{"id":"https://openalex.org/W1966254250","doi":"https://doi.org/10.1109/iembs.2011.6090798","title":"Ultra-high density packaging technology for injectable medical devices","display_name":"Ultra-high density packaging technology for injectable medical devices","publication_year":2011,"publication_date":"2011-08-01","ids":{"openalex":"https://openalex.org/W1966254250","doi":"https://doi.org/10.1109/iembs.2011.6090798","mag":"1966254250","pmid":"https://pubmed.ncbi.nlm.nih.gov/22254946"},"language":"en","primary_location":{"id":"doi:10.1109/iembs.2011.6090798","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iembs.2011.6090798","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref","pubmed"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103208319","display_name":"Bryan McLaughlin","orcid":"https://orcid.org/0000-0001-6456-3812"},"institutions":[{"id":"https://openalex.org/I1343143571","display_name":"Draper Laboratory","ror":"https://ror.org/04378d909","country_code":"US","type":"funder","lineage":["https://openalex.org/I1343143571"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"B. L. McLaughlin","raw_affiliation_strings":["Charles Stark Draper Laboratory, Cambridge, MA 02139, USA","Charles Stark Draper Laboratory, Cambridge, MA, 02139"],"affiliations":[{"raw_affiliation_string":"Charles Stark Draper Laboratory, Cambridge, MA 02139, USA","institution_ids":["https://openalex.org/I1343143571"]},{"raw_affiliation_string":"Charles Stark Draper Laboratory, Cambridge, MA, 02139","institution_ids":["https://openalex.org/I1343143571"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101844549","display_name":"Brian Smith","orcid":"https://orcid.org/0000-0002-5297-1891"},"institutions":[{"id":"https://openalex.org/I1343143571","display_name":"Draper Laboratory","ror":"https://ror.org/04378d909","country_code":"US","type":"funder","lineage":["https://openalex.org/I1343143571"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. Smith","raw_affiliation_strings":["Charles Stark Draper Laboratory, Inc., Cambridge, MA, USA","Charles Stark Draper Laboratory, Cambridge, MA, 02139"],"affiliations":[{"raw_affiliation_string":"Charles Stark Draper Laboratory, Inc., Cambridge, MA, USA","institution_ids":["https://openalex.org/I1343143571"]},{"raw_affiliation_string":"Charles Stark Draper Laboratory, Cambridge, MA, 02139","institution_ids":["https://openalex.org/I1343143571"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091588384","display_name":"John Lachapelle","orcid":null},"institutions":[{"id":"https://openalex.org/I1343143571","display_name":"Draper Laboratory","ror":"https://ror.org/04378d909","country_code":"US","type":"funder","lineage":["https://openalex.org/I1343143571"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Lachapelle","raw_affiliation_strings":["Charles Stark Draper Laboratory, Inc., Cambridge, MA, USA","Charles Stark Draper Laboratory, Cambridge, MA, 02139"],"affiliations":[{"raw_affiliation_string":"Charles Stark Draper Laboratory, Inc., Cambridge, MA, USA","institution_ids":["https://openalex.org/I1343143571"]},{"raw_affiliation_string":"Charles Stark Draper Laboratory, Cambridge, MA, 02139","institution_ids":["https://openalex.org/I1343143571"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047627506","display_name":"D. Traviglia","orcid":null},"institutions":[{"id":"https://openalex.org/I1343143571","display_name":"Draper Laboratory","ror":"https://ror.org/04378d909","country_code":"US","type":"funder","lineage":["https://openalex.org/I1343143571"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Traviglia","raw_affiliation_strings":["Charles Stark Draper Laboratory, Inc., Cambridge, MA, USA","Charles Stark Draper Laboratory, Cambridge, MA, 02139"],"affiliations":[{"raw_affiliation_string":"Charles Stark Draper Laboratory, Inc., Cambridge, MA, USA","institution_ids":["https://openalex.org/I1343143571"]},{"raw_affiliation_string":"Charles Stark Draper Laboratory, Cambridge, MA, 02139","institution_ids":["https://openalex.org/I1343143571"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110006733","display_name":"T. S. Sriram","orcid":null},"institutions":[{"id":"https://openalex.org/I1343143571","display_name":"Draper Laboratory","ror":"https://ror.org/04378d909","country_code":"US","type":"funder","lineage":["https://openalex.org/I1343143571"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. S. Sriram","raw_affiliation_strings":["Charles Stark Draper Laboratory, Inc., Cambridge, MA, USA","Charles Stark Draper Laboratory, Cambridge, MA, 02139"],"affiliations":[{"raw_affiliation_string":"Charles Stark Draper Laboratory, Inc., Cambridge, MA, USA","institution_ids":["https://openalex.org/I1343143571"]},{"raw_affiliation_string":"Charles Stark Draper Laboratory, Cambridge, MA, 02139","institution_ids":["https://openalex.org/I1343143571"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5005571268","display_name":"David O'Dowd","orcid":null},"institutions":[{"id":"https://openalex.org/I1343143571","display_name":"Draper Laboratory","ror":"https://ror.org/04378d909","country_code":"US","type":"funder","lineage":["https://openalex.org/I1343143571"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. O'Dowd","raw_affiliation_strings":["Charles Stark Draper Laboratory, Inc., Cambridge, MA, USA","Charles Stark Draper Laboratory, Cambridge, MA, 02139"],"affiliations":[{"raw_affiliation_string":"Charles Stark Draper Laboratory, Inc., Cambridge, MA, USA","institution_ids":["https://openalex.org/I1343143571"]},{"raw_affiliation_string":"Charles Stark Draper Laboratory, Cambridge, MA, 02139","institution_ids":["https://openalex.org/I1343143571"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5103208319"],"corresponding_institution_ids":["https://openalex.org/I1343143571"],"apc_list":null,"apc_paid":null,"fwci":0.265,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.58078895,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"2011","issue":null,"first_page":"2897","last_page":"2900"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9872999787330627,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.7351831197738647},{"id":"https://openalex.org/keywords/miniaturization","display_name":"Miniaturization","score":0.7185417413711548},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.645564079284668},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.5947558283805847},{"id":"https://openalex.org/keywords/leverage","display_name":"Leverage (statistics)","score":0.5574578642845154},{"id":"https://openalex.org/keywords/application-specific-integrated-circuit","display_name":"Application-specific integrated circuit","score":0.5012161731719971},{"id":"https://openalex.org/keywords/packaging-engineering","display_name":"Packaging engineering","score":0.4661126732826233},{"id":"https://openalex.org/keywords/medical-device","display_name":"Medical device","score":0.4346033036708832},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.42407214641571045},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3732612133026123},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3203703463077545},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.28808555006980896},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2783997058868408},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2661920189857483},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.127098947763443},{"id":"https://openalex.org/keywords/biomedical-engineering","display_name":"Biomedical engineering","score":0.09704762697219849}],"concepts":[{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.7351831197738647},{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.7185417413711548},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.645564079284668},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.5947558283805847},{"id":"https://openalex.org/C153083717","wikidata":"https://www.wikidata.org/wiki/Q6535263","display_name":"Leverage (statistics)","level":2,"score":0.5574578642845154},{"id":"https://openalex.org/C77390884","wikidata":"https://www.wikidata.org/wiki/Q217302","display_name":"Application-specific integrated circuit","level":2,"score":0.5012161731719971},{"id":"https://openalex.org/C193149544","wikidata":"https://www.wikidata.org/wiki/Q7122904","display_name":"Packaging engineering","level":2,"score":0.4661126732826233},{"id":"https://openalex.org/C3020535179","wikidata":"https://www.wikidata.org/wiki/Q6554101","display_name":"Medical device","level":2,"score":0.4346033036708832},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.42407214641571045},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3732612133026123},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3203703463077545},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.28808555006980896},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2783997058868408},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2661920189857483},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.127098947763443},{"id":"https://openalex.org/C136229726","wikidata":"https://www.wikidata.org/wiki/Q327092","display_name":"Biomedical engineering","level":1,"score":0.09704762697219849},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.0},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.0}],"mesh":[{"descriptor_ui":"D004864","descriptor_name":"Equipment and Supplies","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D004864","descriptor_name":"Equipment and Supplies","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D004864","descriptor_name":"Equipment and Supplies","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D008904","descriptor_name":"Miniaturization","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D008904","descriptor_name":"Miniaturization","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D008904","descriptor_name":"Miniaturization","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false}],"locations_count":2,"locations":[{"id":"doi:10.1109/iembs.2011.6090798","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iembs.2011.6090798","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society","raw_type":"proceedings-article"},{"id":"pmid:22254946","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/22254946","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320309015","display_name":"Charles Stark Draper Laboratory","ror":"https://ror.org/04378d909"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2001870828","https://openalex.org/W2042314125","https://openalex.org/W2108560657","https://openalex.org/W2125660523","https://openalex.org/W2128969534","https://openalex.org/W2540294823"],"related_works":["https://openalex.org/W4240199911","https://openalex.org/W2358501646","https://openalex.org/W2357903062","https://openalex.org/W2070619027","https://openalex.org/W1556285067","https://openalex.org/W4234117135","https://openalex.org/W3162917068","https://openalex.org/W2099438907","https://openalex.org/W4213307373","https://openalex.org/W2788051635"],"abstract_inverted_index":{"Future":[0],"implantable":[1],"medical":[2,32],"devices":[3],"will":[4],"be":[5],"highly":[6],"miniaturized":[7],"and":[8,15,42],"almost":[9],"certainly":[10],"leverage":[11],"die-level":[12],"electronics":[13],"miniaturization":[14],"packaging.":[16],"Here,":[17],"an":[18],"integrated":[19],"ultra-high":[20],"density":[21],"packaging":[22,52],"platform":[23],"is":[24],"proposed":[25],"to":[26],"enable":[27],"a":[28,46],"new":[29],"class":[30],"of":[31],"devices.":[33],"Dense":[34],"modules":[35],"are":[36],"obtained":[37],"by":[38],"interconnecting":[39],"existing":[40],"ASICs":[41],"discrete":[43],"components":[44],"using":[45],"process":[47],"which":[48],"achieves":[49],"the":[50],"highest":[51],"densities":[53],"available.":[54]},"counts_by_year":[{"year":2014,"cited_by_count":1}],"updated_date":"2026-01-13T01:12:25.745995","created_date":"2025-10-10T00:00:00"}