{"id":"https://openalex.org/W2118405274","doi":"https://doi.org/10.1109/igarss.2008.4779996","title":"Fabrication of Multi-Scale Triangular Patch High Impedance Ground Planes to Improve the Bandwidth of Conformal Bow-Tie Antennas for Remote Sensing","display_name":"Fabrication of Multi-Scale Triangular Patch High Impedance Ground Planes to Improve the Bandwidth of Conformal Bow-Tie Antennas for Remote Sensing","publication_year":2008,"publication_date":"2008-01-01","ids":{"openalex":"https://openalex.org/W2118405274","doi":"https://doi.org/10.1109/igarss.2008.4779996","mag":"2118405274"},"language":"en","primary_location":{"id":"doi:10.1109/igarss.2008.4779996","is_oa":false,"landing_page_url":"https://doi.org/10.1109/igarss.2008.4779996","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IGARSS 2008 - 2008 IEEE International Geoscience and Remote Sensing Symposium","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5033705210","display_name":"Bora Cakiroglu","orcid":null},"institutions":[{"id":"https://openalex.org/I55061410","display_name":"U.S. Air Force Institute of Technology","ror":"https://ror.org/03f9f1d95","country_code":"US","type":"education","lineage":["https://openalex.org/I1294991024","https://openalex.org/I1330347796","https://openalex.org/I1330347796","https://openalex.org/I2802362820","https://openalex.org/I4210089612","https://openalex.org/I4210102105","https://openalex.org/I4210102105","https://openalex.org/I55061410"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Bora Cakiroglu","raw_affiliation_strings":["Air Force Institute of Technology, Dayton, OH, USA","[Air Force Institute of Technology, Dayton, OH]"],"affiliations":[{"raw_affiliation_string":"Air Force Institute of Technology, Dayton, OH, USA","institution_ids":["https://openalex.org/I55061410"]},{"raw_affiliation_string":"[Air Force Institute of Technology, Dayton, OH]","institution_ids":["https://openalex.org/I55061410"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046185500","display_name":"Peter J. Collins","orcid":"https://orcid.org/0000-0003-4478-3644"},"institutions":[{"id":"https://openalex.org/I55061410","display_name":"U.S. Air Force Institute of Technology","ror":"https://ror.org/03f9f1d95","country_code":"US","type":"education","lineage":["https://openalex.org/I1294991024","https://openalex.org/I1330347796","https://openalex.org/I1330347796","https://openalex.org/I2802362820","https://openalex.org/I4210089612","https://openalex.org/I4210102105","https://openalex.org/I4210102105","https://openalex.org/I55061410"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Peter J. Collins","raw_affiliation_strings":["Air Force Institute of Technology, Dayton, OH, USA","[Air Force Institute of Technology, Dayton, OH]"],"affiliations":[{"raw_affiliation_string":"Air Force Institute of Technology, Dayton, OH, USA","institution_ids":["https://openalex.org/I55061410"]},{"raw_affiliation_string":"[Air Force Institute of Technology, Dayton, OH]","institution_ids":["https://openalex.org/I55061410"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012196419","display_name":"Michael J. Havrilla","orcid":"https://orcid.org/0000-0003-2330-0658"},"institutions":[{"id":"https://openalex.org/I55061410","display_name":"U.S. Air Force Institute of Technology","ror":"https://ror.org/03f9f1d95","country_code":"US","type":"education","lineage":["https://openalex.org/I1294991024","https://openalex.org/I1330347796","https://openalex.org/I1330347796","https://openalex.org/I2802362820","https://openalex.org/I4210089612","https://openalex.org/I4210102105","https://openalex.org/I4210102105","https://openalex.org/I55061410"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael J. Havrilla","raw_affiliation_strings":["Air Force Institute of Technology, Dayton, OH, USA","[Air Force Institute of Technology, Dayton, OH]"],"affiliations":[{"raw_affiliation_string":"Air Force Institute of Technology, Dayton, OH, USA","institution_ids":["https://openalex.org/I55061410"]},{"raw_affiliation_string":"[Air Force Institute of Technology, Dayton, OH]","institution_ids":["https://openalex.org/I55061410"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015143006","display_name":"Kubilay Sertel","orcid":"https://orcid.org/0000-0002-9441-812X"},"institutions":[{"id":"https://openalex.org/I52357470","display_name":"The Ohio State University","ror":"https://ror.org/00rs6vg23","country_code":"US","type":"education","lineage":["https://openalex.org/I52357470"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kubilay Sertel","raw_affiliation_strings":["ElectroScience Laboratory, Ohio State Uinversity, Columbus, OH, USA","ElectroScience Lab., Ohio State Univ., Columbus, OH"],"affiliations":[{"raw_affiliation_string":"ElectroScience Laboratory, Ohio State Uinversity, Columbus, OH, USA","institution_ids":["https://openalex.org/I52357470"]},{"raw_affiliation_string":"ElectroScience Lab., Ohio State Univ., Columbus, OH","institution_ids":["https://openalex.org/I52357470"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113508461","display_name":"A.J. Terzuoli","orcid":null},"institutions":[{"id":"https://openalex.org/I55061410","display_name":"U.S. Air Force Institute of Technology","ror":"https://ror.org/03f9f1d95","country_code":"US","type":"education","lineage":["https://openalex.org/I1294991024","https://openalex.org/I1330347796","https://openalex.org/I1330347796","https://openalex.org/I2802362820","https://openalex.org/I4210089612","https://openalex.org/I4210102105","https://openalex.org/I4210102105","https://openalex.org/I55061410"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Andrew J. Terzuoli","raw_affiliation_strings":["Air Force Institute of Technology, Dayton, OH, USA","[Air Force Institute of Technology, Dayton, OH]"],"affiliations":[{"raw_affiliation_string":"Air Force Institute of Technology, Dayton, OH, USA","institution_ids":["https://openalex.org/I55061410"]},{"raw_affiliation_string":"[Air Force Institute of Technology, Dayton, OH]","institution_ids":["https://openalex.org/I55061410"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5033705210"],"corresponding_institution_ids":["https://openalex.org/I55061410"],"apc_list":null,"apc_paid":null,"fwci":0.9146,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.8102909,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"IV ","last_page":" 1406"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11383","display_name":"Advanced Antenna and Metasurface Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11383","display_name":"Advanced Antenna and Metasurface Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10069","display_name":"Antenna Design and Analysis","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bow-tie","display_name":"Bow tie","score":0.912713885307312},{"id":"https://openalex.org/keywords/ground-plane","display_name":"Ground plane","score":0.8118883371353149},{"id":"https://openalex.org/keywords/patch-antenna","display_name":"Patch antenna","score":0.5983332991600037},{"id":"https://openalex.org/keywords/conductor","display_name":"Conductor","score":0.5664253830909729},{"id":"https://openalex.org/keywords/microstrip-antenna","display_name":"Microstrip antenna","score":0.5493245124816895},{"id":"https://openalex.org/keywords/conformal-map","display_name":"Conformal map","score":0.5429278612136841},{"id":"https://openalex.org/keywords/electrical-impedance","display_name":"Electrical impedance","score":0.4725705683231354},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.4669322371482849},{"id":"https://openalex.org/keywords/antenna","display_name":"Antenna (radio)","score":0.4076481759548187},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.397442489862442},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3176523745059967},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.29703208804130554},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2707661986351013},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.26932787895202637},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.2174428105354309},{"id":"https://openalex.org/keywords/geometry","display_name":"Geometry","score":0.15488961338996887},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.10668802261352539}],"concepts":[{"id":"https://openalex.org/C2777652565","wikidata":"https://www.wikidata.org/wiki/Q4950686","display_name":"Bow tie","level":3,"score":0.912713885307312},{"id":"https://openalex.org/C88764893","wikidata":"https://www.wikidata.org/wiki/Q1547722","display_name":"Ground plane","level":3,"score":0.8118883371353149},{"id":"https://openalex.org/C159238334","wikidata":"https://www.wikidata.org/wiki/Q1419428","display_name":"Patch antenna","level":3,"score":0.5983332991600037},{"id":"https://openalex.org/C34800285","wikidata":"https://www.wikidata.org/wiki/Q5159395","display_name":"Conductor","level":2,"score":0.5664253830909729},{"id":"https://openalex.org/C170349913","wikidata":"https://www.wikidata.org/wiki/Q13402882","display_name":"Microstrip antenna","level":3,"score":0.5493245124816895},{"id":"https://openalex.org/C98214594","wikidata":"https://www.wikidata.org/wiki/Q850275","display_name":"Conformal map","level":2,"score":0.5429278612136841},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.4725705683231354},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.4669322371482849},{"id":"https://openalex.org/C21822782","wikidata":"https://www.wikidata.org/wiki/Q131214","display_name":"Antenna (radio)","level":2,"score":0.4076481759548187},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.397442489862442},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3176523745059967},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.29703208804130554},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2707661986351013},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.26932787895202637},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.2174428105354309},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.15488961338996887},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.10668802261352539},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/igarss.2008.4779996","is_oa":false,"landing_page_url":"https://doi.org/10.1109/igarss.2008.4779996","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IGARSS 2008 - 2008 IEEE International Geoscience and Remote Sensing Symposium","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W47054843","https://openalex.org/W1981753378","https://openalex.org/W2078830849","https://openalex.org/W2160595416","https://openalex.org/W4205866191"],"related_works":["https://openalex.org/W2007332363","https://openalex.org/W2056351415","https://openalex.org/W2129115245","https://openalex.org/W3084713631","https://openalex.org/W2406878935","https://openalex.org/W2189444565","https://openalex.org/W2988329245","https://openalex.org/W2166129146","https://openalex.org/W2766256779","https://openalex.org/W1916400006"],"abstract_inverted_index":{"The":[0,22,64],"realization":[1],"and":[2,76],"performance":[3,66],"is":[4,67,78],"demonstrated":[5,79],"of":[6,41,58,69,84],"a":[7,13,29,54,85,95],"conformal":[8],"bow-tie":[9,43,60],"antenna":[10],"printed":[11],"on":[12],"multi-scale":[14],"triangular":[15,51],"element":[16],"mushroom":[17],"structure":[18],"high-impedance":[19],"ground-plane":[20,89],"(HIGP).":[21],"two-scale":[23],"HIGP":[24,45],"was":[25],"designed":[26],"to":[27,33,49,52],"exhibit":[28],"large":[30],"frequency":[31,39],"band-gap":[32],"cover":[34],"the":[35,42,59,62,70,81],"relatively":[36],"broad":[37],"operational":[38],"bandwidth":[40],"antenna.":[44],"elements":[46],"were":[47],"chosen":[48],"be":[50,91],"form":[53],"natural":[55],"commensurate":[56],"blending":[57],"into":[61],"structure.":[63],"experimental":[65],"characterized":[68],"bow-tie-HIGP":[71],"combination":[72],"from":[73],"2-10":[74],"GHz,":[75],"it":[77],"that":[80],"negative":[82],"effects":[83],"perfect":[86],"electric":[87],"conductor":[88],"may":[90],"mitigated":[92],"by":[93],"using":[94],"HIGP.":[96]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}