{"id":"https://openalex.org/W3214257204","doi":"https://doi.org/10.1109/iecon48115.2021.9589724","title":"Enhanced Cooling of Multilayer PCB Motor Windings Using Thermal Vias","display_name":"Enhanced Cooling of Multilayer PCB Motor Windings Using Thermal Vias","publication_year":2021,"publication_date":"2021-10-13","ids":{"openalex":"https://openalex.org/W3214257204","doi":"https://doi.org/10.1109/iecon48115.2021.9589724","mag":"3214257204"},"language":"en","primary_location":{"id":"doi:10.1109/iecon48115.2021.9589724","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iecon48115.2021.9589724","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IECON 2021 \u2013 47th Annual Conference of the IEEE Industrial Electronics Society","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101515160","display_name":"Andreas Bauer","orcid":"https://orcid.org/0009-0007-9305-6749"},"institutions":[{"id":"https://openalex.org/I73114660","display_name":"University of Applied Sciences Kaiserslautern","ror":"https://ror.org/05dkqa017","country_code":"DE","type":"education","lineage":["https://openalex.org/I73114660"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Andreas Bauer","raw_affiliation_strings":["P3E - Power Electronics, Electronics and EMC, Kaiserslautern University of Applied Sciences, Kaiserslautern, Germany"],"affiliations":[{"raw_affiliation_string":"P3E - Power Electronics, Electronics and EMC, Kaiserslautern University of Applied Sciences, Kaiserslautern, Germany","institution_ids":["https://openalex.org/I73114660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067926458","display_name":"Benjamin H. Zacher","orcid":"https://orcid.org/0000-0002-1746-4130"},"institutions":[{"id":"https://openalex.org/I73114660","display_name":"University of Applied Sciences Kaiserslautern","ror":"https://ror.org/05dkqa017","country_code":"DE","type":"education","lineage":["https://openalex.org/I73114660"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Benjamin H. Zacher","raw_affiliation_strings":["P3E - Power Electronics, Electronics and EMC, Kaiserslautern University of Applied Sciences, Kaiserslautern, Germany"],"affiliations":[{"raw_affiliation_string":"P3E - Power Electronics, Electronics and EMC, Kaiserslautern University of Applied Sciences, Kaiserslautern, Germany","institution_ids":["https://openalex.org/I73114660"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103183179","display_name":"Christian Sch\u00fcmann","orcid":"https://orcid.org/0000-0003-1774-5212"},"institutions":[{"id":"https://openalex.org/I73114660","display_name":"University of Applied Sciences Kaiserslautern","ror":"https://ror.org/05dkqa017","country_code":"DE","type":"education","lineage":["https://openalex.org/I73114660"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Christian Schumann","raw_affiliation_strings":["P3E - Power Electronics, Electronics and EMC, Kaiserslautern University of Applied Sciences, Kaiserslautern, Germany"],"affiliations":[{"raw_affiliation_string":"P3E - Power Electronics, Electronics and EMC, Kaiserslautern University of Applied Sciences, Kaiserslautern, Germany","institution_ids":["https://openalex.org/I73114660"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5101515160"],"corresponding_institution_ids":["https://openalex.org/I73114660"],"apc_list":null,"apc_paid":null,"fwci":0.5014,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.64762667,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10278","display_name":"Electric Motor Design and Analysis","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10278","display_name":"Electric Motor Design and Analysis","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.996399998664856,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9948999881744385,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromagnetic-coil","display_name":"Electromagnetic coil","score":0.7770218849182129},{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.7000426054000854},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6616983413696289},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.58725905418396},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.5541243553161621},{"id":"https://openalex.org/keywords/cooling-capacity","display_name":"Cooling capacity","score":0.4798519015312195},{"id":"https://openalex.org/keywords/water-cooling","display_name":"Water cooling","score":0.4605713188648224},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.387729287147522},{"id":"https://openalex.org/keywords/automotive-engineering","display_name":"Automotive engineering","score":0.3763061463832855},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.37274110317230225},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2891601622104645},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10190883278846741},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.07420158386230469}],"concepts":[{"id":"https://openalex.org/C30403606","wikidata":"https://www.wikidata.org/wiki/Q2981904","display_name":"Electromagnetic coil","level":2,"score":0.7770218849182129},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.7000426054000854},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6616983413696289},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.58725905418396},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5541243553161621},{"id":"https://openalex.org/C164915370","wikidata":"https://www.wikidata.org/wiki/Q5167494","display_name":"Cooling capacity","level":2,"score":0.4798519015312195},{"id":"https://openalex.org/C7694927","wikidata":"https://www.wikidata.org/wiki/Q7667810","display_name":"Water cooling","level":2,"score":0.4605713188648224},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.387729287147522},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.3763061463832855},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.37274110317230225},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2891601622104645},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10190883278846741},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.07420158386230469}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iecon48115.2021.9589724","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iecon48115.2021.9589724","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IECON 2021 \u2013 47th Annual Conference of the IEEE Industrial Electronics Society","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.8799999952316284,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W2044822544","https://openalex.org/W2118068692","https://openalex.org/W2154875797","https://openalex.org/W2555209353","https://openalex.org/W2946025058","https://openalex.org/W2966933651","https://openalex.org/W2986710463","https://openalex.org/W3032723904"],"related_works":["https://openalex.org/W3031568859","https://openalex.org/W759502684","https://openalex.org/W2105990939","https://openalex.org/W4252608911","https://openalex.org/W1994592790","https://openalex.org/W2184913151","https://openalex.org/W3153323934","https://openalex.org/W2389426768","https://openalex.org/W112477172","https://openalex.org/W2030339916"],"abstract_inverted_index":{"In":[0],"this":[1],"paper":[2],"an":[3],"enhanced":[4],"cooling":[5],"strategy":[6],"for":[7,20],"PCB":[8,24],"motor":[9],"windings":[10],"is":[11,14],"presented.":[12],"It":[13],"proposed":[15],"that":[16],"using":[17,54],"thermal":[18,40,55],"vias":[19,56],"a":[21,29,46,60],"parallel":[22],"multilayer":[23],"winding":[25],"system":[26],"can":[27],"achieve":[28],"higher":[30],"current":[31,50],"carrying":[32,51],"capacity.":[33],"Experimental":[34],"measurements":[35],"were":[36],"performed":[37],"under":[38],"strict":[39],"boundary":[41],"conditions.":[42],"The":[43],"results":[44],"show":[45],"significant":[47],"increase":[48],"in":[49,57,66],"capacity":[52],"while":[53],"combination":[58],"with":[59],"heat":[61],"sink.":[62],"Further":[63],"optimization":[64],"possibilities":[65],"respect":[67],"to":[68],"axial":[69],"flux":[70],"machines":[71],"are":[72],"discussed.":[73]},"counts_by_year":[{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}