{"id":"https://openalex.org/W4390337051","doi":"https://doi.org/10.1109/icta60488.2023.10364306","title":"Experiments and Hygrothermal Stress Analysis for a QFN Package","display_name":"Experiments and Hygrothermal Stress Analysis for a QFN Package","publication_year":2023,"publication_date":"2023-10-27","ids":{"openalex":"https://openalex.org/W4390337051","doi":"https://doi.org/10.1109/icta60488.2023.10364306"},"language":"en","primary_location":{"id":"doi:10.1109/icta60488.2023.10364306","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/icta60488.2023.10364306","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102598145","display_name":"Lifan Ma","orcid":null},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Lifan Ma","raw_affiliation_strings":["Fudan University,Department of Materials Science","Department of Materials Science, Fudan University"],"affiliations":[{"raw_affiliation_string":"Fudan University,Department of Materials Science","institution_ids":["https://openalex.org/I24943067"]},{"raw_affiliation_string":"Department of Materials Science, Fudan University","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100735839","display_name":"Jun Wang","orcid":"https://orcid.org/0009-0004-1586-6613"},"institutions":[{"id":"https://openalex.org/I4210159154","display_name":"Yiwu Science and Technology Research Institute","ror":"https://ror.org/04kvstc88","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210159154","https://openalex.org/I55712492"]},{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun Wang","raw_affiliation_strings":["Fudan University,Department of Materials Science","Yiwu Research Institute of Fudan University, Yiwu, Zhejiang, PR China","Department of Materials Science, Fudan University"],"affiliations":[{"raw_affiliation_string":"Fudan University,Department of Materials Science","institution_ids":["https://openalex.org/I24943067"]},{"raw_affiliation_string":"Yiwu Research Institute of Fudan University, Yiwu, Zhejiang, PR China","institution_ids":["https://openalex.org/I4210159154","https://openalex.org/I24943067"]},{"raw_affiliation_string":"Department of Materials Science, Fudan University","institution_ids":["https://openalex.org/I24943067"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5102598145"],"corresponding_institution_ids":["https://openalex.org/I24943067"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.16932722,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"194","last_page":"195"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10219","display_name":"Mechanical Behavior of Composites","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/quad-flat-no-leads-package","display_name":"Quad Flat No-leads package","score":0.9637953639030457},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7281835079193115},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.6753051280975342},{"id":"https://openalex.org/keywords/moisture","display_name":"Moisture","score":0.6245361566543579},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5793929696083069},{"id":"https://openalex.org/keywords/chip-scale-package","display_name":"Chip-scale package","score":0.5396632552146912},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.5210927724838257},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.4644615054130554},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.4590069651603699},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.2892940640449524},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.11948683857917786},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.07422196865081787}],"concepts":[{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.9637953639030457},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7281835079193115},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.6753051280975342},{"id":"https://openalex.org/C176864760","wikidata":"https://www.wikidata.org/wiki/Q217651","display_name":"Moisture","level":2,"score":0.6245361566543579},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5793929696083069},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.5396632552146912},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.5210927724838257},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.4644615054130554},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4590069651603699},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.2892940640449524},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.11948683857917786},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.07422196865081787},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icta60488.2023.10364306","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/icta60488.2023.10364306","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321106","display_name":"Ministry of Education of the People's Republic of China","ror":"https://ror.org/01mv9t934"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1837951370","https://openalex.org/W1969901562","https://openalex.org/W2005373647","https://openalex.org/W2079608878","https://openalex.org/W2145827698","https://openalex.org/W2151292478"],"related_works":["https://openalex.org/W4317382088","https://openalex.org/W1983742508","https://openalex.org/W1969739065","https://openalex.org/W1997600377","https://openalex.org/W2150093483","https://openalex.org/W2060946771","https://openalex.org/W1828445855","https://openalex.org/W4310904614","https://openalex.org/W2121006049","https://openalex.org/W2099861727"],"abstract_inverted_index":{"In":[0],"this":[1],"study,":[2],"the":[3,26,30,55,59,63,70,83,86,92,96,100,106],"material":[4],"parameters":[5],"of":[6,43,77,85,102,108],"EMC":[7],"related":[8],"to":[9],"moisture":[10,21],"diffusion,":[11],"thermo-mechanical":[12],"behaviors":[13],"were":[14,37,49],"tested":[15],"experimentally.":[16],"A":[17],"typical":[18],"QFN":[19],"with":[20,82],"absorption":[22],"was":[23,61],"simulated":[24],"and":[25,46,72],"hygrothermal":[27,56],"stresses":[28],"in":[29,58],"package":[31,60],"during":[32],"reflow":[33],"or":[34],"thermal":[35],"cycling":[36],"analyzed":[38],"by":[39],"Comsol.":[40],"The":[41,51,75,88],"effects":[42],"chip":[44],"location":[45],"pad":[47,89],"grooves":[48,90],"studied.":[50],"results":[52],"show":[53],"that":[54],"stress":[57,79,94],"near":[62,105],"interfaces,":[64,97],"which":[65],"is":[66],"much":[67],"larger":[68],"at":[69,95],"highest":[71],"lowest":[73],"temperatures.":[74],"area":[76],"high":[78],"will":[80],"shift":[81],"locations":[84],"chip.":[87],"reduce":[91],"average":[93],"but":[98],"increase":[99],"risks":[101],"local":[103],"damages":[104],"tips":[107],"grooves.":[109]},"counts_by_year":[],"updated_date":"2025-12-22T23:10:17.713674","created_date":"2025-10-10T00:00:00"}