{"id":"https://openalex.org/W2774602828","doi":"https://doi.org/10.1109/iecon.2017.8216274","title":"Thermal network parameters identifying during the cooling procedure of IGBT module","display_name":"Thermal network parameters identifying during the cooling procedure of IGBT module","publication_year":2017,"publication_date":"2017-10-01","ids":{"openalex":"https://openalex.org/W2774602828","doi":"https://doi.org/10.1109/iecon.2017.8216274","mag":"2774602828"},"language":"en","primary_location":{"id":"doi:10.1109/iecon.2017.8216274","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iecon.2017.8216274","pdf_url":null,"source":{"id":"https://openalex.org/S4363608531","display_name":"IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100751991","display_name":"Jun Zhang","orcid":"https://orcid.org/0000-0001-7826-6755"},"institutions":[{"id":"https://openalex.org/I158842170","display_name":"Chongqing University","ror":"https://ror.org/023rhb549","country_code":"CN","type":"education","lineage":["https://openalex.org/I158842170"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun Zhang","raw_affiliation_strings":["State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing, China","institution_ids":["https://openalex.org/I158842170"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055871568","display_name":"Xiong Du","orcid":"https://orcid.org/0000-0002-0212-1653"},"institutions":[{"id":"https://openalex.org/I158842170","display_name":"Chongqing University","ror":"https://ror.org/023rhb549","country_code":"CN","type":"education","lineage":["https://openalex.org/I158842170"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiong Du","raw_affiliation_strings":["State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing, China","institution_ids":["https://openalex.org/I158842170"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044588691","display_name":"Pengju Sun","orcid":"https://orcid.org/0000-0003-2849-7373"},"institutions":[{"id":"https://openalex.org/I158842170","display_name":"Chongqing University","ror":"https://ror.org/023rhb549","country_code":"CN","type":"education","lineage":["https://openalex.org/I158842170"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Pengju Sun","raw_affiliation_strings":["State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing, China","institution_ids":["https://openalex.org/I158842170"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5013178600","display_name":"Heng\u2010Ming Tai","orcid":"https://orcid.org/0000-0002-0162-7492"},"institutions":[{"id":"https://openalex.org/I87208437","display_name":"University of Tulsa","ror":"https://ror.org/04wn28048","country_code":"US","type":"education","lineage":["https://openalex.org/I87208437"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Heng-Ming Tai","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Tulsa, Tulsa, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Tulsa, Tulsa, USA","institution_ids":["https://openalex.org/I87208437"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1616","last_page":"1621"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12898","display_name":"Induction Heating and Inverter Technology","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9947999715805054,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/insulated-gate-bipolar-transistor","display_name":"Insulated-gate bipolar transistor","score":0.9303339719772339},{"id":"https://openalex.org/keywords/junction-temperature","display_name":"Junction temperature","score":0.8078452348709106},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6094985008239746},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.5576542615890503},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5195075273513794},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.5171163082122803},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4631919264793396},{"id":"https://openalex.org/keywords/rc-circuit","display_name":"RC circuit","score":0.44175440073013306},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.407385915517807},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.38219234347343445},{"id":"https://openalex.org/keywords/control-theory","display_name":"Control theory (sociology)","score":0.3686782419681549},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26636943221092224},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.24527508020401},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.1330636441707611},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.12203145027160645},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10108605027198792},{"id":"https://openalex.org/keywords/short-circuit","display_name":"Short circuit","score":0.08001896739006042},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.06879013776779175}],"concepts":[{"id":"https://openalex.org/C28285623","wikidata":"https://www.wikidata.org/wiki/Q176110","display_name":"Insulated-gate bipolar transistor","level":3,"score":0.9303339719772339},{"id":"https://openalex.org/C167781694","wikidata":"https://www.wikidata.org/wiki/Q6311800","display_name":"Junction temperature","level":3,"score":0.8078452348709106},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6094985008239746},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.5576542615890503},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5195075273513794},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.5171163082122803},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4631919264793396},{"id":"https://openalex.org/C39394816","wikidata":"https://www.wikidata.org/wiki/Q939318","display_name":"RC circuit","level":4,"score":0.44175440073013306},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.407385915517807},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.38219234347343445},{"id":"https://openalex.org/C47446073","wikidata":"https://www.wikidata.org/wiki/Q5165890","display_name":"Control theory (sociology)","level":3,"score":0.3686782419681549},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26636943221092224},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.24527508020401},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.1330636441707611},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.12203145027160645},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10108605027198792},{"id":"https://openalex.org/C68583231","wikidata":"https://www.wikidata.org/wiki/Q206907","display_name":"Short circuit","level":3,"score":0.08001896739006042},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.06879013776779175},{"id":"https://openalex.org/C2775924081","wikidata":"https://www.wikidata.org/wiki/Q55608371","display_name":"Control (management)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iecon.2017.8216274","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iecon.2017.8216274","pdf_url":null,"source":{"id":"https://openalex.org/S4363608531","display_name":"IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8100000023841858,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":24,"referenced_works":["https://openalex.org/W626773769","https://openalex.org/W1485849474","https://openalex.org/W1641947315","https://openalex.org/W1966994623","https://openalex.org/W1969760775","https://openalex.org/W2026012753","https://openalex.org/W2028810166","https://openalex.org/W2044699780","https://openalex.org/W2071760299","https://openalex.org/W2089123494","https://openalex.org/W2115914763","https://openalex.org/W2132012684","https://openalex.org/W2142790790","https://openalex.org/W2167320299","https://openalex.org/W2188562960","https://openalex.org/W2193374437","https://openalex.org/W2243758511","https://openalex.org/W2332194560","https://openalex.org/W2490104653","https://openalex.org/W2588164626","https://openalex.org/W2590511242","https://openalex.org/W4285719527","https://openalex.org/W6686911556","https://openalex.org/W6733845126"],"related_works":["https://openalex.org/W2941586664","https://openalex.org/W2026438159","https://openalex.org/W4280496678","https://openalex.org/W2952153532","https://openalex.org/W2894661039","https://openalex.org/W2973352049","https://openalex.org/W4285161724","https://openalex.org/W3211169310","https://openalex.org/W4388199707","https://openalex.org/W4205930686"],"abstract_inverted_index":{"This":[0],"paper":[1],"proposes":[2],"a":[3],"thermal":[4,32,81],"network":[5,16,33],"parameter":[6],"estimation":[7],"method":[8,59,86],"to":[9,47,63,74,80,89],"find":[10],"RC":[11,92,105],"parameters":[12,34,93,106],"of":[13,20,38,51,56,69,94],"the":[14,29,49,52,57,65,76,84,95,103],"Cauer":[15,96],"using":[17],"cooling":[18],"curve":[19],"IGBT":[21,70,77],"module.":[22],"The":[23],"solutions":[24],"are":[25,45],"developed":[26,53],"by":[27],"exploiting":[28],"relationship":[30],"between":[31],"and":[35,71,113],"time":[36],"constants":[37],"junction":[39,114],"temperature":[40,115],"response":[41],"curves.":[42],"Experimental":[43],"tests":[44],"performed":[46],"validate":[48],"accuracy":[50],"method.":[54],"Advantages":[55],"proposed":[58,85],"include":[60],"no":[61,72],"need":[62,73],"know":[64],"power":[66],"loss":[67],"information":[68],"heat":[75],"module":[78],"up":[79],"steady-state.":[82],"Moreover,":[83],"is":[87],"able":[88],"obtain":[90],"complete":[91],"network.":[97],"In":[98],"addition,":[99],"we":[100],"show":[101],"that":[102],"identified":[104],"can":[107],"be":[108],"used":[109],"for":[110],"condition":[111],"monitoring":[112],"estimation.":[116]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":4}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}