https://openalex.org/W2117988687","https://openalex.org/W2346543366","https://openalex.org/W311319973","https://openalex.org/W4243279819","https://openalex.org/W2009860552"],"abstract_inverted_index":{"With":[0],"the":[1,63,69,73,88,92,106],"increase":[2],"in":[3,8,120],"number":[4],"of":[5,48,72,105],"processing":[6],"chips":[7,56],"platform":[9],"based":[10,79],"computation":[11],"intensive":[12],"systems":[13],"such":[14,133],"as":[15,40],"servers,":[16],"a":[17,116],"seamless,":[18],"scalable,":[19],"energy":[20,42],"efficient":[21,43],"and":[22,51,65,143],"high":[23,141],"bandwidth":[24,142],"interconnection":[25,36,118],"network":[26],"is":[27,82],"required.":[28],"Newly":[29],"envisioned":[30],"silicon":[31],"interposers":[32],"with":[33,137],"Network-on-Chip":[34],"(NoC)":[35],"framework":[37],"have":[38],"emerged":[39],"an":[41,121],"technology":[44],"for":[45,111,123],"2.5D":[46],"integration":[47,81,113],"multiple":[49,55],"processor":[50],"memory":[52],"chips,":[53],"where":[54],"are":[57,66],"mounted":[58],"on":[59],"another":[60],"die":[61],"called":[62],"interposer":[64,74,78,109,122,138],"interconnected":[67],"using":[68],"metal":[70],"layers":[71],"die.":[75],"However,":[76],"conventional":[77],"multichip":[80,112,134],"limited":[83],"to":[84],"edge-to-edge":[85],"connections":[86],"between":[87],"adjacent":[89],"dies":[90],"leaving":[91],"interposer's":[93],"routing":[94],"resources":[95,110],"underutilized.":[96],"In":[97],"this":[98],"paper,":[99],"we":[100,130],"propose":[101],"large":[102],"scale":[103],"utilization":[104],"available":[107],"abundant":[108],"by":[114],"implementing":[115],"hypercube":[117],"architecture":[119],"chip-to-chip":[124],"communication.":[125],"Through":[126],"system":[127,135],"level":[128],"simulations,":[129],"demonstrate":[131],"that":[132],"integrated":[136],"can":[139],"provide":[140],"energy-efficient":[144],"communication":[145],"under":[146],"various":[147],"traffic":[148],"patterns.":[149]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2020,"cited_by_count":6},{"year":2018,"cited_by_count":4}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}