{"id":"https://openalex.org/W7130582318","doi":"https://doi.org/10.1109/ictc66702.2025.11388426","title":"Enhanced Thermal Performance of RF Amplifiers via Manifold Microchannel with Porous Structure","display_name":"Enhanced Thermal Performance of RF Amplifiers via Manifold Microchannel with Porous Structure","publication_year":2025,"publication_date":"2025-10-14","ids":{"openalex":"https://openalex.org/W7130582318","doi":"https://doi.org/10.1109/ictc66702.2025.11388426"},"language":null,"primary_location":{"id":"doi:10.1109/ictc66702.2025.11388426","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ictc66702.2025.11388426","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 16th International Conference on Information and Communication Technology Convergence (ICTC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5126399898","display_name":"Minsoo Kang","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Minsoo Kang","raw_affiliation_strings":["ETRI,RF&Power Components Research Section,Daejeon,Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ETRI,RF&Power Components Research Section,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026780820","display_name":"Hyun Wook Jung","orcid":"https://orcid.org/0000-0001-8395-2573"},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyun-Wook Jung","raw_affiliation_strings":["ETRI,RF&Power Components Research Section,Daejeon,Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ETRI,RF&Power Components Research Section,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052279685","display_name":"S. J. Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seong-Ll Kim","raw_affiliation_strings":["ETRI,RF&Power Components Research Section,Daejeon,Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ETRI,RF&Power Components Research Section,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5126373748","display_name":"Sangmin Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I4210134032","display_name":"Intelligent Energy (United Kingdom)","ror":"https://ror.org/03e0mxz52","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210134032"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Sangmin Lee","raw_affiliation_strings":["Chung-Ang University,Department of Intelligent Energy and Industry,Seoul,Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chung-Ang University,Department of Intelligent Energy and Industry,Seoul,Republic of Korea","institution_ids":["https://openalex.org/I4210134032"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111915495","display_name":"Haecheon Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I67900169","display_name":"Chung-Ang University","ror":"https://ror.org/01r024a98","country_code":"KR","type":"education","lineage":["https://openalex.org/I67900169"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Haecheon Kim","raw_affiliation_strings":["Chung-Ang University,School of Mechanical Engineering,Seoul,Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chung-Ang University,School of Mechanical Engineering,Seoul,Republic of Korea","institution_ids":["https://openalex.org/I67900169"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113564107","display_name":"Ho-Kyun Ahn","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ho-Kyun Ahn","raw_affiliation_strings":["ETRI,RF&Power Components Research Section,Daejeon,Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ETRI,RF&Power Components Research Section,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102909368","display_name":"Daewon Kang","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Dong-Min Kang","raw_affiliation_strings":["ETRI,RF&Power Components Research Section,Daejeon,Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ETRI,RF&Power Components Research Section,Daejeon,Republic of Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5126424334","display_name":"Hyoungsoon Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I67900169","display_name":"Chung-Ang University","ror":"https://ror.org/01r024a98","country_code":"KR","type":"education","lineage":["https://openalex.org/I67900169"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyoungsoon Lee","raw_affiliation_strings":["Chung-Ang University,School of Mechanical Engineering,Seoul,Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chung-Ang University,School of Mechanical Engineering,Seoul,Republic of Korea","institution_ids":["https://openalex.org/I67900169"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1340","last_page":"1341"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.6222000122070312,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.6222000122070312,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.09210000187158585,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.04129999876022339,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microchannel","display_name":"Microchannel","score":0.913100004196167},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6186000108718872},{"id":"https://openalex.org/keywords/coolant","display_name":"Coolant","score":0.5703999996185303},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.5054000020027161},{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.4823000133037567},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.4756999909877777},{"id":"https://openalex.org/keywords/computer-cooling","display_name":"Computer cooling","score":0.39730000495910645},{"id":"https://openalex.org/keywords/amplifier","display_name":"Amplifier","score":0.39489999413490295}],"concepts":[{"id":"https://openalex.org/C63662833","wikidata":"https://www.wikidata.org/wiki/Q6839341","display_name":"Microchannel","level":2,"score":0.913100004196167},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7143999934196472},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6186000108718872},{"id":"https://openalex.org/C91914117","wikidata":"https://www.wikidata.org/wiki/Q1056832","display_name":"Coolant","level":2,"score":0.5703999996185303},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5479999780654907},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.5054000020027161},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.4823000133037567},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.4756999909877777},{"id":"https://openalex.org/C11026015","wikidata":"https://www.wikidata.org/wiki/Q840551","display_name":"Computer cooling","level":3,"score":0.39730000495910645},{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.39489999413490295},{"id":"https://openalex.org/C156820238","wikidata":"https://www.wikidata.org/wiki/Q422876","display_name":"Active cooling","level":3,"score":0.38530001044273376},{"id":"https://openalex.org/C6648577","wikidata":"https://www.wikidata.org/wiki/Q622669","display_name":"Porosity","level":2,"score":0.33869999647140503},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.3353999853134155},{"id":"https://openalex.org/C38349280","wikidata":"https://www.wikidata.org/wiki/Q1434290","display_name":"Flow (mathematics)","level":2,"score":0.33489999175071716},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.3222000002861023},{"id":"https://openalex.org/C1633027","wikidata":"https://www.wikidata.org/wiki/Q815820","display_name":"Computational fluid dynamics","level":2,"score":0.32120001316070557},{"id":"https://openalex.org/C159188206","wikidata":"https://www.wikidata.org/wiki/Q1478382","display_name":"Heat flux","level":3,"score":0.3077999949455261},{"id":"https://openalex.org/C7694927","wikidata":"https://www.wikidata.org/wiki/Q7667810","display_name":"Water cooling","level":2,"score":0.3001999855041504},{"id":"https://openalex.org/C89394759","wikidata":"https://www.wikidata.org/wiki/Q192593","display_name":"Thermal radiation","level":2,"score":0.29280000925064087},{"id":"https://openalex.org/C529865628","wikidata":"https://www.wikidata.org/wiki/Q1790740","display_name":"Manifold (fluid mechanics)","level":2,"score":0.2913999855518341},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.28110000491142273},{"id":"https://openalex.org/C48632124","wikidata":"https://www.wikidata.org/wiki/Q617088","display_name":"Heat spreader","level":3,"score":0.2689000070095062},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2574000060558319},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.2535000145435333}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ictc66702.2025.11388426","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ictc66702.2025.11388426","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 16th International Conference on Information and Communication Technology Convergence (ICTC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8777338862419128,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320334874","display_name":"Defense Acquisition Program Administration","ror":"https://ror.org/04bjg9m96"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2483663039","https://openalex.org/W4308690840","https://openalex.org/W4400854614"],"related_works":[],"abstract_inverted_index":{"High-power":[0],"RF":[1,126],"amplifiers,":[2],"such":[3],"as":[4],"GaN":[5],"high-electron-mobility":[6],"transistors":[7],"(HEMTs),":[8],"generate":[9],"intense":[10],"local":[11],"heat":[12,54,114],"fluxes":[13],"in":[14,93],"the":[15,57,71,110],"active":[16],"device":[17],"region,":[18],"which":[19],"can":[20],"degrade":[21],"electric":[22],"performance.":[23],"Conventional":[24],"indirect":[25],"cooling":[26,49],"is":[27,121],"limited":[28],"by":[29],"thermal":[30,79,94,133],"resistances,":[31],"making":[32],"it":[33],"difficult":[34],"to":[35,77,112,124],"manage":[36],"localized":[37],"hotspots":[38],"efficiently.":[39],"In":[40,96],"this":[41],"work,":[42],"we":[43,98],"evaluate":[44],"an":[45],"embedded":[46],"manifold":[47],"microchannel":[48,73,111],"structure":[50],"designed":[51],"for":[52,103],"direct":[53],"removal":[55],"from":[56],"backside":[58],"of":[59,70],"a":[60,90,100,105,129],"GaN-on-SiC":[61],"HEMT":[62],"device.":[63],"Three-dimensional":[64],"computational":[65],"fluid":[66],"dynamics":[67],"(CFD)":[68],"simulations":[69],"baseline":[72],"configuration":[74],"were":[75],"performed":[76],"quantify":[78],"resistance,":[80],"pressure":[81],"drop,":[82],"and":[83,117,137],"coolant":[84],"flow":[85],"effects.":[86],"The":[87],"results":[88],"show":[89],"significant":[91],"reduction":[92],"resistance.":[95],"parallel,":[97],"present":[99],"fabrication":[101],"concept":[102],"integrating":[104],"porous":[106],"metal":[107],"insert":[108],"into":[109],"enhance":[113],"transfer":[115],"area":[116],"uniformity.":[118],"This":[119],"approach":[120],"broadly":[122],"applicable":[123],"high-power":[125],"components,":[127],"offering":[128],"path":[130],"toward":[131],"improved":[132],"performance,":[134],"compact":[135],"packaging,":[136],"operational":[138],"stability.":[139]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2026-02-20T00:00:00"}