{"id":"https://openalex.org/W4407214469","doi":"https://doi.org/10.1109/icta64028.2024.10860441","title":"BISHENG: A 49.38PPM Flexible Multi-Function Printer SoC in 28nm CMOS","display_name":"BISHENG: A 49.38PPM Flexible Multi-Function Printer SoC in 28nm CMOS","publication_year":2024,"publication_date":"2024-10-25","ids":{"openalex":"https://openalex.org/W4407214469","doi":"https://doi.org/10.1109/icta64028.2024.10860441"},"language":"en","primary_location":{"id":"doi:10.1109/icta64028.2024.10860441","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icta64028.2024.10860441","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5007503693","display_name":"Dongliang Xiong","orcid":"https://orcid.org/0000-0002-6332-2627"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Dongliang Xiong","raw_affiliation_strings":["Zhejiang University"],"affiliations":[{"raw_affiliation_string":"Zhejiang University","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100372789","display_name":"Xiaoxu Zhang","orcid":"https://orcid.org/0009-0003-0130-0793"},"institutions":[{"id":"https://openalex.org/I75059550","display_name":"Zhejiang Gongshang University","ror":"https://ror.org/0569mkk41","country_code":"CN","type":"education","lineage":["https://openalex.org/I75059550"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaoxu Zhang","raw_affiliation_strings":["Zhejiang Gongshang University"],"affiliations":[{"raw_affiliation_string":"Zhejiang Gongshang University","institution_ids":["https://openalex.org/I75059550"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074059776","display_name":"Siwen Xiu","orcid":null},"institutions":[{"id":"https://openalex.org/I55538621","display_name":"China Jiliang University","ror":"https://ror.org/05v1y0t93","country_code":"CN","type":"education","lineage":["https://openalex.org/I55538621"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Siwen Xiu","raw_affiliation_strings":["China Jiliang University"],"affiliations":[{"raw_affiliation_string":"China Jiliang University","institution_ids":["https://openalex.org/I55538621"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031785945","display_name":"Zhili Liu","orcid":"https://orcid.org/0000-0002-5983-630X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Zhili Liu","raw_affiliation_strings":["Geehy Semiconductor"],"affiliations":[{"raw_affiliation_string":"Geehy Semiconductor","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102819610","display_name":"Dandan Zheng","orcid":"https://orcid.org/0000-0002-6873-9616"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dandan Zheng","raw_affiliation_strings":["Zhejiang University"],"affiliations":[{"raw_affiliation_string":"Zhejiang University","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046036687","display_name":"Li Ding","orcid":"https://orcid.org/0000-0002-1827-1090"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Li Ding","raw_affiliation_strings":["Geehy Semiconductor"],"affiliations":[{"raw_affiliation_string":"Geehy Semiconductor","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037552812","display_name":"Aiguo Yin","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Aiguo Yin","raw_affiliation_strings":["Pantum Electronics"],"affiliations":[{"raw_affiliation_string":"Pantum Electronics","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060804972","display_name":"Peiyong Zhang","orcid":"https://orcid.org/0000-0002-7627-2470"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Peiyong Zhang","raw_affiliation_strings":["Zhejiang University"],"affiliations":[{"raw_affiliation_string":"Zhejiang University","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101907483","display_name":"Kai Huang","orcid":"https://orcid.org/0000-0002-2344-2982"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kai Huang","raw_affiliation_strings":["Zhejiang University"],"affiliations":[{"raw_affiliation_string":"Zhejiang University","institution_ids":["https://openalex.org/I76130692"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5007503693"],"corresponding_institution_ids":["https://openalex.org/I76130692"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.25013343,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"178","last_page":"179"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9887999892234802,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.7551213502883911},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5402374863624573},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.48823192715644836},{"id":"https://openalex.org/keywords/function","display_name":"Function (biology)","score":0.4465397298336029},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.37330806255340576},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.34810394048690796},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22044220566749573}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7551213502883911},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5402374863624573},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.48823192715644836},{"id":"https://openalex.org/C14036430","wikidata":"https://www.wikidata.org/wiki/Q3736076","display_name":"Function (biology)","level":2,"score":0.4465397298336029},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.37330806255340576},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.34810394048690796},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22044220566749573},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C78458016","wikidata":"https://www.wikidata.org/wiki/Q840400","display_name":"Evolutionary biology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icta64028.2024.10860441","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icta64028.2024.10860441","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.5400000214576721}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2922408905","https://openalex.org/W4377235511","https://openalex.org/W4385650756"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W3014521742","https://openalex.org/W2617868873","https://openalex.org/W3204141294","https://openalex.org/W4386230336","https://openalex.org/W4306968100","https://openalex.org/W2464627195","https://openalex.org/W2171986175","https://openalex.org/W2089791793","https://openalex.org/W2038858740"],"abstract_inverted_index":{"Innovative":[0],"AI":[1],"functions":[2],"and":[3,33,49,56],"imaging":[4],"algorithms":[5],"are":[6],"important":[7],"for":[8],"multi-function":[9],"printers":[10],"(MFP)":[11],"to":[12],"provide":[13],"good":[14],"user":[15],"experience.":[16],"However,":[17],"prior":[18],"printer":[19,81],"system":[20],"on":[21,89],"chips":[22],"(SoC)":[23],"using":[24],"hardwired":[25],"hardware":[26],"or":[27],"customized":[28,46],"processors":[29,48],"have":[30],"limited":[31],"flexibility":[32],"programmability.":[34],"This":[35],"paper":[36],"proposes":[37],"a":[38,50,83],"flexible":[39],"MFP":[40],"SoC":[41],"called":[42],"BISHENG,":[43],"which":[44],"uses":[45],"RISC-V":[47],"hybrid":[51],"interconnect":[52],"with":[53,82],"sequential":[54],"pipeline":[55],"partial":[57],"crossbar.":[58],"The":[59],"chip":[60],"was":[61],"fabricated":[62],"in":[63,79],"28":[64],"nm":[65],"CMOS.":[66],"Experiment":[67],"result":[68],"shows":[69],"that":[70],"it":[71],"can":[72],"achieves":[73],"49.38":[74],"pages":[75],"per":[76],"minute":[77],"(PPM)":[78],"prototype":[80],"typical":[84],"power":[85],"2.55":[86],"W.":[87],"Keywords-System":[88],"Chip,":[90],"Multi-Function":[91],"Printer,":[92],"Document":[93],"Image":[94],"Processing,":[95],"On-Chip":[96],"Network":[97]},"counts_by_year":[],"updated_date":"2025-12-22T23:10:17.713674","created_date":"2025-10-10T00:00:00"}