{"id":"https://openalex.org/W4310972258","doi":"https://doi.org/10.1109/iecon49645.2022.9968498","title":"Investigation of Thermal Deformation Characteristics in IGBT Modules Under Bonding Wire Cracking Condition","display_name":"Investigation of Thermal Deformation Characteristics in IGBT Modules Under Bonding Wire Cracking Condition","publication_year":2022,"publication_date":"2022-10-17","ids":{"openalex":"https://openalex.org/W4310972258","doi":"https://doi.org/10.1109/iecon49645.2022.9968498"},"language":"en","primary_location":{"id":"doi:10.1109/iecon49645.2022.9968498","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iecon49645.2022.9968498","pdf_url":null,"source":{"id":"https://openalex.org/S4363607717","display_name":"IECON 2022 \u2013 48th Annual Conference of the IEEE Industrial Electronics Society","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IECON 2022 \u2013 48th Annual Conference of the IEEE Industrial Electronics Society","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100427130","display_name":"Cong Chen","orcid":"https://orcid.org/0000-0003-3499-6312"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Cong Chen","raw_affiliation_strings":["University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063242124","display_name":"Libing Bai","orcid":"https://orcid.org/0000-0001-8906-0576"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Libing Bai","raw_affiliation_strings":["University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032744914","display_name":"Jun Luo","orcid":"https://orcid.org/0000-0003-1782-6653"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun Luo","raw_affiliation_strings":["University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100329225","display_name":"Jiahao Wang","orcid":"https://orcid.org/0009-0001-2008-5051"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiahao Wang","raw_affiliation_strings":["University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051170836","display_name":"Quan Zhou","orcid":"https://orcid.org/0000-0002-9351-5614"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Quan Zhou","raw_affiliation_strings":["University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100436785","display_name":"Jie Zhang","orcid":"https://orcid.org/0000-0002-6547-1570"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jie Zhang","raw_affiliation_strings":["University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078781533","display_name":"Lulu Tian","orcid":"https://orcid.org/0000-0001-5820-0337"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lulu Tian","raw_affiliation_strings":["University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101993854","display_name":"Wei Huang","orcid":"https://orcid.org/0000-0002-0973-8015"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Huang","raw_affiliation_strings":["University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5068200524","display_name":"Yuhua Cheng","orcid":"https://orcid.org/0000-0001-8704-5241"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuhua Cheng","raw_affiliation_strings":["University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China,School of Automation Engineering,Chengdu,China","institution_ids":["https://openalex.org/I150229711"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I150229711"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"100","issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10624","display_name":"Silicon and Solar Cell Technologies","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/insulated-gate-bipolar-transistor","display_name":"Insulated-gate bipolar transistor","score":0.7748004198074341},{"id":"https://openalex.org/keywords/cracking","display_name":"Cracking","score":0.7495797872543335},{"id":"https://openalex.org/keywords/deformation","display_name":"Deformation (meteorology)","score":0.734974205493927},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7245304584503174},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.674951434135437},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6475009322166443},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.565055251121521},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.4684726297855377},{"id":"https://openalex.org/keywords/work","display_name":"Work (physics)","score":0.4633380174636841},{"id":"https://openalex.org/keywords/power-module","display_name":"Power module","score":0.4134064018726349},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.4094460904598236},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3669206500053406},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.34299159049987793},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.32422810792922974},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.22046124935150146},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.18817737698554993},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16255471110343933},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.0755283534526825},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.06445270776748657}],"concepts":[{"id":"https://openalex.org/C28285623","wikidata":"https://www.wikidata.org/wiki/Q176110","display_name":"Insulated-gate bipolar transistor","level":3,"score":0.7748004198074341},{"id":"https://openalex.org/C58396970","wikidata":"https://www.wikidata.org/wiki/Q212749","display_name":"Cracking","level":2,"score":0.7495797872543335},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.734974205493927},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7245304584503174},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.674951434135437},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6475009322166443},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.565055251121521},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.4684726297855377},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.4633380174636841},{"id":"https://openalex.org/C141812795","wikidata":"https://www.wikidata.org/wiki/Q7236534","display_name":"Power module","level":3,"score":0.4134064018726349},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.4094460904598236},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3669206500053406},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.34299159049987793},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.32422810792922974},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.22046124935150146},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.18817737698554993},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16255471110343933},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0755283534526825},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.06445270776748657},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iecon49645.2022.9968498","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iecon49645.2022.9968498","pdf_url":null,"source":{"id":"https://openalex.org/S4363607717","display_name":"IECON 2022 \u2013 48th Annual Conference of the IEEE Industrial Electronics Society","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IECON 2022 \u2013 48th Annual Conference of the IEEE Industrial Electronics Society","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1490649090","https://openalex.org/W1973857030","https://openalex.org/W2008706439","https://openalex.org/W2023096650","https://openalex.org/W2082619602","https://openalex.org/W2167075460","https://openalex.org/W2757841039","https://openalex.org/W2975350496","https://openalex.org/W2990765135","https://openalex.org/W3023328319","https://openalex.org/W3121910998","https://openalex.org/W4205182622","https://openalex.org/W4280633616","https://openalex.org/W6629463882"],"related_works":["https://openalex.org/W4385326046","https://openalex.org/W2159439554","https://openalex.org/W2757841039","https://openalex.org/W4388199707","https://openalex.org/W1483223816","https://openalex.org/W2117029960","https://openalex.org/W3188277291","https://openalex.org/W4293868801","https://openalex.org/W2992455282","https://openalex.org/W3207339406"],"abstract_inverted_index":{"This":[0,118],"paper":[1],"presents":[2],"an":[3],"investigation":[4],"of":[5,24,77,90],"dynamic":[6],"thermal":[7,47,52,73,87],"deformation":[8,48,53,74,88],"characteristics":[9,55],"in":[10],"insulated":[11],"gate":[12],"bipolar":[13],"transistor":[14],"(IGBT)":[15],"modules":[16,40],"under":[17,56],"bonding":[18,57,80],"wire":[19,58,81],"cracking":[20],"condition":[21],"by":[22,83,95],"means":[23],"finite":[25],"element":[26],"simulation":[27,116],"and":[28,43,60,65,106,123,132],"experimental":[29,101],"validation.":[30],"Firstly,":[31],"a":[32],"realistically":[33],"restored":[34],"three-dimensional":[35],"geometric":[36],"model":[37],"for":[38,136],"IGBT":[39],"is":[41,103],"constructed":[42],"simulated":[44],"to":[45,126],"investigate":[46],"field.":[49],"Then":[50],"the":[51,72,78,86,100,107,115],"field":[54],"intact":[59],"cracked":[61,79],"conditions":[62],"are":[63],"compared":[64],"analyzed":[66],"indepth.":[67],"The":[68],"result":[69],"shows":[70,109],"that":[71,110],"fluctuation":[75],"amplitude":[76],"decreases":[82],"82%,":[84],"while":[85],"value":[89],"other":[91],"unbroken":[92],"wires":[93],"increases":[94],"35%":[96],"on":[97],"average.":[98],"Finally,":[99],"verification":[102],"carried":[104],"out,":[105],"conclusion":[108],"it":[111],"coincides":[112],"well":[113],"with":[114],"results.":[117],"work":[119],"provides":[120],"confident":[121],"evidence":[122],"important":[124],"data":[125],"facilitate":[127],"more":[128],"precise":[129],"life-time":[130],"predictions":[131],"thermal-mechanical":[133],"reliability":[134],"assessment":[135],"power":[137],"electronic":[138],"modules.":[139]},"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}